DE3854113T2 - Verfahren zur selektiven reaktiven Ionenätzung von Substraten. - Google Patents
Verfahren zur selektiven reaktiven Ionenätzung von Substraten.Info
- Publication number
- DE3854113T2 DE3854113T2 DE3854113T DE3854113T DE3854113T2 DE 3854113 T2 DE3854113 T2 DE 3854113T2 DE 3854113 T DE3854113 T DE 3854113T DE 3854113 T DE3854113 T DE 3854113T DE 3854113 T2 DE3854113 T2 DE 3854113T2
- Authority
- DE
- Germany
- Prior art keywords
- substrates
- reactive ion
- ion etching
- selective reactive
- selective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/95—Multilayer mask including nonradiation sensitive layer
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Semiconductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/115,140 US4826564A (en) | 1987-10-30 | 1987-10-30 | Method of selective reactive ion etching of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3854113D1 DE3854113D1 (de) | 1995-08-10 |
DE3854113T2 true DE3854113T2 (de) | 1996-02-29 |
Family
ID=22359519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3854113T Expired - Fee Related DE3854113T2 (de) | 1987-10-30 | 1988-09-27 | Verfahren zur selektiven reaktiven Ionenätzung von Substraten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4826564A (de) |
EP (1) | EP0314599B1 (de) |
JP (1) | JPH06103673B2 (de) |
DE (1) | DE3854113T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5169494A (en) * | 1989-03-27 | 1992-12-08 | Matsushita Electric Industrial Co., Ltd. | Fine pattern forming method |
US5001085A (en) * | 1990-07-17 | 1991-03-19 | Micron Technology, Inc. | Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches |
US5316895A (en) * | 1990-10-31 | 1994-05-31 | Texas Instruments Incorporated | Photolithographic method using non-photoactive resins |
US5277749A (en) * | 1991-10-17 | 1994-01-11 | International Business Machines Corporation | Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps |
JPH05343308A (ja) * | 1992-06-09 | 1993-12-24 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US5705321A (en) * | 1993-09-30 | 1998-01-06 | The University Of New Mexico | Method for manufacture of quantum sized periodic structures in Si materials |
US5665251A (en) * | 1994-11-23 | 1997-09-09 | International Business Machines Corporation | RIE image transfer process for plating |
US5994229A (en) * | 1998-01-12 | 1999-11-30 | Taiwan Semiconductor Manufacturing Company Ltd. | Achievement of top rounding in shallow trench etch |
US6252227B1 (en) * | 1998-10-19 | 2001-06-26 | Taiwan Semiconductor Manufacturing Company | Method for sectioning a semiconductor wafer with FIB for viewing with SEM |
US6749763B1 (en) * | 1999-08-02 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | Plasma processing method |
US20010045527A1 (en) * | 2000-04-05 | 2001-11-29 | Wissman Barry Dean | Electron-beam cured polymer mask for DRIE micro-machining |
US6409312B1 (en) | 2001-03-27 | 2002-06-25 | Lexmark International, Inc. | Ink jet printer nozzle plate and process therefor |
US6806021B2 (en) * | 2001-04-02 | 2004-10-19 | Kabushiki Kaisha Toshiba | Method for forming a pattern and method of manufacturing semiconductor device |
JP3878583B2 (ja) * | 2003-08-28 | 2007-02-07 | 株式会社東芝 | パターン形成方法、ならびに半導体装置およびその製造方法 |
US7316844B2 (en) * | 2004-01-16 | 2008-01-08 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
US20050155950A1 (en) * | 2004-01-20 | 2005-07-21 | Macronix International Co., Ltd. | Method of forming a micro pattern on a substrate |
JP4012156B2 (ja) * | 2004-02-02 | 2007-11-21 | 独立行政法人科学技術振興機構 | 圧電素子の製造方法 |
JP4793583B2 (ja) * | 2004-10-14 | 2011-10-12 | 日産化学工業株式会社 | 金属酸化物を含むリソグラフィー用下層膜形成組成物 |
US7695890B2 (en) * | 2005-09-09 | 2010-04-13 | Brewer Science Inc. | Negative photoresist for silicon KOH etch without silicon nitride |
US7709178B2 (en) * | 2007-04-17 | 2010-05-04 | Brewer Science Inc. | Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride |
US8192642B2 (en) * | 2007-09-13 | 2012-06-05 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
FR2926162B1 (fr) * | 2008-01-03 | 2017-09-01 | Centre Nat De La Rech Scient - Cnrs | Procede de modification localisee de l'energie de surface d'un substrat |
KR20180080416A (ko) * | 2017-01-03 | 2018-07-12 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4493855A (en) * | 1982-12-23 | 1985-01-15 | International Business Machines Corporation | Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
US4539049A (en) * | 1983-02-09 | 1985-09-03 | Jos. Cavedon Co., Inc. | Aluminum zirconium metallo-organic complex useful as coupling and hydrophobic agents |
JPS59202636A (ja) * | 1983-05-04 | 1984-11-16 | Hitachi Ltd | 微細パタ−ン形成方法 |
EP0215052A1 (de) * | 1985-02-13 | 1987-03-25 | Huck Manufacturing Company | Befestigungssystem und befestigungsvorrichtung für schiffscontainer und dergleichen |
-
1987
- 1987-10-30 US US07/115,140 patent/US4826564A/en not_active Expired - Fee Related
-
1988
- 1988-09-20 JP JP63233844A patent/JPH06103673B2/ja not_active Expired - Lifetime
- 1988-09-27 DE DE3854113T patent/DE3854113T2/de not_active Expired - Fee Related
- 1988-09-27 EP EP88480049A patent/EP0314599B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0314599A3 (de) | 1991-03-06 |
JPH06103673B2 (ja) | 1994-12-14 |
EP0314599B1 (de) | 1995-07-05 |
JPH01137635A (ja) | 1989-05-30 |
US4826564A (en) | 1989-05-02 |
EP0314599A2 (de) | 1989-05-03 |
DE3854113D1 (de) | 1995-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |