DE3785826T2 - Maske zum Niederschlag von Pastenmaterial. - Google Patents

Maske zum Niederschlag von Pastenmaterial.

Info

Publication number
DE3785826T2
DE3785826T2 DE87106470T DE3785826T DE3785826T2 DE 3785826 T2 DE3785826 T2 DE 3785826T2 DE 87106470 T DE87106470 T DE 87106470T DE 3785826 T DE3785826 T DE 3785826T DE 3785826 T2 DE3785826 T2 DE 3785826T2
Authority
DE
Germany
Prior art keywords
mask
nitrogen
coating
electrically conductive
titanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87106470T
Other languages
German (de)
English (en)
Other versions
DE3785826D1 (de
Inventor
Kie Yeung Ahn
Saryadevara Basavaiah
Stephen Bruce Brodsky
Charles Anthony Cortellino
Joseph Eli Levine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3785826D1 publication Critical patent/DE3785826D1/de
Application granted granted Critical
Publication of DE3785826T2 publication Critical patent/DE3785826T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24298—Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE87106470T 1986-09-15 1987-05-05 Maske zum Niederschlag von Pastenmaterial. Expired - Fee Related DE3785826T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/907,268 US4803110A (en) 1986-09-15 1986-09-15 Coated mask for photolithographic construction of electric circuits

Publications (2)

Publication Number Publication Date
DE3785826D1 DE3785826D1 (de) 1993-06-17
DE3785826T2 true DE3785826T2 (de) 1993-10-28

Family

ID=25423797

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87106470T Expired - Fee Related DE3785826T2 (de) 1986-09-15 1987-05-05 Maske zum Niederschlag von Pastenmaterial.

Country Status (4)

Country Link
US (1) US4803110A (enExample)
EP (1) EP0267359B1 (enExample)
JP (1) JPS6377787A (enExample)
DE (1) DE3785826T2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063660A (en) * 1988-05-26 1991-11-12 Siemens Aktiengesellschaft Method for manufacturing preforms coated with hard solder for repairing interconnect interruptions
US4953460A (en) * 1989-10-02 1990-09-04 At&T Bell Laboratories Method and apparatus for screen printing
JPH0661926B2 (ja) * 1990-02-14 1994-08-17 株式会社鈴寅整染工場 印刷用スクリーンの製造方法
US5195243A (en) * 1992-02-28 1993-03-23 General Motors Corporation Method of making a coated porous metal panel
US5527586A (en) * 1992-03-18 1996-06-18 Printron, Inc. Apparatus and method for depositing metal particles on a dielectric substrate
US5814367A (en) 1993-08-13 1998-09-29 General Atomics Broadband infrared and signature control materials and methods of producing the same
US5502400A (en) * 1994-02-15 1996-03-26 International Business Machines Corporation Logically configurable impedance matching input terminators for VLSI
US6235105B1 (en) 1994-12-06 2001-05-22 General Atomics Thin film pigmented optical coating compositions
US5819652A (en) * 1994-12-14 1998-10-13 International Business Machines Corporation Reduced cavity depth screening stencil
TW289901B (enExample) * 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
US5669972A (en) * 1995-04-27 1997-09-23 International Business Machines Corporation Flex tab thick film metal mask
GB2307446A (en) * 1995-11-25 1997-05-28 Ibm Solder paste deposition
DE69707394T2 (de) * 1996-06-11 2002-07-11 Koninklijke Philips Electronics N.V., Eindhoven Herstellung von bahnen auf flachen substraten mittels siebdruck
DE19640285C2 (de) * 1996-09-30 1998-11-12 Siemens Nixdorf Inf Syst Vorrichtung zum Auftragen von Lötpaste auf die Kontaktelemente von Ball Grid Array-Bauteilen
US5744214A (en) * 1997-01-30 1998-04-28 International Business Machines Corporation Corrosion resistant molybdenum mask
US6669781B2 (en) 1997-09-23 2003-12-30 Micron Technology, Inc. Method and apparatus for improving stencil/screen print quality
US6194085B1 (en) 1997-09-27 2001-02-27 International Business Machines Corporation Optical color tracer identifier in metal paste that bleed to greensheet
US5927193A (en) * 1997-10-16 1999-07-27 International Business Machines Corporation Process for via fill
US6002951A (en) * 1997-11-12 1999-12-14 International Business Machines Corporation Multi-layer ceramic substrate having high TC superconductor circuitry
US6045615A (en) * 1998-01-28 2000-04-04 International Business Machines Corporation Homogeneous screening nozzle
US6089151A (en) 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
US5878661A (en) * 1998-07-13 1999-03-09 Ford Motor Company Self-shearing stencil
US6095041A (en) * 1999-07-22 2000-08-01 International Business Corporation Stencil mask with channels including depressions
US6217989B1 (en) 1999-12-10 2001-04-17 International Business Machines Corporation Conductive line features for enhanced reliability of multi-layer ceramic substrates
DE102005045350B4 (de) * 2005-09-22 2009-07-16 Siemens Ag Druckschablone eines SMT-Prozesses
JP2011201054A (ja) * 2010-03-24 2011-10-13 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
CN101932200A (zh) * 2010-07-20 2010-12-29 潘宇强 碳化钛新型复合材料的smt金属掩膜板之制作方法
CN101906615A (zh) * 2010-07-20 2010-12-08 潘宇强 氮化钛新型复合材料的smt金属掩模板之制作方法
CN101928926A (zh) * 2010-07-20 2010-12-29 潘宇强 氮化铬新型复合材料的smt金属掩膜板之制作方法
DE102011003287A1 (de) * 2011-01-27 2012-08-02 Christian Koenen Gmbh Druckschablone zum Aufbringen eines Druckmusters auf ein Substrat und Verfahren zum Herstellen einer Druckschablone
TWI532537B (zh) * 2011-08-10 2016-05-11 太陽誘電化學技術股份有限公司 包含底質薄膜之印刷用構造體、印刷用孔版及該印刷用構造體之製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1564896A1 (de) * 1966-08-30 1970-01-08 Telefunken Patent Halbleiteranordnung
GB1260468A (en) * 1968-03-28 1972-01-19 Nat Res Dev Improvements in or relating to the formation of connections on microelectronic circuits
US3802078A (en) * 1971-06-07 1974-04-09 P Denes Cutting device and method for making same
AT350285B (de) * 1974-08-07 1979-05-25 Plansee Metallwerk Mit einem ueberzug versehene, metallische gebrauchsgegenstaende
US4006073A (en) * 1975-04-03 1977-02-01 The United States Of America As Represented By The United States Energy Research And Development Administration Thin film deposition by electric and magnetic crossed-field diode sputtering
US4169913A (en) * 1978-03-01 1979-10-02 Sumitomo Electric Industries, Ltd. Coated tool steel and machining tool formed therefrom
CH640885A5 (de) * 1978-07-21 1984-01-31 Suisse Horlogerie Rech Lab Mit einem harten ueberzug versehene maschinenelemente.
US4260658A (en) * 1979-06-21 1981-04-07 Kobe, Inc. Erosion resistant surface
JPS581067A (ja) * 1981-06-26 1983-01-06 Toshiba Corp 装飾用金属窒化物皮膜の形成法
JPS5831336A (ja) * 1981-08-19 1983-02-24 Konishiroku Photo Ind Co Ltd ホトマスク素材
IL63802A (en) * 1981-09-11 1984-10-31 Iscar Ltd Sintered hard metal products having a multi-layer wear-resistant coating
US4411960A (en) * 1981-12-21 1983-10-25 Gte Products Corporation Articles coated with wear-resistant titanium compounds
GB2123039B (en) * 1982-03-23 1985-10-23 Atomic Energy Authority Uk Coatings for cutting implements
US4406668A (en) * 1982-05-20 1983-09-27 Gte Laboratories Incorporated Nitride coated silicon nitride cutting tools
US4406670A (en) * 1982-05-20 1983-09-27 Gte Laboratories Incorporated Nitride coated composite modified silicon aluminum oxynitride cutting tools

Also Published As

Publication number Publication date
JPS6377787A (ja) 1988-04-07
DE3785826D1 (de) 1993-06-17
JPH0583080B2 (enExample) 1993-11-24
EP0267359A3 (en) 1989-04-26
US4803110A (en) 1989-02-07
EP0267359A2 (en) 1988-05-18
EP0267359B1 (en) 1993-05-12

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee