DE3714512C2 - - Google Patents
Info
- Publication number
- DE3714512C2 DE3714512C2 DE3714512A DE3714512A DE3714512C2 DE 3714512 C2 DE3714512 C2 DE 3714512C2 DE 3714512 A DE3714512 A DE 3714512A DE 3714512 A DE3714512 A DE 3714512A DE 3714512 C2 DE3714512 C2 DE 3714512C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- semiconductor laser
- furrows
- cover layer
- gaas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 43
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 15
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 28
- 238000001451 molecular beam epitaxy Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 125000002524 organometallic group Chemical group 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2202—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure by making a groove in the upper laser structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3428—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers layer orientation perpendicular to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
- H01S5/3432—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs the whole junction comprising only (AI)GaAs
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61102982A JPS62257783A (ja) | 1986-04-30 | 1986-04-30 | 半導体レ−ザ素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3714512A1 DE3714512A1 (de) | 1987-11-05 |
DE3714512C2 true DE3714512C2 (en, 2012) | 1991-06-20 |
Family
ID=14341926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873714512 Granted DE3714512A1 (de) | 1986-04-30 | 1987-04-30 | Halbleiterlaser |
Country Status (4)
Country | Link |
---|---|
US (1) | US4835783A (en, 2012) |
JP (1) | JPS62257783A (en, 2012) |
DE (1) | DE3714512A1 (en, 2012) |
GB (1) | GB2191339B (en, 2012) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE34356E (en) * | 1984-05-10 | 1993-08-24 | Sharp Kabushiki Kaisha | Semiconductor laser array |
DE3923354A1 (de) * | 1989-07-14 | 1991-01-24 | Licentia Gmbh | Halbleiterlaser |
JP2002171021A (ja) * | 2000-11-30 | 2002-06-14 | Toshiba Corp | 半導体レーザ、半導体レーザの製造方法および半導体レーザの実装方法 |
RU2230411C2 (ru) * | 2002-04-16 | 2004-06-10 | Федеральное государственное унитарное предприятие "Научно-исследовательский институт "Полюс" им.М.Ф.Стельмаха | Инжекционный лазер |
US7033056B2 (en) * | 2002-05-03 | 2006-04-25 | Projectiondesign As | Multi-lamp arrangement for optical systems |
JP2003332676A (ja) * | 2002-05-08 | 2003-11-21 | Mitsubishi Electric Corp | 半導体光装置 |
US6845116B2 (en) * | 2002-10-24 | 2005-01-18 | Wisconsin Alumni Research Foundation | Narrow lateral waveguide laser |
US7272161B1 (en) * | 2003-09-25 | 2007-09-18 | Finisar Corporation | Epitaxial layer for laser diode ridge protection |
JP4956928B2 (ja) * | 2004-09-28 | 2012-06-20 | 日亜化学工業株式会社 | 半導体装置 |
TWI262639B (en) * | 2005-06-16 | 2006-09-21 | Ind Tech Res Inst | Semiconductor laser device |
JP2009088425A (ja) * | 2007-10-03 | 2009-04-23 | Sony Corp | 半導体レーザおよびその製造方法 |
JP2008205442A (ja) * | 2008-01-11 | 2008-09-04 | Matsushita Electric Ind Co Ltd | 半導体レーザ素子の製造方法 |
WO2019230826A1 (ja) * | 2018-05-29 | 2019-12-05 | 京セラ株式会社 | 電子素子搭載用基板、電子装置および電子モジュール |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445218A (en) * | 1981-09-28 | 1984-04-24 | Bell Telephone Laboratories, Incorporated | Semiconductor laser with conductive current mask |
JPS58122794A (ja) * | 1982-01-14 | 1983-07-21 | Nippon Telegr & Teleph Corp <Ntt> | ダブルヘテロ接合形半導体レ−ザ |
GB8406432D0 (en) * | 1984-03-12 | 1984-04-18 | British Telecomm | Semiconductor devices |
GB8522308D0 (en) * | 1985-09-09 | 1985-10-16 | British Telecomm | Semiconductor lasers |
-
1986
- 1986-04-30 JP JP61102982A patent/JPS62257783A/ja active Pending
-
1987
- 1987-04-23 US US07/041,483 patent/US4835783A/en not_active Expired - Fee Related
- 1987-04-27 GB GB8709923A patent/GB2191339B/en not_active Expired - Lifetime
- 1987-04-30 DE DE19873714512 patent/DE3714512A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
US4835783A (en) | 1989-05-30 |
GB2191339A (en) | 1987-12-09 |
GB8709923D0 (en) | 1987-06-03 |
JPS62257783A (ja) | 1987-11-10 |
DE3714512A1 (de) | 1987-11-05 |
GB2191339B (en) | 1990-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |