DE3670546D1 - Verfahren zum herstellen einer halbleiteranordnung mit gegeneinander isolierten streifenfoermigen, sich gegenseitig ueberlappenden siliciumelektroden. - Google Patents
Verfahren zum herstellen einer halbleiteranordnung mit gegeneinander isolierten streifenfoermigen, sich gegenseitig ueberlappenden siliciumelektroden.Info
- Publication number
- DE3670546D1 DE3670546D1 DE8686201549T DE3670546T DE3670546D1 DE 3670546 D1 DE3670546 D1 DE 3670546D1 DE 8686201549 T DE8686201549 T DE 8686201549T DE 3670546 T DE3670546 T DE 3670546T DE 3670546 D1 DE3670546 D1 DE 3670546D1
- Authority
- DE
- Germany
- Prior art keywords
- strip
- shaped
- producing
- semiconductor arrangement
- electrodes overlapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920001296 polysiloxane Polymers 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66946—Charge transfer devices
- H01L29/66954—Charge transfer devices with an insulated gate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/911—Differential oxidation and etching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8502478A NL8502478A (nl) | 1985-09-11 | 1985-09-11 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3670546D1 true DE3670546D1 (de) | 1990-05-23 |
Family
ID=19846536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686201549T Expired - Lifetime DE3670546D1 (de) | 1985-09-11 | 1986-09-09 | Verfahren zum herstellen einer halbleiteranordnung mit gegeneinander isolierten streifenfoermigen, sich gegenseitig ueberlappenden siliciumelektroden. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4700459A (de) |
EP (1) | EP0214702B1 (de) |
JP (1) | JPS6262544A (de) |
DE (1) | DE3670546D1 (de) |
NL (1) | NL8502478A (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04213975A (ja) * | 1990-12-11 | 1992-08-05 | Sony Corp | 固体撮像装置 |
US5210049A (en) * | 1992-04-28 | 1993-05-11 | Eastman Kodak Company | Method of making a solid state image sensor |
TW218426B (de) * | 1992-05-11 | 1994-01-01 | Samsung Electronics Co Ltd | |
US6376868B1 (en) | 1999-06-15 | 2002-04-23 | Micron Technology, Inc. | Multi-layered gate for a CMOS imager |
US6654057B1 (en) * | 1999-06-17 | 2003-11-25 | Micron Technology, Inc. | Active pixel sensor with a diagonal active area |
US6326652B1 (en) | 1999-06-18 | 2001-12-04 | Micron Technology, Inc., | CMOS imager with a self-aligned buried contact |
US6414342B1 (en) | 1999-06-18 | 2002-07-02 | Micron Technology Inc. | Photogate with improved short wavelength response for a CMOS imager |
US6204524B1 (en) | 1999-07-14 | 2001-03-20 | Micron Technology, Inc. | CMOS imager with storage capacitor |
CN1323811C (zh) * | 2003-04-29 | 2007-07-04 | 远藤工业株式会社 | 弹簧平衡器 |
JP2005079567A (ja) * | 2003-09-04 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 半導体装置、その製造方法およびカメラ |
US20050274994A1 (en) * | 2004-06-14 | 2005-12-15 | Rhodes Howard E | High dielectric constant spacer for imagers |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4055885A (en) * | 1973-02-28 | 1977-11-01 | Hitachi, Ltd. | Charge transfer semiconductor device with electrodes separated by oxide region therebetween and method for fabricating the same |
US3909925A (en) * | 1974-05-06 | 1975-10-07 | Telex Computer Products | N-Channel charge coupled device fabrication process |
US3943543A (en) * | 1974-07-26 | 1976-03-09 | Texas Instruments Incorporated | Three level electrode configuration for three phase charge coupled device |
NL184591C (nl) * | 1974-09-24 | 1989-09-01 | Philips Nv | Ladingsoverdrachtinrichting. |
US4077112A (en) * | 1974-09-24 | 1978-03-07 | U.S. Philips Corporation | Method of manufacturing charge transfer device |
NL7709916A (nl) * | 1977-09-09 | 1979-03-13 | Philips Nv | Ladingsgekoppelde inrichting. |
US4262297A (en) * | 1978-12-19 | 1981-04-14 | The General Electric Company Limited | Semiconductor charge transfer device with multi-level polysilicon electrode and bus-line structure |
NL7907434A (nl) * | 1979-10-08 | 1981-04-10 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleider- inrichting. |
NL8202777A (nl) * | 1982-07-09 | 1984-02-01 | Philips Nv | Halfgeleiderinrichting en werkwijze voor het vervaardigen daarvan. |
-
1985
- 1985-09-11 NL NL8502478A patent/NL8502478A/nl not_active Application Discontinuation
-
1986
- 1986-09-08 US US06/905,225 patent/US4700459A/en not_active Expired - Fee Related
- 1986-09-08 JP JP61209752A patent/JPS6262544A/ja active Pending
- 1986-09-09 EP EP86201549A patent/EP0214702B1/de not_active Expired
- 1986-09-09 DE DE8686201549T patent/DE3670546D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL8502478A (nl) | 1987-04-01 |
EP0214702B1 (de) | 1990-04-18 |
JPS6262544A (ja) | 1987-03-19 |
EP0214702A1 (de) | 1987-03-18 |
US4700459A (en) | 1987-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8339 | Ceased/non-payment of the annual fee |