DE3650294D1 - Automatische Kantenschleifmaschine. - Google Patents

Automatische Kantenschleifmaschine.

Info

Publication number
DE3650294D1
DE3650294D1 DE3650294T DE3650294T DE3650294D1 DE 3650294 D1 DE3650294 D1 DE 3650294D1 DE 3650294 T DE3650294 T DE 3650294T DE 3650294 T DE3650294 T DE 3650294T DE 3650294 D1 DE3650294 D1 DE 3650294D1
Authority
DE
Germany
Prior art keywords
grinding machine
edge grinding
automatic edge
automatic
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3650294T
Other languages
English (en)
Other versions
DE3650294T2 (de
Inventor
Robert Steere
Thomas Lewandowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon Technology Corp
Original Assignee
Silicon Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Technology Corp filed Critical Silicon Technology Corp
Application granted granted Critical
Publication of DE3650294D1 publication Critical patent/DE3650294D1/de
Publication of DE3650294T2 publication Critical patent/DE3650294T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE3650294T 1985-11-04 1986-10-16 Automatische Kantenschleifmaschine. Expired - Fee Related DE3650294T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/794,629 US4638601A (en) 1985-11-04 1985-11-04 Automatic edge grinder

Publications (2)

Publication Number Publication Date
DE3650294D1 true DE3650294D1 (de) 1995-05-11
DE3650294T2 DE3650294T2 (de) 1995-08-10

Family

ID=25163186

Family Applications (2)

Application Number Title Priority Date Filing Date
DE86308036T Expired - Fee Related DE3688695T2 (de) 1985-11-04 1986-10-16 Automatische kantenschleifmaschine.
DE3650294T Expired - Fee Related DE3650294T2 (de) 1985-11-04 1986-10-16 Automatische Kantenschleifmaschine.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE86308036T Expired - Fee Related DE3688695T2 (de) 1985-11-04 1986-10-16 Automatische kantenschleifmaschine.

Country Status (3)

Country Link
US (1) US4638601A (de)
EP (2) EP0457364B1 (de)
DE (2) DE3688695T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794736A (en) * 1985-12-27 1989-01-03 Citizen Watch Co., Ltd. Arrangement for mechanically and accurately processing a workpiece with a position detecting pattern or patterns
JPH0637024B2 (ja) * 1987-08-23 1994-05-18 エムテック株式会社 オリエンテ−ションフラットの研削方法及び装置
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US5036628A (en) * 1989-04-25 1991-08-06 Silicon Technology Corporation Seal assembly for a wafer grinding machine
US5076021A (en) * 1989-04-28 1991-12-31 Silicon Technology Corporation Flat grind stage assembly for an automatic edge grinder
US5036624A (en) * 1989-06-21 1991-08-06 Silicon Technology Corporation Notch grinder
US5058328A (en) * 1990-01-10 1991-10-22 Silicon Technology Corporation Wafer centering assembly
JP2859389B2 (ja) * 1990-07-09 1999-02-17 坂東機工 株式会社 ガラス板の周辺エッジを研削加工する方法及びこの方法を実施するガラス板の数値制御研削機械
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
DE4208835A1 (de) * 1992-03-19 1993-09-30 Wernicke & Co Gmbh Verfahren zum Formschleifen des Umfangs eines Brillenglases
JP2598661Y2 (ja) * 1992-07-16 1999-08-16 信越半導体株式会社 回転割出式ウエーハ面取部研磨装置
JPH06104228A (ja) * 1992-09-19 1994-04-15 M Tec Kk 半導体ウェーハのノッチ部のアール面取り方法及び装置
US5538463A (en) * 1992-11-26 1996-07-23 Shin-Etsu Handotai Co., Ltd. Apparatus for bevelling wafer-edge
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5319886A (en) * 1993-06-14 1994-06-14 Silicon Technology Corporation Tool mounting arrangement
IT1262263B (it) * 1993-12-30 1996-06-19 Delle Vedove Levigatrici Spa Procedimento di levigatura per profili curvi e sagomati e macchina levigatrice che realizza tale procedimento
JP3035690B2 (ja) * 1994-01-27 2000-04-24 株式会社東京精密 ウェーハ直径・断面形状測定装置及びそれを組み込んだウェーハ面取り機
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
JP2882458B2 (ja) * 1994-11-28 1999-04-12 株式会社東京精密 ウェーハ面取り機
DE19527222C2 (de) * 1995-07-26 1997-09-04 Wernicke & Co Gmbh Anlage zum Schleifen wenigstens des Umfangsrandes von Brillengläsern und Verfahren zum rechnerischen Berücksichtigen der Position eines an einem Haltekopf der Anlage gehaltenen Brillenglasrohlings
JP3198401B2 (ja) * 1995-08-18 2001-08-13 株式会社新川 ウェーハリングの供給・返送装置
JPH0964148A (ja) * 1995-08-18 1997-03-07 Shinkawa Ltd ウェーハリングの供給・返送装置
GB2322318B (en) * 1996-06-15 1999-12-01 Unova Uk Ltd Grinding machines for grinding discs or wafer workpieces
GB2317585B (en) * 1997-06-11 1999-12-01 Western Atlas Uk Ltd Improvements in and relating to grinding machines
EP1000706B1 (de) * 1996-06-15 2008-05-07 Cinetic Landis Grinding Limited Flexible verbindung einer schleifmaschinenspindel zu einer plattform
US6257966B1 (en) * 1998-04-27 2001-07-10 Tokyo Seimitsu Co., Ltd. Wafer surface machining apparatus
JPH11320363A (ja) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
US6332751B1 (en) * 1999-04-02 2001-12-25 Tokyo Electron Limited Transfer device centering method and substrate processing apparatus
JP3303294B2 (ja) * 1999-06-11 2002-07-15 株式会社東京精密 半導体保護テープの切断方法
GB2351684B (en) * 1999-07-03 2001-07-11 Unova Uk Ltd Improvement in and relating to edge grinding
DE10162514C2 (de) * 2001-12-19 2003-08-07 Wacker Siltronic Halbleitermat Verfahren zur Vorbereitung einer materialabtragenden Bearbeitung der Kante einer Halbleiterscheibe
KR100618543B1 (ko) * 2004-06-15 2006-08-31 삼성전자주식회사 웨이퍼 레벨 적층 패키지용 칩 스케일 패키지 제조 방법
CN101861653B (zh) * 2008-01-24 2012-07-18 应用材料公司 太阳能电池板清边模块
US20110306275A1 (en) * 2010-06-13 2011-12-15 Nicolson Matthew D Component finishing tool
JP6071611B2 (ja) 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
CN110744386A (zh) * 2019-09-17 2020-02-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 异形晶片轮廓修磨倒角机
CN114683126B (zh) * 2022-03-30 2023-03-24 中锗科技有限公司 一种磷化铟衬底片定位磨边装置及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3552584A (en) * 1968-01-03 1971-01-05 Hamco Machine And Electronics Work handling device
DE1752922C3 (de) * 1968-08-06 1974-10-31 Wilhelm Loh Kg Optikmaschinenfabrik, 6330 Wetzlar Maschine zur Randbearbeitung kleiner, nicht kreisrunder Werkstücke
US3913272A (en) * 1973-06-08 1975-10-21 Ford Motor Co Trim separation
US3921788A (en) * 1974-05-21 1975-11-25 Macronetics Inc Processing apparatus for thin disc-like workpieces
JPS5143280A (en) * 1974-10-09 1976-04-13 Toyoda Machine Works Ltd Idotaino gentenfutsukisochi
US4031667A (en) * 1976-03-29 1977-06-28 Macronetics, Inc. Apparatus for contouring edge of semiconductor wafers
US4203259A (en) * 1978-05-17 1980-05-20 Coburn Optical Industries, Inc. Apparatus for edging ophthalmic lenses
US4227347A (en) * 1978-09-14 1980-10-14 Silicon Valley Group, Inc. Two motor drive for a wafer processing machine
FR2437271A1 (fr) * 1978-09-26 1980-04-25 Crouzet Sa Dispositif pour detourer les tranches de silicium
US4344260A (en) * 1979-07-13 1982-08-17 Nagano Electronics Industrial Co., Ltd. Method for precision shaping of wafer materials
US4330203A (en) * 1979-10-15 1982-05-18 Gerd Oppenheim Optical lens layout and blocking device
JPS56105638A (en) * 1980-01-26 1981-08-22 Sumitomo Electric Ind Ltd Manufacture of circular gallium arsenide wafer
JPS58114851A (ja) * 1981-12-25 1983-07-08 Nakamuratome Seimitsu Kogyo Kk レンズ芯取機
DK14583A (da) * 1982-01-20 1983-07-21 Saint Gobain Vitrage Fremgangsmaade og apparat til positionsstyring af vaerktoejet paa en kantbearbejdningsmaskine til glasplader
DE3376631D1 (en) * 1982-01-20 1988-06-23 Saint Gobain Vitrage Apparatus for grinding the edges of glass sheets
GB2123724B (en) * 1982-05-04 1986-07-09 Tokyo Shibaura Electric Co Machining the periphery of work
JPS591143A (ja) * 1982-06-25 1984-01-06 Hitachi Ltd レンズ芯取り機
JPS59214554A (ja) * 1983-05-17 1984-12-04 Daiichi Seiki Kk ウエハ−の面取り研削装置

Also Published As

Publication number Publication date
EP0457364B1 (de) 1995-04-05
EP0457364A2 (de) 1991-11-21
US4638601A (en) 1987-01-27
EP0222521B1 (de) 1993-07-14
EP0222521A2 (de) 1987-05-20
DE3688695T2 (de) 1993-11-04
EP0457364A3 (en) 1992-05-13
DE3688695D1 (de) 1993-08-19
DE3650294T2 (de) 1995-08-10
EP0222521A3 (en) 1989-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee