DE3587933D1 - Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen. - Google Patents

Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.

Info

Publication number
DE3587933D1
DE3587933D1 DE3587933T DE3587933T DE3587933D1 DE 3587933 D1 DE3587933 D1 DE 3587933D1 DE 3587933 T DE3587933 T DE 3587933T DE 3587933 T DE3587933 T DE 3587933T DE 3587933 D1 DE3587933 D1 DE 3587933D1
Authority
DE
Germany
Prior art keywords
housing
circuit carrier
carrier contact
contact
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3587933T
Other languages
English (en)
Other versions
DE3587933T2 (de
Inventor
Dimitry Grabbe
Iosif Korsunsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE3587933D1 publication Critical patent/DE3587933D1/de
Application granted granted Critical
Publication of DE3587933T2 publication Critical patent/DE3587933T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/5149—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to sever electric terminal from supply strip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/647—With means to convey work relative to tool station
    • Y10T83/658—With projections on work-carrier [e.g., pin wheel]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE3587933T 1984-02-27 1985-02-06 Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen. Expired - Fee Related DE3587933T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58427484A 1984-02-27 1984-02-27

Publications (2)

Publication Number Publication Date
DE3587933D1 true DE3587933D1 (de) 1994-11-03
DE3587933T2 DE3587933T2 (de) 1995-05-11

Family

ID=24336648

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3587933T Expired - Fee Related DE3587933T2 (de) 1984-02-27 1985-02-06 Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.
DE8585300782T Expired - Fee Related DE3584532D1 (de) 1984-02-27 1985-02-06 Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8585300782T Expired - Fee Related DE3584532D1 (de) 1984-02-27 1985-02-06 Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen.

Country Status (7)

Country Link
US (3) US4642872A (de)
EP (2) EP0155080B1 (de)
JP (2) JPS60211787A (de)
KR (1) KR900006067B1 (de)
DE (2) DE3587933T2 (de)
HK (1) HK12795A (de)
IE (1) IE56446B1 (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799897A (en) * 1985-12-30 1989-01-24 Dai-Ichi Seiko Kabushiki Kaisha IC tester socket
JPS62160676A (ja) * 1985-12-31 1987-07-16 日本テキサス・インスツルメンツ株式会社 ソケツト
US4710134A (en) * 1986-09-29 1987-12-01 Amp Incorporated Low insertion force chip carrier connector with movable housing
US4917614A (en) * 1987-05-12 1990-04-17 Amp Incorporated Electrical connector for surface mounting onto circuit boards
US4755146A (en) * 1987-06-04 1988-07-05 Molex Incorporated Heat-dissipating socket connector for leaded modules
US5168432A (en) * 1987-11-17 1992-12-01 Advanced Interconnections Corporation Adapter for connection of an integrated circuit package to a circuit board
US5041023A (en) * 1988-01-22 1991-08-20 Burndy Corporation Card edge connector
US4886470A (en) * 1988-05-24 1989-12-12 Amp Incorporated Burn-in socket for gull wing integrated circuit package
US4934961A (en) * 1988-12-21 1990-06-19 Burndy Corporation Bi-level card edge connector and method of making the same
EP0379176B1 (de) * 1989-01-19 1995-03-15 Burndy Corporation Kupplungsvorrichtung für die Kanten gedruckter Schaltungen
US4941832A (en) * 1989-01-30 1990-07-17 Amp Incorporated Low profile chip carrier socket
US4919623A (en) * 1989-02-13 1990-04-24 Amp Incorporated Burn-in socket for integrated circuit device
US5053199A (en) * 1989-02-21 1991-10-01 Boehringer Mannheim Corporation Electronically readable information carrier
JPH0338769Y2 (de) * 1989-08-01 1991-08-15
US4959029A (en) * 1989-08-18 1990-09-25 Amp Incorporated Electrical contact
EP0418993B1 (de) * 1989-09-19 1996-01-17 Autosplice, Inc. Anordnung von kontinuierlich eingebetteten elektronischen Bauelementen
JPH02155181A (ja) * 1989-10-02 1990-06-14 Yamaichi Electric Mfg Co Ltd Ｉｃ接続器
US4996476A (en) * 1989-11-06 1991-02-26 Itt Corporation Test clip for surface mount device
US5007844A (en) * 1990-01-17 1991-04-16 Hewlett-Packard Company Surface mount method and device
US5166609A (en) * 1990-05-24 1992-11-24 Tektronix, Inc. Adapter and test fixture for an integrated circuit device package
FR2669149B1 (fr) * 1990-11-12 1994-09-02 Souriau & Cie Connecteur intermediaire entre carte de circuit imprime et substrat a circuits electroniques actifs.
US5142765A (en) * 1990-12-07 1992-09-01 Rohm Co., Ltd. Lead mounting apparatus
US5127839A (en) * 1991-04-26 1992-07-07 Amp Incorporated Electrical connector having reliable terminals
JP2555593Y2 (ja) * 1991-06-14 1997-11-26 日本エー・エム・ピー株式会社 表面実装型コネクタ
US5199889A (en) * 1991-11-12 1993-04-06 Jem Tech Leadless grid array socket
US5226825A (en) * 1992-01-15 1993-07-13 The Whitaker Corporation Surface mount chip carrier socket
US5241744A (en) * 1992-05-12 1993-09-07 Zierick Manufacturing Corporation Method of individually inserting terminals connected in a strip and apparatus for carrying out the method
JPH0831348B2 (ja) * 1993-04-30 1996-03-27 株式会社秩父富士 Ｉｃパッケージ用ソケット
US5767443A (en) * 1993-07-10 1998-06-16 Micron Technology, Inc. Multi-die encapsulation device
US5593927A (en) * 1993-10-14 1997-01-14 Micron Technology, Inc. Method for packaging semiconductor dice
US5605464A (en) * 1994-03-22 1997-02-25 Molex Incorporated IC package connector
KR100225316B1 (ko) * 1994-03-28 1999-10-15 무라타 고이치 와이어압착소켓 커넥터 제조 방법 및 장치
US5709026A (en) * 1995-12-22 1998-01-20 Micro Contacts, Inc. Apparatus for metal stamping insertion into a mold cavity
DE19618481C1 (de) * 1996-05-08 1997-08-14 Telefunken Microelectron Elektronikmodul mit Steckkontakten und leitender Abdeckkappe
JPH1055864A (ja) * 1996-08-09 1998-02-24 Amp Japan Ltd 基板取付用端子組立体及びそれを使用した基板組立体
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
JPH10241807A (ja) * 1997-02-14 1998-09-11 Molex Inc 電気コネクタ
US6141869A (en) * 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
WO2002041396A2 (en) * 2000-11-20 2002-05-23 Intel Corporation High performance heat sink configurations for use in high density packaging applications
JP3411904B2 (ja) * 2000-12-25 2003-06-03 山一電機株式会社 実装コネクタおよびコンタクト端子
US6388207B1 (en) 2000-12-29 2002-05-14 Intel Corporation Electronic assembly with trench structures and methods of manufacture
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
JP2004063425A (ja) * 2002-07-31 2004-02-26 Mitsumi Electric Co Ltd モジュール用コネクタ
JP2004063391A (ja) * 2002-07-31 2004-02-26 Mitsumi Electric Co Ltd モジュール用コネクタ
JP4464878B2 (ja) * 2005-07-11 2010-05-19 矢崎総業株式会社 電気接続箱
TWI305435B (en) * 2005-12-29 2009-01-11 Hon Hai Prec Ind Co Ltd Electrical connector
CN201774029U (zh) * 2010-02-08 2011-03-23 富士康(昆山)电脑接插件有限公司 电连接器
KR101388792B1 (ko) * 2012-04-27 2014-04-23 삼성전기주식회사 반도체 패키지 모듈
JP5990333B2 (ja) * 2013-08-30 2016-09-14 矢崎総業株式会社 電子部品と端子金具との接続構造
US9011187B2 (en) * 2013-09-04 2015-04-21 Cheng Uei Precision Industry Co., Ltd. Electrical connector

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE950221C (de) * 1953-02-06 1956-10-04 Preh Elektro Feinmechanik Verfahren und Einrichtung zum Bestuecken von Roehrenfassungen mit Kontakftedern
US3503036A (en) * 1968-03-27 1970-03-24 Amp Inc Contact terminals and manufacturing method
US3533045A (en) * 1968-05-29 1970-10-06 Amp Inc Supporting and keying means for printed circuit boards or the like
NL137271B (de) * 1968-08-22 1900-01-01
US3652899A (en) * 1968-10-29 1972-03-28 Amp Inc Support member for electronic packaging
US3669054A (en) * 1970-03-23 1972-06-13 Amp Inc Method of manufacturing electrical terminals
US3756109A (en) * 1971-07-01 1973-09-04 Motorola Inc Automatic feed apparatus for encapsulated semiconductor units
US3754203A (en) * 1971-07-01 1973-08-21 Amp Inc Substrate connector and terminal therefore
BE789688A (fr) * 1971-10-06 1973-04-04 Amp Inc Connecteur
US3910664A (en) * 1973-01-04 1975-10-07 Amp Inc Multi-contact electrical connector for a ceramic substrate or the like
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US3871736A (en) * 1973-09-20 1975-03-18 Amp Inc Connectors providing interconnection between closely spaced conductors and widely spaced terminals
US3948128A (en) * 1973-12-07 1976-04-06 Dennison Manufacturing Company Feed and severing apparatus
US3942788A (en) * 1974-06-13 1976-03-09 Bell & Howell Company Sheet material transport equipment
US4018494A (en) * 1975-06-10 1977-04-19 Amp Incorporated Interconnection for electrically connecting two vertically stacked electronic packages
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
GB1515820A (en) * 1977-01-14 1978-06-28 Amp Inc Electrical connector
FR2378423A1 (fr) * 1977-01-25 1978-08-18 Amp Inc Connecteur electrique de montage de substrats pour circuits integres sur des plaquettes a circuit imprime
US4116519A (en) * 1977-08-02 1978-09-26 Amp Incorporated Electrical connections for chip carriers
US4263708A (en) * 1978-06-03 1981-04-28 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Machine for automatically inserting parallel lead electronic components into a printed circuit board
US4222622A (en) * 1978-06-12 1980-09-16 Gte Products Corporation Electrical connector for circuit board
US4216580A (en) * 1978-12-20 1980-08-12 Western Electric Company, Inc. Methods of and apparatus for assembling articles with a support
US4341433A (en) * 1979-05-14 1982-07-27 Amp Incorporated Active device substrate connector
US4268102A (en) * 1979-10-04 1981-05-19 Amp Incorporated Low impedance electrical connecting means for spaced-apart conductors
US4370017A (en) * 1980-11-20 1983-01-25 Amp Incorporated Complanate contact terminal
US4370012A (en) * 1980-11-20 1983-01-25 Amp Incorporated Electrical connector for circuit board or substrate
US4354729A (en) * 1980-12-22 1982-10-19 Amp Incorporated Preloaded electrical contact terminal
US4402561A (en) * 1981-03-27 1983-09-06 Amp Incorporated Socket for integrated circuit package with extended leads
US4449770A (en) * 1981-05-22 1984-05-22 Amp Incorporated Socketless separable connector
US4426769A (en) * 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
JPS5854474A (ja) * 1981-09-26 1983-03-31 Omron Tateisi Electronics Co レストランシステム
DE3202920A1 (de) * 1982-01-29 1983-08-11 Rhein-Nadel Maschinennadel GmbH, 5100 Aachen Vorrichtung zum transport stabfoermiger werkstuecke, insbesondere naehmaschinennadel-rohlinge
US4451818A (en) * 1982-07-06 1984-05-29 Amp Incorporated Miniature connector for a circuit board edge
US4489871A (en) * 1982-11-24 1984-12-25 Amp Incorporated Strip feeding apparatus
US4494807A (en) * 1982-12-27 1985-01-22 Amp Incorporated Low profile chip carrier contact
US4513353A (en) * 1982-12-27 1985-04-23 Amp Incorporated Connection of leadless integrated circuit package to a circuit board
US4511197A (en) * 1983-08-01 1985-04-16 Amp Incorporated High density contact assembly
US4533192A (en) * 1984-04-25 1985-08-06 Minnesota Mining And Manufacturing Company Integrated circuit test socket
US4547031A (en) * 1984-06-29 1985-10-15 Amp Incorporated Chip carrier socket and contact
US4630875A (en) * 1984-07-02 1986-12-23 Amp Incorporated Chip carrier socket which requires low insertion force for the chip carrier
US4655519A (en) * 1985-10-16 1987-04-07 Amp Incorporated Electrical connector for interconnecting arrays of conductive areas

Also Published As

Publication number Publication date
US4645279A (en) 1987-02-24
IE56446B1 (en) 1991-07-31
KR900006067B1 (ko) 1990-08-20
DE3584532D1 (de) 1991-12-05
EP0155080A3 (en) 1988-07-13
USRE33268E (en) 1990-07-17
JPS63239792A (ja) 1988-10-05
EP0155080A2 (de) 1985-09-18
KR850006846A (ko) 1985-10-16
EP0155080B1 (de) 1991-10-30
EP0404277A1 (de) 1990-12-27
HK12795A (en) 1995-02-03
JPH0673310B2 (ja) 1994-09-14
EP0404277B1 (de) 1994-09-28
JPS6353674B2 (de) 1988-10-25
DE3587933T2 (de) 1995-05-11
US4642872A (en) 1987-02-17
IE850434L (en) 1985-08-27
JPS60211787A (ja) 1985-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee