DE3512237A1 - Mehrschichtige flexible schaltungsanordnung mit verbindungsvorrichtungen zwischen den schichten - Google Patents

Mehrschichtige flexible schaltungsanordnung mit verbindungsvorrichtungen zwischen den schichten

Info

Publication number
DE3512237A1
DE3512237A1 DE19853512237 DE3512237A DE3512237A1 DE 3512237 A1 DE3512237 A1 DE 3512237A1 DE 19853512237 DE19853512237 DE 19853512237 DE 3512237 A DE3512237 A DE 3512237A DE 3512237 A1 DE3512237 A1 DE 3512237A1
Authority
DE
Germany
Prior art keywords
circuit
circuit arrangement
conductor
connection
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19853512237
Other languages
German (de)
English (en)
Inventor
Frederick A. Mesa Ariz. Balash
Mary T. Chandler Ariz. Caton
Roger Beynes Meleard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mektron France S A Chateau Gontier Fr
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of DE3512237A1 publication Critical patent/DE3512237A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE19853512237 1984-04-03 1985-04-03 Mehrschichtige flexible schaltungsanordnung mit verbindungsvorrichtungen zwischen den schichten Ceased DE3512237A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8405220A FR2562335B1 (fr) 1984-04-03 1984-04-03 Circuit multicouche flexible avec connexions entre couches soudees par voie ultrasonique

Publications (1)

Publication Number Publication Date
DE3512237A1 true DE3512237A1 (de) 1985-12-12

Family

ID=9302775

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853512237 Ceased DE3512237A1 (de) 1984-04-03 1985-04-03 Mehrschichtige flexible schaltungsanordnung mit verbindungsvorrichtungen zwischen den schichten

Country Status (7)

Country Link
JP (1) JPS60227497A (it)
DE (1) DE3512237A1 (it)
ES (1) ES295813Y (it)
FR (1) FR2562335B1 (it)
GB (1) GB2157085B (it)
IT (1) IT1183552B (it)
SE (1) SE459832B (it)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535008A1 (de) * 1985-10-01 1987-04-02 Telefunken Electronic Gmbh Folienschaltung
DE10035175C1 (de) * 2000-07-19 2002-01-03 Fraunhofer Ges Forschung Verfahren zur Herstellung einer elektrischen und/oder mechanischen Verbindung von flexiblen Dünnfilmsubstraten
DE102005033218A1 (de) * 2005-07-15 2007-01-18 Printed Systems Gmbh Dreidimensionale Schaltung
DE102011109992A1 (de) * 2011-08-11 2013-02-14 Eppendorf Ag Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704498A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
DE3704497A1 (de) * 1987-02-13 1988-08-25 Aristo Graphic Systeme Verfahren zur herstellung eines digitalisiertabletts
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
GB2233157B (en) * 1989-06-13 1992-10-21 British Aerospace Printed circuit board
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
US5347710A (en) * 1993-07-27 1994-09-20 International Business Machines Corporation Parallel processor and method of fabrication
DE19831876A1 (de) * 1997-07-16 1999-02-25 Fraunhofer Ges Forschung Kontakt sowie Verfahren zur Herstellung eines Kontaktes
JP3587748B2 (ja) 1999-10-18 2004-11-10 ソニーケミカル株式会社 多層フレキシブル配線板及び多層フレキシブル配線板製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1456994A (en) * 1973-06-28 1976-12-01 Marconi Co Ltd Methods for forming electrical internconnection between metal layers for printed circuit assembly
IL53957A0 (en) * 1977-02-15 1978-04-30 Bogardus Lomerson R A method for establishing an electrically conductive path through an insulating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535008A1 (de) * 1985-10-01 1987-04-02 Telefunken Electronic Gmbh Folienschaltung
DE10035175C1 (de) * 2000-07-19 2002-01-03 Fraunhofer Ges Forschung Verfahren zur Herstellung einer elektrischen und/oder mechanischen Verbindung von flexiblen Dünnfilmsubstraten
WO2002007486A1 (de) * 2000-07-19 2002-01-24 Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung einer elektrischen und/oder mechanischen verbindung von flexiblen dünnfilmsubstraten
US6995083B2 (en) 2000-07-19 2006-02-07 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method for producing an electrical and/or mechanical connection between flexible thin-film substrates
DE102005033218A1 (de) * 2005-07-15 2007-01-18 Printed Systems Gmbh Dreidimensionale Schaltung
DE102011109992A1 (de) * 2011-08-11 2013-02-14 Eppendorf Ag Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät

Also Published As

Publication number Publication date
ES295813U (es) 1987-06-16
FR2562335B1 (fr) 1988-11-25
SE8501635D0 (sv) 1985-04-02
GB8508567D0 (en) 1985-05-09
IT8520190A0 (it) 1985-04-02
JPH0564880B2 (it) 1993-09-16
SE459832B (sv) 1989-08-07
GB2157085A (en) 1985-10-16
JPS60227497A (ja) 1985-11-12
ES295813Y (es) 1987-12-16
IT1183552B (it) 1987-10-22
GB2157085B (en) 1987-06-24
FR2562335A1 (fr) 1985-10-04
SE8501635L (sv) 1985-10-04

Similar Documents

Publication Publication Date Title
DE3020196C2 (de) Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
DE2702844C2 (de) Verfahren zur Herstellung einer vielschichtigen gedruckten Schaltung
DE2524437C3 (de) Schalttafelstruktur einer kapazitiv gekoppelten Tastatur
DE4002025C2 (de) Leiterplatte
DE4138818B4 (de) Gehäuse zur Aufnahme elektronischer Komponenten und Verfahren zu seiner Herstellung
DE3812021A1 (de) Flexible schaltung mit anschlussorganen und verfahren zu ihrer herstellung
EP0175045A2 (de) Verfahren zur Herstellung von durchkontaktierten flexiblen Leiterplatten für hohe Biegebeanspruchung
DE2539925A1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte
DE1616734A1 (de) Verfahren zum wahlweisen Verbinden der in mehreren Ebenen verlaufenden flaechenhaften Leitungszuege eines mehrschichtigen Isolierstofftraegers
DE2752438A1 (de) Anordnung fuer das packen von monolithisch integrierten halbleiterschaltungen
DE3325315A1 (de) Matrixanzeige
DE3325982A1 (de) Schichtwiderstand-eingabevorrichtung und verfahren zu ihrer herstellung
DE4020498C2 (de) Verfahren zum Herstellen von Multiwire-Leiterplatten mit isolierten Metalleitern und/oder optischen Leitern
DE3011068A1 (de) Elektrische gegenplatte und verfahren zu ihrer herstellung
DE3512237A1 (de) Mehrschichtige flexible schaltungsanordnung mit verbindungsvorrichtungen zwischen den schichten
EP0535491B1 (de) Verfahren zur Herstellung elektrisch leitender Verbindungen an Leiterplatten
DE19627663A1 (de) Oberflächenmontierbefestigungen von Nebenplatinen an Hauptplatinen
DE112017000403T5 (de) Geschirmter, gefalteter Steckverbinder für einen Sensor
DE69833495T2 (de) Herstellungsvefahren für eine mehrschichtige leiterplatte
DE3442803A1 (de) Hybridschaltung auf einem flexiblen traegermaterial sowie verfahren zu deren herstellung
DE3631947C2 (it)
DE2939922A1 (de) Elektrische verbinderanordnung
DE3810486C2 (it)
DE2627297C2 (de) Mehrschichtige, gedruckte Schaltungsplatte
DE102019116333A1 (de) Elektrische leitungsanordnung mit einer art verdrillung und herstellungsverfahren

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: MEKTRON FRANCE S. A., CHATEAU GONTIER, FR

8110 Request for examination paragraph 44
8131 Rejection