DE3508005A1 - Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten - Google Patents

Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten

Info

Publication number
DE3508005A1
DE3508005A1 DE19853508005 DE3508005A DE3508005A1 DE 3508005 A1 DE3508005 A1 DE 3508005A1 DE 19853508005 DE19853508005 DE 19853508005 DE 3508005 A DE3508005 A DE 3508005A DE 3508005 A1 DE3508005 A1 DE 3508005A1
Authority
DE
Germany
Prior art keywords
soldering
semiconductor package
cleaned
dual
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19853508005
Other languages
German (de)
English (en)
Inventor
Richardus Henricus Johannes Herwen Fierkens
Ireneus Johannes Theodorus Maria Rozendaal Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Fico Tooling BV
Original Assignee
ASM Fico Tooling BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Fico Tooling BV filed Critical ASM Fico Tooling BV
Publication of DE3508005A1 publication Critical patent/DE3508005A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/045—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning In General (AREA)
DE19853508005 1984-03-06 1985-03-06 Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten Withdrawn DE3508005A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58684184A 1984-03-06 1984-03-06

Publications (1)

Publication Number Publication Date
DE3508005A1 true DE3508005A1 (de) 1986-03-27

Family

ID=24347305

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853508005 Withdrawn DE3508005A1 (de) 1984-03-06 1985-03-06 Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten

Country Status (4)

Country Link
JP (1) JPS615598A (enExample)
DE (1) DE3508005A1 (enExample)
GB (1) GB2159753B (enExample)
NL (1) NL8500637A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2661544B1 (fr) * 1990-04-27 1994-05-27 Commissariat Energie Atomique Procede et dispositif de decontamination par decapage ionique.
US5223691A (en) * 1991-06-03 1993-06-29 Motorola, Inc. Plasma based soldering method requiring no additional heat sources or flux
DE19654250A1 (de) * 1996-08-26 1998-03-05 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Herstellen oxidationsempfindlicher Lötverbindunden
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US8444041B2 (en) * 2011-04-08 2013-05-21 Lincoln Global, Inc. Brazing system and method
CN108511329B (zh) * 2018-06-15 2024-03-15 德阳帛汉电子有限公司 一种芯片清洗装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB806381A (en) * 1956-07-27 1958-12-23 Gen Motors Corp Improvements in or relating to methods of, and apparatus for, etching metal surfaces by ionic bombardment and to articles produced thereby
DE1289382B (de) * 1963-08-16 1969-02-13 Licentia Gmbh Verfahren zur Oxydation eines Silizium-Halbleiterkoerpers
BE758321A (fr) * 1969-11-03 1971-04-01 Rca Corp Procede de metallisation de dispositifs a semi-conducteurs
GB1305313A (enExample) * 1970-02-13 1973-01-31
FR2082505A5 (enExample) * 1970-03-18 1971-12-10 Radiotechnique Compelec
GB1347849A (en) * 1971-04-21 1974-02-27 Nat Res Dev Metal oxide semiconductor transistors
JPS5712651B2 (enExample) * 1974-05-23 1982-03-12
GB1462929A (en) * 1974-09-03 1977-01-26 Olson D M Vaginal speculum
US3994793A (en) * 1975-05-22 1976-11-30 International Business Machines Corporation Reactive ion etching of aluminum
JPS54124853A (en) * 1978-03-23 1979-09-28 Hiroyasu Funakubo Press contacting method and apparatus of minute metal strain
GB2144669B (en) * 1982-12-07 1986-02-26 Standard Telephones Cables Ltd Cleaning electrical contacts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern

Also Published As

Publication number Publication date
JPS615598A (ja) 1986-01-11
JPH0262959B2 (enExample) 1990-12-27
GB8505650D0 (en) 1985-04-03
NL8500637A (nl) 1985-10-01
GB2159753B (en) 1988-09-07
GB2159753A (en) 1985-12-11

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: MOLL, W., DIPL.-PHYS. DR.RER.NAT. GLAWE, U., DIPL.

8141 Disposal/no request for examination