BE758321A - Procede de metallisation de dispositifs a semi-conducteurs - Google Patents
Procede de metallisation de dispositifs a semi-conducteursInfo
- Publication number
- BE758321A BE758321A BE758321DA BE758321A BE 758321 A BE758321 A BE 758321A BE 758321D A BE758321D A BE 758321DA BE 758321 A BE758321 A BE 758321A
- Authority
- BE
- Belgium
- Prior art keywords
- semiconductor devices
- metallizing
- metallizing semiconductor
- devices
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/36—Gas-filled discharge tubes for cleaning surfaces while plating with ions of materials introduced into the discharge, e.g. introduced by evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/017—Clean surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/045—Electric field
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/05—Etch and refill
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/158—Sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87329969A | 1969-11-03 | 1969-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE758321A true BE758321A (fr) | 1971-04-01 |
Family
ID=25361352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE758321D BE758321A (fr) | 1969-11-03 | Procede de metallisation de dispositifs a semi-conducteurs |
Country Status (9)
Country | Link |
---|---|
US (1) | US3640811A (fr) |
JP (1) | JPS494583B1 (fr) |
BE (1) | BE758321A (fr) |
CA (1) | CA932627A (fr) |
DE (1) | DE2054069A1 (fr) |
FR (1) | FR2066947B1 (fr) |
GB (1) | GB1279229A (fr) |
NL (1) | NL7015995A (fr) |
SE (1) | SE358771B (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947298A (en) * | 1974-01-25 | 1976-03-30 | Raytheon Company | Method of forming junction regions utilizing R.F. sputtering |
DE2549405A1 (de) * | 1974-11-05 | 1976-05-06 | Eastman Kodak Co | Verfahren zum niederschlagen einer schicht aus photosensitivem material auf einer oberflaeche |
US4288306A (en) * | 1978-07-08 | 1981-09-08 | Wolfgang Kieferle | Process for forming a metal or alloy layer and device for executing same |
US4420386A (en) * | 1983-04-22 | 1983-12-13 | White Engineering Corporation | Method for pure ion plating using magnetic fields |
GB2159753B (en) * | 1984-03-06 | 1988-09-07 | Asm Fico Tooling | Method and apparatus for cleaning lead pins before soldering operations |
IT1185964B (it) * | 1985-10-01 | 1987-11-18 | Sgs Microelettronica Spa | Procedimento e relativa apparecchiatura per realizzare contatti metallo-semiconduttore di tipo ohmico |
GB2202236B (en) * | 1987-03-09 | 1991-04-24 | Philips Electronic Associated | Manufacture of electronic devices comprising cadmium mercury telluride |
US4822466A (en) * | 1987-06-25 | 1989-04-18 | University Of Houston - University Park | Chemically bonded diamond films and method for producing same |
KR910005401B1 (ko) * | 1988-09-07 | 1991-07-29 | 경상현 | 비결정 실리콘을 이용한 자기정렬 트랜지스터 제조방법 |
EP1835524A1 (fr) * | 2006-03-16 | 2007-09-19 | Sulzer Metco AG | Dispositif de fixation pour une source de pulvérisation cathodique |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3121852A (en) * | 1960-04-18 | 1964-02-18 | Gen Motors Corp | Ohmic contacts on semiconductors |
US3233137A (en) * | 1961-08-28 | 1966-02-01 | Litton Systems Inc | Method and apparatus for cleansing by ionic bombardment |
US3271286A (en) * | 1964-02-25 | 1966-09-06 | Bell Telephone Labor Inc | Selective removal of material using cathodic sputtering |
US3324019A (en) * | 1962-12-11 | 1967-06-06 | Schjeldahl Co G T | Method of sputtering sequentially from a plurality of cathodes |
US3325393A (en) * | 1964-05-28 | 1967-06-13 | Gen Electric | Electrical discharge cleaning and coating process |
US3479269A (en) * | 1967-01-04 | 1969-11-18 | Bell Telephone Labor Inc | Method for sputter etching using a high frequency negative pulse train |
US3492215A (en) * | 1967-02-27 | 1970-01-27 | Bendix Corp | Sputtering of material simultaneously evaporated onto the target |
-
0
- BE BE758321D patent/BE758321A/fr unknown
-
1969
- 1969-11-03 US US873299A patent/US3640811A/en not_active Expired - Lifetime
-
1970
- 1970-10-13 CA CA095445A patent/CA932627A/en not_active Expired
- 1970-10-29 GB GB51576/70A patent/GB1279229A/en not_active Expired
- 1970-10-29 FR FR7039096A patent/FR2066947B1/fr not_active Expired
- 1970-11-02 SE SE14739/70A patent/SE358771B/xx unknown
- 1970-11-02 JP JP45096738A patent/JPS494583B1/ja active Pending
- 1970-11-02 NL NL7015995A patent/NL7015995A/xx unknown
- 1970-11-03 DE DE19702054069 patent/DE2054069A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS494583B1 (fr) | 1974-02-01 |
CA932627A (en) | 1973-08-28 |
DE2054069A1 (de) | 1971-05-19 |
SE358771B (fr) | 1973-08-06 |
FR2066947A1 (fr) | 1971-08-13 |
US3640811A (en) | 1972-02-08 |
FR2066947B1 (fr) | 1976-04-16 |
GB1279229A (en) | 1972-06-28 |
NL7015995A (fr) | 1971-05-05 |
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