GB2159753B - Method and apparatus for cleaning lead pins before soldering operations - Google Patents

Method and apparatus for cleaning lead pins before soldering operations

Info

Publication number
GB2159753B
GB2159753B GB08505650A GB8505650A GB2159753B GB 2159753 B GB2159753 B GB 2159753B GB 08505650 A GB08505650 A GB 08505650A GB 8505650 A GB8505650 A GB 8505650A GB 2159753 B GB2159753 B GB 2159753B
Authority
GB
United Kingdom
Prior art keywords
lead pins
before soldering
soldering operations
pins before
cleaning lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08505650A
Other versions
GB8505650D0 (en
GB2159753A (en
Inventor
Richardus Henricus Jo Fierkens
Ireneus Johannes Theodorus Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Fico Tooling BV
Original Assignee
ASM Fico Tooling BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Fico Tooling BV filed Critical ASM Fico Tooling BV
Publication of GB8505650D0 publication Critical patent/GB8505650D0/en
Publication of GB2159753A publication Critical patent/GB2159753A/en
Application granted granted Critical
Publication of GB2159753B publication Critical patent/GB2159753B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • ing And Chemical Polishing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cleaning In General (AREA)
GB08505650A 1984-03-06 1985-03-05 Method and apparatus for cleaning lead pins before soldering operations Expired GB2159753B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58684184A 1984-03-06 1984-03-06

Publications (3)

Publication Number Publication Date
GB8505650D0 GB8505650D0 (en) 1985-04-03
GB2159753A GB2159753A (en) 1985-12-11
GB2159753B true GB2159753B (en) 1988-09-07

Family

ID=24347305

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08505650A Expired GB2159753B (en) 1984-03-06 1985-03-05 Method and apparatus for cleaning lead pins before soldering operations

Country Status (4)

Country Link
JP (1) JPS615598A (en)
DE (1) DE3508005A1 (en)
GB (1) GB2159753B (en)
NL (1) NL8500637A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4032328A1 (en) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl METHOD AND DEVICE FOR PROCESSING JOINT PARTNERS TO BE SOLDERED
FR2661544B1 (en) * 1990-04-27 1994-05-27 Commissariat Energie Atomique PROCESS AND DEVICE FOR DECONTAMINATION BY ION STRIPPING.
US5223691A (en) * 1991-06-03 1993-06-29 Motorola, Inc. Plasma based soldering method requiring no additional heat sources or flux
DE19654250A1 (en) * 1996-08-26 1998-03-05 Fraunhofer Ges Forschung Production of oxidation-sensitive soldered joints
US6468833B2 (en) * 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
US8444041B2 (en) * 2011-04-08 2013-05-21 Lincoln Global, Inc. Brazing system and method
CN108511329B (en) * 2018-06-15 2024-03-15 德阳帛汉电子有限公司 Chip cleaning device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB806381A (en) * 1956-07-27 1958-12-23 Gen Motors Corp Improvements in or relating to methods of, and apparatus for, etching metal surfaces by ionic bombardment and to articles produced thereby
DE1289382B (en) * 1963-08-16 1969-02-13 Licentia Gmbh Process for the oxidation of a silicon semiconductor body
BE758321A (en) * 1969-11-03 1971-04-01 Rca Corp PROCESS FOR METALLIZING SEMICONDUCTOR DEVICES
GB1305313A (en) * 1970-02-13 1973-01-31
FR2082505A5 (en) * 1970-03-18 1971-12-10 Radiotechnique Compelec
GB1347849A (en) * 1971-04-21 1974-02-27 Nat Res Dev Metal oxide semiconductor transistors
JPS5712651B2 (en) * 1974-05-23 1982-03-12
GB1462929A (en) * 1974-09-03 1977-01-26 Olson D M Vaginal speculum
US3994793A (en) * 1975-05-22 1976-11-30 International Business Machines Corporation Reactive ion etching of aluminum
JPS54124853A (en) * 1978-03-23 1979-09-28 Hiroyasu Funakubo Press contacting method and apparatus of minute metal strain
GB2144669B (en) * 1982-12-07 1986-02-26 Standard Telephones Cables Ltd Cleaning electrical contacts

Also Published As

Publication number Publication date
GB8505650D0 (en) 1985-04-03
NL8500637A (en) 1985-10-01
JPS615598A (en) 1986-01-11
DE3508005A1 (en) 1986-03-27
JPH0262959B2 (en) 1990-12-27
GB2159753A (en) 1985-12-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee
728C Application made for restoration (sect. 28/1977)
728A Order made restoring the patent (sect. 28/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980305