DE3485531D1 - Verfahren fuer die herstellung von motiven fuer fotomasken. - Google Patents
Verfahren fuer die herstellung von motiven fuer fotomasken.Info
- Publication number
- DE3485531D1 DE3485531D1 DE8484307030T DE3485531T DE3485531D1 DE 3485531 D1 DE3485531 D1 DE 3485531D1 DE 8484307030 T DE8484307030 T DE 8484307030T DE 3485531 T DE3485531 T DE 3485531T DE 3485531 D1 DE3485531 D1 DE 3485531D1
- Authority
- DE
- Germany
- Prior art keywords
- motives
- production
- photo masks
- masks
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58194580A JPS6085523A (ja) | 1983-10-17 | 1983-10-17 | マスク形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3485531D1 true DE3485531D1 (de) | 1992-04-09 |
Family
ID=16326903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484307030T Expired - Fee Related DE3485531D1 (de) | 1983-10-17 | 1984-10-15 | Verfahren fuer die herstellung von motiven fuer fotomasken. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4610940A (de) |
EP (1) | EP0138602B1 (de) |
JP (1) | JPS6085523A (de) |
DE (1) | DE3485531D1 (de) |
IE (1) | IE57546B1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8610655D0 (en) * | 1986-05-01 | 1986-06-04 | Smiths Industries Plc | Integrated circuit substrates |
US4847183A (en) * | 1987-09-09 | 1989-07-11 | Hewlett-Packard Company | High contrast optical marking method for polished surfaces |
GB8803171D0 (en) * | 1988-02-11 | 1988-03-09 | English Electric Valve Co Ltd | Imaging apparatus |
US4849313A (en) * | 1988-04-28 | 1989-07-18 | Vlsi Technology, Inc. | Method for making a reticle mask |
JP2666859B2 (ja) * | 1988-11-25 | 1997-10-22 | 日本電気株式会社 | 目合せ用バーニヤパターンを備えた半導体装置 |
US5082755A (en) * | 1989-10-02 | 1992-01-21 | General Electric Company | Liquid crystal programmable photoresist exposure method for making a set of masks |
US5237393A (en) * | 1990-05-28 | 1993-08-17 | Nec Corporation | Reticle for a reduced projection exposure apparatus |
JPH0444307A (ja) * | 1990-06-12 | 1992-02-14 | Nec Corp | 半導体装置の製造方法 |
GB9024043D0 (en) * | 1990-11-06 | 1990-12-19 | Street Graham S B | Method and apparatus for processing cellular images |
KR100273785B1 (ko) * | 1991-07-18 | 2001-01-15 | 기타지마 요시토시 | 정합패턴을 갖는 패턴판의 묘화방법 및 그 방법에 의하여 묘화된 패턴판 |
JP3039152B2 (ja) * | 1992-08-18 | 2000-05-08 | ブラザー工業株式会社 | 自動エミュレーション切換え機能付き印字装置 |
KR0128828B1 (ko) * | 1993-12-23 | 1998-04-07 | 김주용 | 반도체 장치의 콘택홀 제조방법 |
US5450332A (en) * | 1994-06-24 | 1995-09-12 | The United States Of America As Represented By The National Security Agency | Method of creating a mebes pattern-generation file for use in the manufacture of integrated-circuit masks |
US5876883A (en) * | 1995-12-27 | 1999-03-02 | Vlsi Technology, Inc. | Method forming focus/exposure matrix on a wafer using overlapped exposures |
US6465322B2 (en) | 1998-01-15 | 2002-10-15 | Koninklijke Philips Electronics N.V. | Semiconductor processing methods and structures for determining alignment during semiconductor wafer processing |
US6327513B1 (en) | 1998-04-16 | 2001-12-04 | Vlsi Technology, Inc. | Methods and apparatus for calculating alignment of layers during semiconductor processing |
JP2000299266A (ja) | 1999-04-12 | 2000-10-24 | Canon Inc | X線マスク、およびx線マスク作製方法 |
CN112882222B (zh) * | 2021-03-23 | 2022-11-22 | 重庆市毅博机械有限公司 | 一种用于瞄准镜镜片的分划线绘制装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2905636C2 (de) * | 1979-02-14 | 1985-06-20 | Censor Patent- Und Versuchs-Anstalt, Vaduz | Verfahren zum Kopieren von Masken auf ein Werkstück |
JPS55134934A (en) * | 1979-04-09 | 1980-10-21 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Projection exposing method |
JPS584927A (ja) * | 1981-06-30 | 1983-01-12 | Nec Ic Microcomput Syst Ltd | パタ−ン作成方法 |
US4388386A (en) * | 1982-06-07 | 1983-06-14 | International Business Machines Corporation | Mask set mismatch |
-
1983
- 1983-10-17 JP JP58194580A patent/JPS6085523A/ja active Granted
-
1984
- 1984-10-09 US US06/658,626 patent/US4610940A/en not_active Expired - Fee Related
- 1984-10-15 IE IE2643/84A patent/IE57546B1/en not_active IP Right Cessation
- 1984-10-15 DE DE8484307030T patent/DE3485531D1/de not_active Expired - Fee Related
- 1984-10-15 EP EP84307030A patent/EP0138602B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0138602B1 (de) | 1992-03-04 |
EP0138602A3 (en) | 1987-11-25 |
IE842643L (en) | 1985-04-17 |
JPS6085523A (ja) | 1985-05-15 |
JPS6233739B2 (de) | 1987-07-22 |
IE57546B1 (en) | 1992-10-21 |
EP0138602A2 (de) | 1985-04-24 |
US4610940A (en) | 1986-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |