DE3478729D1 - Process for forming elongated solder connections between a semiconductor device and a supporting substrate - Google Patents

Process for forming elongated solder connections between a semiconductor device and a supporting substrate

Info

Publication number
DE3478729D1
DE3478729D1 DE8484113328T DE3478729T DE3478729D1 DE 3478729 D1 DE3478729 D1 DE 3478729D1 DE 8484113328 T DE8484113328 T DE 8484113328T DE 3478729 T DE3478729 T DE 3478729T DE 3478729 D1 DE3478729 D1 DE 3478729D1
Authority
DE
Germany
Prior art keywords
semiconductor device
supporting substrate
solder connections
forming elongated
elongated solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484113328T
Other languages
English (en)
Inventor
Mark Neil Lakritz
Jose Ordonez
Peter Joseph Tubiola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3478729D1 publication Critical patent/DE3478729D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10135—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H01L2224/1705—Shape
    • H01L2224/17051—Bump connectors having different shapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/81139—Guiding structures on the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8484113328T 1983-11-25 1984-11-06 Process for forming elongated solder connections between a semiconductor device and a supporting substrate Expired DE3478729D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/555,264 US4545610A (en) 1983-11-25 1983-11-25 Method for forming elongated solder connections between a semiconductor device and a supporting substrate

Publications (1)

Publication Number Publication Date
DE3478729D1 true DE3478729D1 (en) 1989-07-20

Family

ID=24216611

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484113328T Expired DE3478729D1 (en) 1983-11-25 1984-11-06 Process for forming elongated solder connections between a semiconductor device and a supporting substrate

Country Status (4)

Country Link
US (1) US4545610A (de)
EP (1) EP0147576B1 (de)
JP (1) JPS60119737A (de)
DE (1) DE3478729D1 (de)

Families Citing this family (229)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US4661375A (en) * 1985-04-22 1987-04-28 At&T Technologies, Inc. Method for increasing the height of solder bumps
JPS61260648A (ja) * 1985-05-15 1986-11-18 Matsushita Electric Ind Co Ltd 半導体装置の実装方法
JPS629642A (ja) * 1985-07-05 1987-01-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4695861A (en) * 1985-10-21 1987-09-22 Honeywell Inc. Backside mosaic photoconductive infrared detector array
JPS6284973U (de) * 1985-11-19 1987-05-30
US4807021A (en) * 1986-03-10 1989-02-21 Kabushiki Kaisha Toshiba Semiconductor device having stacking structure
EP0248566A3 (de) * 1986-05-30 1990-01-31 AT&T Corp. Verfahren zur Kontrolle der Geometrie der Lötverbindung während der Montage eines Halbleiterbauelementes ohne Verdrahtung auf einer Substratoberfläche
GB2194387A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Bonding integrated circuit devices
EP0264648B1 (de) * 1986-09-25 1993-05-05 Kabushiki Kaisha Toshiba Verfahren zum Herstellen eines Filmträgers
DE3788263T2 (de) * 1986-09-25 1994-03-24 Toshiba Kawasaki Kk Verfahren zum elektrischen Verbinden von zwei Objekten.
US4760948A (en) * 1986-12-23 1988-08-02 Rca Corporation Leadless chip carrier assembly and method
US5170931A (en) * 1987-03-11 1992-12-15 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4845542A (en) * 1987-03-19 1989-07-04 Unisys Corporation Interconnect for layered integrated circuit assembly
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
US4912545A (en) * 1987-09-16 1990-03-27 Irvine Sensors Corporation Bonding of aligned conductive bumps on adjacent surfaces
US4803450A (en) * 1987-12-14 1989-02-07 General Electric Company Multilayer circuit board fabricated from silicon
US4980753A (en) * 1988-11-21 1990-12-25 Honeywell Inc. Low-cost high-performance semiconductor chip package
US5208186A (en) * 1989-02-09 1993-05-04 National Semiconductor Corporation Process for reflow bonding of bumps in IC devices
US4935627A (en) * 1989-03-13 1990-06-19 Honeywell Inc. Electrical interconnection apparatus for achieving precise alignment of hybrid components
GB2236217A (en) * 1989-08-23 1991-03-27 Itt Ind Ltd Improvement relating to electrical connectors
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
JP2805245B2 (ja) * 1989-08-28 1998-09-30 エルエスアイ ロジック コーポレーション フリップチップ構造
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5168346A (en) * 1989-08-28 1992-12-01 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US5056216A (en) * 1990-01-26 1991-10-15 Sri International Method of forming a plurality of solder connections
US6227436B1 (en) 1990-02-19 2001-05-08 Hitachi, Ltd. Method of fabricating an electronic circuit device and apparatus for performing the method
US6471115B1 (en) 1990-02-19 2002-10-29 Hitachi, Ltd. Process for manufacturing electronic circuit devices
US5251806A (en) * 1990-06-19 1993-10-12 International Business Machines Corporation Method of forming dual height solder interconnections
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5011066A (en) * 1990-07-27 1991-04-30 Motorola, Inc. Enhanced collapse solder interconnection
ZA915965B (en) * 1990-07-30 1992-04-29 South Africa Ind Dev Corp Attaching integrated circuits to circuit boards
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
FR2666173A1 (fr) * 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
US5233504A (en) * 1990-12-06 1993-08-03 Motorola, Inc. Noncollapsing multisolder interconnection
US5154341A (en) * 1990-12-06 1992-10-13 Motorola Inc. Noncollapsing multisolder interconnection
US5220200A (en) * 1990-12-10 1993-06-15 Delco Electronics Corporation Provision of substrate pillars to maintain chip standoff
US5157480A (en) * 1991-02-06 1992-10-20 Motorola, Inc. Semiconductor device having dual electrical contact sites
US5266520A (en) * 1991-02-11 1993-11-30 International Business Machines Corporation Electronic packaging with varying height connectors
US5148968A (en) * 1991-02-11 1992-09-22 Motorola, Inc. Solder bump stretch device
KR920022482A (ko) * 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
US5194137A (en) * 1991-08-05 1993-03-16 Motorola Inc. Solder plate reflow method for forming solder-bumped terminals
US5160409A (en) * 1991-08-05 1992-11-03 Motorola, Inc. Solder plate reflow method for forming a solder bump on a circuit trace intersection
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
JP2555811B2 (ja) * 1991-09-10 1996-11-20 富士通株式会社 半導体チップのフリップチップ接合方法
CA2077161A1 (en) * 1991-09-13 1993-03-14 Thomas W. Fitzgerald Method of establishing soldered connections
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
AU670922B2 (en) * 1992-01-28 1996-08-08 British Telecommunications Public Limited Company Alignment of integrated optical components
US5338208A (en) * 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
JP3215424B2 (ja) * 1992-03-24 2001-10-09 ユニシス・コーポレイション 微細自己整合特性を有する集積回路モジュール
US5269453A (en) * 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
US5324892A (en) * 1992-08-07 1994-06-28 International Business Machines Corporation Method of fabricating an electronic interconnection
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
JP2716336B2 (ja) * 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
US5329423A (en) * 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
US5767580A (en) * 1993-04-30 1998-06-16 Lsi Logic Corporation Systems having shaped, self-aligning micro-bump structures
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
JP3194553B2 (ja) * 1993-08-13 2001-07-30 富士通株式会社 半導体装置の製造方法
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
US5466635A (en) * 1994-06-02 1995-11-14 Lsi Logic Corporation Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US6486003B1 (en) * 1996-12-13 2002-11-26 Tessera, Inc. Expandable interposer for a microelectronic package and method therefor
US6848173B2 (en) 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5567648A (en) * 1994-08-29 1996-10-22 Motorola, Inc. Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
US5665989A (en) * 1995-01-03 1997-09-09 Lsi Logic Programmable microsystems in silicon
US5573171A (en) * 1995-02-16 1996-11-12 Trw Inc. Method of thin film patterning by reflow
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6030856A (en) * 1996-06-10 2000-02-29 Tessera, Inc. Bondable compliant pads for packaging of a semiconductor chip and method therefor
US6395991B1 (en) * 1996-07-29 2002-05-28 International Business Machines Corporation Column grid array substrate attachment with heat sink stress relief
JPH1070153A (ja) * 1996-08-26 1998-03-10 Hitachi Ltd 電子部品の接続方法
US5829668A (en) * 1996-09-03 1998-11-03 Motorola Corporation Method for forming solder bumps on bond pads
JP3553300B2 (ja) * 1996-12-02 2004-08-11 富士通株式会社 半導体装置の製造方法及び半導体装置の実装方法
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US5957370A (en) * 1997-01-10 1999-09-28 Integrated Device Technology, Inc. Plating process for fine pitch die in wafer form
US6330967B1 (en) 1997-03-13 2001-12-18 International Business Machines Corporation Process to produce a high temperature interconnection
US5859474A (en) * 1997-04-23 1999-01-12 Lsi Logic Corporation Reflow ball grid array assembly
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7819301B2 (en) * 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US7007833B2 (en) * 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
US6195268B1 (en) * 1997-06-09 2001-02-27 Floyd K. Eide Stacking layers containing enclosed IC chips
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6335222B1 (en) * 1997-09-18 2002-01-01 Tessera, Inc. Microelectronic packages with solder interconnections
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US5984164A (en) 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
US6059173A (en) 1998-03-05 2000-05-09 International Business Machines Corporation Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
US5923955A (en) * 1998-05-28 1999-07-13 Xerox Corporation Fine flip chip interconnection
US6070782A (en) * 1998-07-09 2000-06-06 International Business Machines Corporation Socketable bump grid array shaped-solder on copper spheres
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
WO2000021689A1 (en) * 1998-10-09 2000-04-20 The Trustees Of Princeton University Microscale patterning and articles formed thereby
US6713238B1 (en) * 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
SE523164C2 (sv) * 1999-05-17 2004-03-30 Ericsson Telefon Ab L M Monteringsarrangemang för halvledarelement med lödkulor för inriktning till mottagande yta
US6274474B1 (en) * 1999-10-25 2001-08-14 International Business Machines Corporation Method of forming BGA interconnections having mixed solder profiles
US6410861B1 (en) * 1999-12-03 2002-06-25 Motorola, Inc. Low profile interconnect structure
US6956878B1 (en) 2000-02-07 2005-10-18 Silicon Light Machines Corporation Method and apparatus for reducing laser speckle using polarization averaging
DE60108413T2 (de) 2000-11-10 2005-06-02 Unitive Electronics, Inc. Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US20030087477A1 (en) * 2001-05-02 2003-05-08 Tomohiro Kawashima Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same
KR100443504B1 (ko) * 2001-06-12 2004-08-09 주식회사 하이닉스반도체 볼 그리드 어레이 패키지 구조 및 그 제조방법
US6683375B2 (en) 2001-06-15 2004-01-27 Fairchild Semiconductor Corporation Semiconductor die including conductive columns
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6710264B2 (en) 2001-11-16 2004-03-23 Hewlett-Packard Development Company, L.P. Method and apparatus for supporting a circuit component having solder column interconnects using external support
US6809937B2 (en) 2001-11-16 2004-10-26 Hewlett-Packard Development Company, L.P. Method and apparatus for shock and vibration isolation of a circuit component
US6541710B1 (en) * 2001-11-16 2003-04-01 Hewlett-Packard Company Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns
US6813162B2 (en) * 2001-11-16 2004-11-02 Hewlett-Packard Development Company, L.P. Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6848177B2 (en) 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6600661B1 (en) 2002-04-08 2003-07-29 Hewlett-Packard Development Company, L.P. Method and apparatus for supporting a circuit component
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US6953956B2 (en) * 2002-12-18 2005-10-11 Easic Corporation Semiconductor device having borderless logic array and flexible I/O
US20040147169A1 (en) 2003-01-28 2004-07-29 Allison Jeffrey W. Power connector with safety feature
TWI225899B (en) 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US7239023B2 (en) * 2003-09-24 2007-07-03 Tai-Saw Technology Co., Ltd. Package assembly for electronic device
US7049216B2 (en) * 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US6890795B1 (en) * 2003-12-30 2005-05-10 Agency For Science, Technology And Research Wafer level super stretch solder
US7458839B2 (en) 2006-02-21 2008-12-02 Fci Americas Technology, Inc. Electrical connectors having power contacts with alignment and/or restraining features
WO2005065254A2 (en) 2003-12-31 2005-07-21 Fci Americas Technology, Inc. Electrical power contacts and connectors comprising same
US7095105B2 (en) * 2004-03-23 2006-08-22 Texas Instruments Incorporated Vertically stacked semiconductor device
TW200603698A (en) 2004-04-13 2006-01-16 Unitive International Ltd Methods of forming solder bumps on exposed metal pads and related structures
US7214104B2 (en) 2004-09-14 2007-05-08 Fci Americas Technology, Inc. Ball grid array connector
US7476108B2 (en) 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7226296B2 (en) * 2004-12-23 2007-06-05 Fci Americas Technology, Inc. Ball grid array contacts with spring action
US7384289B2 (en) 2005-01-31 2008-06-10 Fci Americas Technology, Inc. Surface-mount connector
US7303427B2 (en) 2005-04-05 2007-12-04 Fci Americas Technology, Inc. Electrical connector with air-circulation features
US7160757B2 (en) * 2005-04-25 2007-01-09 Intel Corporation Gap control between interposer and substrate in electronic assemblies
US20070040565A1 (en) * 2005-08-19 2007-02-22 National University of Singapore, Agency For Science, Technology and Research Compliant probes and test methodology for fine pitch wafer level devices and interconnects
US8957511B2 (en) * 2005-08-22 2015-02-17 Madhukar B. Vora Apparatus and methods for high-density chip connectivity
US7745301B2 (en) * 2005-08-22 2010-06-29 Terapede, Llc Methods and apparatus for high-density chip connectivity
US20070045807A1 (en) * 2005-09-01 2007-03-01 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US20080036100A1 (en) * 2006-05-17 2008-02-14 Tessera, Inc. Solder elements with columnar structures and methods of making the same
US7425145B2 (en) 2006-05-26 2008-09-16 Fci Americas Technology, Inc. Connectors and contacts for transmitting electrical power
US7726982B2 (en) 2006-06-15 2010-06-01 Fci Americas Technology, Inc. Electrical connectors with air-circulation features
TWI346826B (en) * 2006-10-26 2011-08-11 Taiwan Tft Lcd Ass Bonding structure and method of fabricating the same
US7641500B2 (en) 2007-04-04 2010-01-05 Fci Americas Technology, Inc. Power cable connector system
US7905731B2 (en) 2007-05-21 2011-03-15 Fci Americas Technology, Inc. Electrical connector with stress-distribution features
US7762857B2 (en) 2007-10-01 2010-07-27 Fci Americas Technology, Inc. Power connectors with contact-retention features
US8062051B2 (en) 2008-07-29 2011-11-22 Fci Americas Technology Llc Electrical communication system having latching and strain relief features
USD640637S1 (en) * 2009-01-16 2011-06-28 Fci Americas Technology Llc Vertical electrical connector
USD608293S1 (en) 2009-01-16 2010-01-19 Fci Americas Technology, Inc. Vertical electrical connector
USD606497S1 (en) 2009-01-16 2009-12-22 Fci Americas Technology, Inc. Vertical electrical connector
USD664096S1 (en) 2009-01-16 2012-07-24 Fci Americas Technology Llc Vertical electrical connector
USD610548S1 (en) 2009-01-16 2010-02-23 Fci Americas Technology, Inc. Right-angle electrical connector
USD619099S1 (en) 2009-01-30 2010-07-06 Fci Americas Technology, Inc. Electrical connector
US8323049B2 (en) 2009-01-30 2012-12-04 Fci Americas Technology Llc Electrical connector having power contacts
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
USD618180S1 (en) 2009-04-03 2010-06-22 Fci Americas Technology, Inc. Asymmetrical electrical connector
USD618181S1 (en) 2009-04-03 2010-06-22 Fci Americas Technology, Inc. Asymmetrical electrical connector
US8296940B2 (en) * 2010-04-19 2012-10-30 General Electric Company Method of forming a micro pin hybrid interconnect array
KR101712043B1 (ko) * 2010-10-14 2017-03-03 삼성전자주식회사 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법
US20120267779A1 (en) 2011-04-25 2012-10-25 Mediatek Inc. Semiconductor package
US10096540B2 (en) * 2011-05-13 2018-10-09 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
EP2624034A1 (de) 2012-01-31 2013-08-07 Fci Abbaubare optische Kupplungsvorrichtung
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US8970035B2 (en) * 2012-08-31 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
US8941236B2 (en) 2012-09-28 2015-01-27 Intel Corporation Using collapse limiter structures between elements to reduce solder bump bridging
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US20190206821A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Substrate assembly with spacer element
TWI736859B (zh) * 2019-03-18 2021-08-21 矽品精密工業股份有限公司 電子封裝件及其製法
DE102021103360A1 (de) * 2021-02-05 2022-08-11 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Verfahren zur Herstellung einer Vorverzinnungsanordnung und derartige Vorverzinnungsanordnung
CN113745169B (zh) * 2021-07-23 2023-10-24 中国电子科技集团公司第二十九研究所 多腔槽ltcc基板与封装盒体焊接结构及方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3401126A (en) * 1965-06-18 1968-09-10 Ibm Method of rendering noble metal conductive composition non-wettable by solder
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3621565A (en) * 1969-06-12 1971-11-23 Nasa Fabrication of single-crystal film semiconductor devices
US3871015A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform connector joints
US3591839A (en) * 1969-08-27 1971-07-06 Siliconix Inc Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US3997963A (en) * 1973-06-29 1976-12-21 Ibm Corporation Novel beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
FR2378354A1 (fr) * 1977-01-19 1978-08-18 Alsthom Atlantique Procede de fabrication de semiconducteurs de puissance a contacts presses
NL7704770A (nl) * 1977-05-02 1978-11-06 Philips Nv Werkwijze voor het aanbrengen van afstandstukjes op een isolerend substraat.
JPS5678356U (de) * 1979-11-12 1981-06-25
JPS58157146A (ja) * 1982-03-12 1983-09-19 Fujitsu Ltd 半導体装置
FR2612617B1 (fr) * 1987-03-16 1992-07-10 Bergounhon Rene Four pour deshydrater pulverulents, sables et granulats

Also Published As

Publication number Publication date
JPS60119737A (ja) 1985-06-27
EP0147576B1 (de) 1989-06-14
US4545610A (en) 1985-10-08
JPH0263301B2 (de) 1990-12-27
EP0147576A1 (de) 1985-07-10

Similar Documents

Publication Publication Date Title
DE3478729D1 (en) Process for forming elongated solder connections between a semiconductor device and a supporting substrate
EP0169574A3 (en) Apparatus for manufacturing semiconductor device
GB2163901B (en) A semiconductor integrated circuit device and a process for manufacturing such a device
DE3470253D1 (en) Method of manufacturing a semiconductor device having small dimensions
DE3379621D1 (en) Semiconductor integrated circuit device and a method for manufacturing the same
KR940009993B1 (en) Method and apparatus for bonding semiconductor substrates
DE3379297D1 (en) Substrate for semiconductor apparatus
GB8412110D0 (en) Apparatus for fabricating semiconductor devices
DE3464440D1 (en) An electrode for a semiconductor device
EP0146895A3 (en) Method of manufacturing semiconductor device
EP0187249A3 (en) Apparatus for producing semiconductor devices
HK84188A (en) Process of fabricating a semiconductor integrated circuit device
DE3276841D1 (en) Solder support pad for semiconductor devices
HK44686A (en) Semiconductor integrated circuit devices and a process for producing the same
GB2137809B (en) A ceramic package for semiconductor devices
SG77188G (en) A semiconductor integrated circuit device
EP0097796A3 (en) Process and apparatus for unsoldering solder bonded semiconductor devices
HK40490A (en) A semiconductor integrated circuit device
DE3571724D1 (en) Semiconductor device package for high frequencies
GB2212796B (en) Method and apparatus for manufacturing compound semiconductor single crystal
DE3279378D1 (en) Package for semiconductor device and method for its production
GB8418927D0 (en) Semiconductor manufacturing apparatus
HK41890A (en) Semiconductor device and fabrication process thereof
DE3464670D1 (en) A method for manufacturing a semiconductor device
GB2140929B (en) Process for making semiconductors devices

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee