JPS5678356U - - Google Patents
Info
- Publication number
- JPS5678356U JPS5678356U JP1979155903U JP15590379U JPS5678356U JP S5678356 U JPS5678356 U JP S5678356U JP 1979155903 U JP1979155903 U JP 1979155903U JP 15590379 U JP15590379 U JP 15590379U JP S5678356 U JPS5678356 U JP S5678356U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10165—Alignment aids
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- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/17515—Bump connectors having different functions
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- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/8114—Guiding structures outside the body
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81909—Post-treatment of the bump connector or bonding area
- H01L2224/8193—Reshaping
- H01L2224/81935—Reshaping by heating means, e.g. reflowing
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979155903U JPS5678356U (de) | 1979-11-12 | 1979-11-12 | |
GB8035586A GB2062963B (en) | 1979-11-12 | 1980-11-05 | Semiconductor chip mountings |
DE3042085A DE3042085C2 (de) | 1979-11-12 | 1980-11-07 | Halbleiteranordnung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979155903U JPS5678356U (de) | 1979-11-12 | 1979-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5678356U true JPS5678356U (de) | 1981-06-25 |
Family
ID=15616027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979155903U Pending JPS5678356U (de) | 1979-11-12 | 1979-11-12 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5678356U (de) |
DE (1) | DE3042085C2 (de) |
GB (1) | GB2062963B (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8122540U1 (de) * | 1981-07-31 | 1983-01-13 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "informationskarte mit integriertem baustein" |
JPS5873127A (ja) * | 1981-10-28 | 1983-05-02 | Hitachi Ltd | Icチツプのはんだ溶融接続方法 |
GB8324839D0 (en) * | 1983-09-16 | 1983-10-19 | Lucas Ind Plc | Mounting carrier for microelectronic silicon chip |
US4545610A (en) * | 1983-11-25 | 1985-10-08 | International Business Machines Corporation | Method for forming elongated solder connections between a semiconductor device and a supporting substrate |
GB2156153B (en) * | 1984-03-21 | 1988-02-24 | Pitney Bowes Inc | Alignment process for semiconductor chips |
GB8522429D0 (en) * | 1985-09-10 | 1985-10-16 | Plessey Co Plc | Alignment for hybrid device |
US4763829A (en) * | 1986-06-04 | 1988-08-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Soldering of electronic components |
GB2194387A (en) * | 1986-08-20 | 1988-03-02 | Plessey Co Plc | Bonding integrated circuit devices |
AU645283B2 (en) * | 1990-01-23 | 1994-01-13 | Sumitomo Electric Industries, Ltd. | Substrate for packaging a semiconductor device |
DE4003070A1 (de) * | 1990-02-02 | 1991-08-08 | Telefunken Electronic Gmbh | Verfahren zum aufloeten eines halbleiterkoerpers auf einen traegerkoerper |
US5311405A (en) * | 1993-08-02 | 1994-05-10 | Motorola, Inc. | Method and apparatus for aligning and attaching a surface mount component |
US6388203B1 (en) | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
WO1996031905A1 (en) | 1995-04-05 | 1996-10-10 | Mcnc | A solder bump structure for a microelectronic substrate |
EP0899787A3 (de) * | 1997-07-25 | 2001-05-16 | Mcnc | Knotrolliert geformte Lötreservoirszur Volumenerhöhung von Löthöckern und damit hergestellten Strukturen |
DE19738399A1 (de) * | 1997-09-03 | 1999-03-04 | Bosch Gmbh Robert | Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat |
DE19750073A1 (de) * | 1997-11-12 | 1999-05-20 | Bosch Gmbh Robert | Schaltungsträgerplatte |
EP1168429A1 (de) * | 2000-06-28 | 2002-01-02 | Telefonaktiebolaget L M Ericsson (Publ) | Integriertes Halbleiterchip und Verfahren, um dieses auf eine Leiterplatte zu montieren |
US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
AU2003256360A1 (en) | 2002-06-25 | 2004-01-06 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
US7049216B2 (en) | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
DE102005043910A1 (de) * | 2005-09-14 | 2007-03-15 | Weissbach, Ernst-A. | Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls |
US8026583B2 (en) | 2005-09-14 | 2011-09-27 | Htc Beteiligungs Gmbh | Flip-chip module and method for the production thereof |
US7932615B2 (en) | 2006-02-08 | 2011-04-26 | Amkor Technology, Inc. | Electronic devices including solder bumps on compliant dielectric layers |
US7674701B2 (en) | 2006-02-08 | 2010-03-09 | Amkor Technology, Inc. | Methods of forming metal layers using multi-layer lift-off patterns |
FR2918212B1 (fr) * | 2007-06-27 | 2009-09-25 | Fr De Detecteurs Infrarouges S | Procede pour la realisation d'une matrice de rayonnements electromagnetiques et procede pour remplacer un module elementaire d'une telle matrice de detection. |
DE102012105297A1 (de) * | 2012-06-19 | 2013-12-19 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Verbinden eines Bauteils mit einem Träger über eine Lötung und Bauteil zum Verbinden mit einem Träger |
JP6702019B2 (ja) * | 2016-06-22 | 2020-05-27 | 株式会社ジェイテクト | 半導体装置 |
US20230363295A1 (en) * | 2022-05-09 | 2023-11-09 | International Business Machines Corporation | Downstop and bump bonds formation on substrates |
WO2023218301A1 (en) * | 2022-05-09 | 2023-11-16 | International Business Machines Corporation | Electronic structure and method of manufacturing an electronic structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3871014A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform solder wettable areas on the substrate |
US3811186A (en) * | 1972-12-11 | 1974-05-21 | Ibm | Method of aligning and attaching circuit devices on a substrate |
-
1979
- 1979-11-12 JP JP1979155903U patent/JPS5678356U/ja active Pending
-
1980
- 1980-11-05 GB GB8035586A patent/GB2062963B/en not_active Expired
- 1980-11-07 DE DE3042085A patent/DE3042085C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2062963B (en) | 1984-05-23 |
DE3042085C2 (de) | 1984-09-13 |
DE3042085A1 (de) | 1981-06-04 |
GB2062963A (en) | 1981-05-28 |