DE3424232A1 - Flexible polyimid-mehrschicht-laminate - Google Patents

Flexible polyimid-mehrschicht-laminate

Info

Publication number
DE3424232A1
DE3424232A1 DE19843424232 DE3424232A DE3424232A1 DE 3424232 A1 DE3424232 A1 DE 3424232A1 DE 19843424232 DE19843424232 DE 19843424232 DE 3424232 A DE3424232 A DE 3424232A DE 3424232 A1 DE3424232 A1 DE 3424232A1
Authority
DE
Germany
Prior art keywords
polyimide
carrier material
layers
malleable
polyamic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843424232
Other languages
German (de)
English (en)
Inventor
Ernst F. Dipl.-Chem. 6127 Breuberg Kundiger
Jeffery Drake Tolland Conn. Lasher
Hans-Georg Dipl.-Ing. Dr. 8751 Kleinwallstadt Zengel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo Patente 5600 Wuppertal De GmbH
Original Assignee
Akzo GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo GmbH filed Critical Akzo GmbH
Priority to DE19843424232 priority Critical patent/DE3424232A1/de
Priority to DE8585107109T priority patent/DE3566483D1/de
Priority to AT85107109T priority patent/ATE38925T1/de
Priority to EP19850107109 priority patent/EP0167020B1/de
Priority to US06/746,887 priority patent/US4675246A/en
Priority to IE1541/85A priority patent/IE56861B1/en
Priority to PT8074185A priority patent/PT80741B/pt
Priority to NO852624A priority patent/NO852624L/no
Priority to ES544684A priority patent/ES8604451A1/es
Priority to GR851600A priority patent/GR851600B/el
Priority to DK293385A priority patent/DK293385A/da
Priority to CA000486009A priority patent/CA1239859A/en
Priority to JP60142680A priority patent/JPS6119352A/ja
Publication of DE3424232A1 publication Critical patent/DE3424232A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
DE19843424232 1984-06-30 1984-06-30 Flexible polyimid-mehrschicht-laminate Withdrawn DE3424232A1 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
DE19843424232 DE3424232A1 (de) 1984-06-30 1984-06-30 Flexible polyimid-mehrschicht-laminate
DE8585107109T DE3566483D1 (en) 1984-06-30 1985-06-10 Flexible polyimide multilayer laminate
AT85107109T ATE38925T1 (de) 1984-06-30 1985-06-10 Flexible polyimid-mehrschichtlaminate.
EP19850107109 EP0167020B1 (de) 1984-06-30 1985-06-10 Flexible Polyimid-Mehrschichtlaminate
US06/746,887 US4675246A (en) 1984-06-30 1985-06-20 Flexible multilayer polyimide laminates
IE1541/85A IE56861B1 (en) 1984-06-30 1985-06-20 Flexible multilayer polyimide laminates
PT8074185A PT80741B (de) 1984-06-30 1985-06-28 Flexible polyimid-mehrschichtlaminate
NO852624A NO852624L (no) 1984-06-30 1985-06-28 Fleksibelt polymid-flersjiktslaminat.
ES544684A ES8604451A1 (es) 1984-06-30 1985-06-28 Procedimiento para fabricar estratificados flexibles de va- rias capas
GR851600A GR851600B (ja) 1984-06-30 1985-06-28
DK293385A DK293385A (da) 1984-06-30 1985-06-28 Fleksibelt polyimid-flerlagslaminat
CA000486009A CA1239859A (en) 1984-06-30 1985-06-28 Flexible multilayer polyimide laminates
JP60142680A JPS6119352A (ja) 1984-06-30 1985-07-01 可撓性多層ラミネート及びその製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843424232 DE3424232A1 (de) 1984-06-30 1984-06-30 Flexible polyimid-mehrschicht-laminate

Publications (1)

Publication Number Publication Date
DE3424232A1 true DE3424232A1 (de) 1986-01-23

Family

ID=6239591

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843424232 Withdrawn DE3424232A1 (de) 1984-06-30 1984-06-30 Flexible polyimid-mehrschicht-laminate

Country Status (2)

Country Link
JP (1) JPS6119352A (ja)
DE (1) DE3424232A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3620601A1 (de) * 1986-06-19 1987-12-23 Akzo Gmbh Verfahren zur herstellung von polyimid-metall-laminaten
DE4118814A1 (de) * 1990-06-08 1991-12-19 Hitachi Ltd Verfahren und vorrichtung zum verkleben von mehrlagenplatten

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684060B2 (ja) * 1986-05-07 1994-10-26 三菱化成株式会社 硬化ポリイミド樹脂被覆物の製造方法
JP2621880B2 (ja) * 1987-09-25 1997-06-18 三井東圧化学株式会社 フレキシブル金属プラスチック積層板
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH01153875U (ja) * 1988-04-18 1989-10-23
JPH02180679A (ja) * 1988-12-29 1990-07-13 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板の製造方法
JPH0649185B2 (ja) * 1988-12-29 1994-06-29 新日鐵化学株式会社 フレキシブルプリント配線用基板の製造方法
JPH0693537B2 (ja) * 1989-09-19 1994-11-16 新日鐵化学株式会社 両面導体ポリイミド積層体の製造方法
JP2746555B2 (ja) * 1995-11-13 1998-05-06 新日鐵化学株式会社 フレキシブルプリント基板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221797B (de) * 1964-07-24 1966-07-28 Westinghouse Electric Corp Verfahren zur Herstellung von Polyimidschichtpressstoffen
US3486934A (en) * 1966-08-01 1969-12-30 Minnesota Mining & Mfg Process for the production of a metal-polyimide composite and the resulting article
DE2110247A1 (de) * 1970-03-12 1971-09-23 Gen Electric Metallaminatbauteile und Verfahren zu ihrer Herstellung
DE2063506A1 (de) * 1970-12-23 1972-07-06 Basf Ag Polyimide enthaltende Laminate
DE2345796A1 (de) * 1972-09-11 1974-03-21 Rhone Poulenc Sa Verbunderzeugnisse auf der basis von waermebestaendigen harzen
US3821054A (en) * 1971-10-19 1974-06-28 E Trostyanskaya Method of chemical bonding of polyimide polymers
EP0048315A2 (en) * 1980-09-22 1982-03-31 National Aeronautics And Space Administration Process for preparing high temperature polyimide film laminates
GB2101526A (en) * 1981-05-06 1983-01-19 Ube Industries Aromatic imide polymer laminate material and method for producing the same
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49129862A (ja) * 1973-04-20 1974-12-12
JPS5572095A (en) * 1978-11-25 1980-05-30 Kanegafuchi Chemical Ind Flexible printed circuit board
JPS56145871U (ja) * 1980-03-31 1981-11-04
JPS5752230A (en) * 1980-09-12 1982-03-27 Hitachi Ltd Driving system of semiconductor
JPS58190092A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221797B (de) * 1964-07-24 1966-07-28 Westinghouse Electric Corp Verfahren zur Herstellung von Polyimidschichtpressstoffen
US3486934A (en) * 1966-08-01 1969-12-30 Minnesota Mining & Mfg Process for the production of a metal-polyimide composite and the resulting article
GB1198856A (en) * 1966-08-01 1970-07-15 Minnesota Mining & Mfg Improvements in or relating to Laminates of Metal and Polyimide Resins
DE2110247A1 (de) * 1970-03-12 1971-09-23 Gen Electric Metallaminatbauteile und Verfahren zu ihrer Herstellung
DE2063506A1 (de) * 1970-12-23 1972-07-06 Basf Ag Polyimide enthaltende Laminate
US3821054A (en) * 1971-10-19 1974-06-28 E Trostyanskaya Method of chemical bonding of polyimide polymers
DE2345796A1 (de) * 1972-09-11 1974-03-21 Rhone Poulenc Sa Verbunderzeugnisse auf der basis von waermebestaendigen harzen
EP0048315A2 (en) * 1980-09-22 1982-03-31 National Aeronautics And Space Administration Process for preparing high temperature polyimide film laminates
GB2101526A (en) * 1981-05-06 1983-01-19 Ube Industries Aromatic imide polymer laminate material and method for producing the same
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CH-Z: Die Angewandte Makromolekulare Chemie 90, 1980,37-45, Nr.1378 *
DE-Z: Kunststoffe, Bd.60, 1970, S.401/402 *
US-Z: Die Macromolecular Reviews, Vol.11, Bd.11, 1976, S.161-208 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3620601A1 (de) * 1986-06-19 1987-12-23 Akzo Gmbh Verfahren zur herstellung von polyimid-metall-laminaten
DE4118814A1 (de) * 1990-06-08 1991-12-19 Hitachi Ltd Verfahren und vorrichtung zum verkleben von mehrlagenplatten

Also Published As

Publication number Publication date
JPH0525670B2 (ja) 1993-04-13
JPS6119352A (ja) 1986-01-28

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: AKZO PATENTE GMBH, 5600 WUPPERTAL, DE

8141 Disposal/no request for examination