DE3333601A1 - Drahtanschluss- bzw. verdrahtungsvorrichtung - Google Patents

Drahtanschluss- bzw. verdrahtungsvorrichtung

Info

Publication number
DE3333601A1
DE3333601A1 DE19833333601 DE3333601A DE3333601A1 DE 3333601 A1 DE3333601 A1 DE 3333601A1 DE 19833333601 DE19833333601 DE 19833333601 DE 3333601 A DE3333601 A DE 3333601A DE 3333601 A1 DE3333601 A1 DE 3333601A1
Authority
DE
Germany
Prior art keywords
signal
ultrasonic
capillary tube
tool
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833333601
Other languages
German (de)
English (en)
Other versions
DE3333601C2 (enExample
Inventor
Katsuhiko Kawasaki Aoyagi
Tomio Yokohama Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of DE3333601A1 publication Critical patent/DE3333601A1/de
Application granted granted Critical
Publication of DE3333601C2 publication Critical patent/DE3333601C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
DE19833333601 1982-09-16 1983-09-16 Drahtanschluss- bzw. verdrahtungsvorrichtung Granted DE3333601A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57161213A JPS5950536A (ja) 1982-09-16 1982-09-16 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
DE3333601A1 true DE3333601A1 (de) 1984-03-22
DE3333601C2 DE3333601C2 (enExample) 1987-11-26

Family

ID=15730755

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833333601 Granted DE3333601A1 (de) 1982-09-16 1983-09-16 Drahtanschluss- bzw. verdrahtungsvorrichtung

Country Status (3)

Country Link
US (1) US4571688A (enExample)
JP (1) JPS5950536A (enExample)
DE (1) DE3333601A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
WO1999019107A1 (de) * 1997-10-13 1999-04-22 Hesse & Knipps Gmbh Verfahren zur qualitätskontrolle
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880701152A (ko) * 1986-05-16 1988-07-25 파라사트 파하드 수동와이어 본딩장치
US4771930A (en) * 1986-06-30 1988-09-20 Kulicke And Soffa Industries Inc. Apparatus for supplying uniform tail lengths
US4824005A (en) * 1986-08-13 1989-04-25 Orthodyne Electronics Corporation Dual mode ultrasonic generator in a wire bonding apparatus
JPS63194343A (ja) * 1987-02-09 1988-08-11 Toshiba Corp ワイヤボンディング装置の制御方法
DE58906862D1 (de) * 1988-05-05 1994-03-17 Esec Sa Vorrichtung zur ultraschallkontaktierenden Drahtverbindung an elektronischen Komponenten.
US4817848A (en) * 1988-05-12 1989-04-04 Hughes Aircraft Company Compliant motion servo
JP2506958B2 (ja) * 1988-07-22 1996-06-12 松下電器産業株式会社 ワイヤボンディング装置
JPH0244745A (ja) * 1988-08-05 1990-02-14 Sharp Corp ワイヤボンディング方法
JPH088285B2 (ja) * 1990-02-23 1996-01-29 株式会社東芝 ワイヤボンディング方法
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
JP2665080B2 (ja) * 1991-08-02 1997-10-22 山形日本電気株式会社 半導体製造装置
ATE147672T1 (de) * 1991-10-30 1997-02-15 F&K Delvotec Bondtechnik Gmbh Steuerungssystem
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
TW334622B (en) * 1996-04-17 1998-06-21 Esec Sa Apparatus for making wire connections on semiconductor chips
US5871141A (en) * 1997-05-22 1999-02-16 Kulicke And Soffa, Investments, Inc. Fine pitch bonding tool for constrained bonding
US6564115B1 (en) * 2000-02-01 2003-05-13 Texas Instruments Incorporated Combined system, method and apparatus for wire bonding and testing
JP4456234B2 (ja) * 2000-07-04 2010-04-28 パナソニック株式会社 バンプ形成方法
TWI271247B (en) * 2003-03-21 2007-01-21 Esec Trading Sa Wire bonder
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
US10693524B2 (en) * 2018-03-16 2020-06-23 University Of Illinois System and method for mechanically-based magnetic-field transmitter
DE102021101654A1 (de) * 2021-01-26 2022-07-28 Hesse Gmbh Verfahren zum Betreiben einer Ultraschallverbindungsvorrichtung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784079A (en) * 1972-04-03 1974-01-08 Motorola Inc Ultrasonic bond control apparatus
DE2332230A1 (de) * 1973-06-25 1975-01-09 Hitachi Ltd Drahtbefestigungsvorrichtung
US4069961A (en) * 1975-12-23 1978-01-24 Esec Sales S.A. Contacting head for forming a wire connection on an integrated circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52102060A (en) * 1976-02-24 1977-08-26 Hitachi Ltd Method and device for detecting shapes of beveling and bead
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4409659A (en) * 1980-12-15 1983-10-11 Sonobond Ultrasonics, Inc. Programmable power supply for ultrasonic applications
US4438880A (en) * 1981-08-17 1984-03-27 Orthodyne Electronics Corporation Ultrasonic wire bond touchdown sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784079A (en) * 1972-04-03 1974-01-08 Motorola Inc Ultrasonic bond control apparatus
DE2332230A1 (de) * 1973-06-25 1975-01-09 Hitachi Ltd Drahtbefestigungsvorrichtung
US4069961A (en) * 1975-12-23 1978-01-24 Esec Sales S.A. Contacting head for forming a wire connection on an integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
WO1999019107A1 (de) * 1997-10-13 1999-04-22 Hesse & Knipps Gmbh Verfahren zur qualitätskontrolle
US6308881B1 (en) 1997-10-13 2001-10-30 Hesse & Knipps Gmbh Quality control method
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Also Published As

Publication number Publication date
JPH0131695B2 (enExample) 1989-06-27
JPS5950536A (ja) 1984-03-23
DE3333601C2 (enExample) 1987-11-26
US4571688A (en) 1986-02-18

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: HENKEL, G., DR.PHIL. FEILER, L., DR.RER.NAT. HAENZ

8127 New person/name/address of the applicant

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee