DE3319339A1 - Treiberanordnung fuer eine x-y-elektrodenmatrix - Google Patents
Treiberanordnung fuer eine x-y-elektrodenmatrixInfo
- Publication number
- DE3319339A1 DE3319339A1 DE19833319339 DE3319339A DE3319339A1 DE 3319339 A1 DE3319339 A1 DE 3319339A1 DE 19833319339 DE19833319339 DE 19833319339 DE 3319339 A DE3319339 A DE 3319339A DE 3319339 A1 DE3319339 A1 DE 3319339A1
- Authority
- DE
- Germany
- Prior art keywords
- switching elements
- substrate
- connections
- arrangement
- driver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract 1
- 238000005401 electroluminescence Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8118382U JPS58184861U (ja) | 1982-05-31 | 1982-05-31 | 回路基板の構造 |
JP58066266A JPS59191394A (ja) | 1983-04-13 | 1983-04-13 | 集積回路基板の製造方法及び製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3319339A1 true DE3319339A1 (de) | 1983-12-29 |
DE3319339C2 DE3319339C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-09 |
Family
ID=26407447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19833319339 Granted DE3319339A1 (de) | 1982-05-31 | 1983-05-27 | Treiberanordnung fuer eine x-y-elektrodenmatrix |
Country Status (2)
Country | Link |
---|---|
US (1) | US5137205A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
DE (1) | DE3319339A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4344293A1 (de) * | 1992-12-28 | 1994-07-07 | Mitsubishi Electric Corp | Sensorcharakteristik-Abgleichschaltung zum Abgleichen der Ausgangscharakteristik eines Halbleitersensors |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2321135B (en) * | 1997-01-11 | 2001-06-27 | Furse W J & Co Ltd | Improvements in or relating to thermal trip arrangements |
US6312265B1 (en) | 1999-08-27 | 2001-11-06 | Seagate Technology Llc | Double-sided single-print straddle mount assembly |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2734423A1 (de) * | 1976-07-30 | 1978-02-02 | Sharp Kk | Treiberschaltung fuer duennschicht-el- matrixanzeigen |
DE2748899A1 (de) * | 1977-11-02 | 1979-05-10 | John Anderson | Elektro-lumineszenter anzeigeschirm |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3296692A (en) * | 1963-09-13 | 1967-01-10 | Bell Telephone Labor Inc | Thermocompression wire attachments to quartz crystals |
US3387365A (en) * | 1965-09-28 | 1968-06-11 | John P. Stelmak | Method of making electrical connections to a miniature electronic component |
US3555364A (en) * | 1968-01-31 | 1971-01-12 | Drexel Inst Of Technology | Microelectronic modules and assemblies |
US3589591A (en) * | 1969-08-06 | 1971-06-29 | Ibm | Bonding apparatus |
US3705332A (en) * | 1970-06-25 | 1972-12-05 | Howard L Parks | Electrical circuit packaging structure and method of fabrication thereof |
US3914850A (en) * | 1973-11-05 | 1975-10-28 | Western Electric Co | Bonding of dissimilar workpieces to a substrate |
US3883945A (en) * | 1974-03-13 | 1975-05-20 | Mallory & Co Inc P R | Method for transferring and joining beam leaded chips |
US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
US4050618A (en) * | 1975-06-19 | 1977-09-27 | Angelucci Sr Thomas L | Flexible lead bonding apparatus |
US4345371A (en) * | 1979-03-14 | 1982-08-24 | Sony Corporation | Method and apparatus for manufacturing hybrid integrated circuits |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
DD153951A1 (de) * | 1980-10-30 | 1982-02-10 | Hermann Viehweger | Geloetete elektrische verbindungsstelle |
-
1983
- 1983-05-27 DE DE19833319339 patent/DE3319339A1/de active Granted
-
1991
- 1991-02-20 US US07/658,436 patent/US5137205A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2734423A1 (de) * | 1976-07-30 | 1978-02-02 | Sharp Kk | Treiberschaltung fuer duennschicht-el- matrixanzeigen |
DE2748899A1 (de) * | 1977-11-02 | 1979-05-10 | John Anderson | Elektro-lumineszenter anzeigeschirm |
Non-Patent Citations (2)
Title |
---|
DE-B.: H.Delfs: Hybridschaltungen, Stuttgart 1973,Verlag Berliner Union GmbH, S.97-99,106-111 * |
DE-Z.: Elektrotechnik 1973, H.5, S.12-15 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4344293A1 (de) * | 1992-12-28 | 1994-07-07 | Mitsubishi Electric Corp | Sensorcharakteristik-Abgleichschaltung zum Abgleichen der Ausgangscharakteristik eines Halbleitersensors |
DE4344293B4 (de) * | 1992-12-28 | 2005-12-22 | Mitsubishi Denki K.K. | Sensorcharakteristik-Abgleichschaltung zum Abgleichen der Ausgangscharakteristik eines Halbleitersensors |
Also Published As
Publication number | Publication date |
---|---|
DE3319339C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-09 |
US5137205A (en) | 1992-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |