DE3272398D1 - Miniature circuit processing devices and matrix test heads for use therein - Google Patents

Miniature circuit processing devices and matrix test heads for use therein

Info

Publication number
DE3272398D1
DE3272398D1 DE8383900099T DE3272398T DE3272398D1 DE 3272398 D1 DE3272398 D1 DE 3272398D1 DE 8383900099 T DE8383900099 T DE 8383900099T DE 3272398 T DE3272398 T DE 3272398T DE 3272398 D1 DE3272398 D1 DE 3272398D1
Authority
DE
Germany
Prior art keywords
processing devices
miniature circuit
circuit processing
test heads
matrix test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383900099T
Other languages
German (de)
English (en)
Inventor
Joseph Kvaternik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE3272398D1 publication Critical patent/DE3272398D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE8383900099T 1981-11-02 1982-11-01 Miniature circuit processing devices and matrix test heads for use therein Expired DE3272398D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/317,413 US4510445A (en) 1981-11-02 1981-11-02 Miniature circuit processing devices and matrix test heads for use therein
PCT/US1982/001544 WO1983001688A1 (en) 1981-11-02 1982-11-01 Miniature circuit processing devices and matrix test heads for use therein

Publications (1)

Publication Number Publication Date
DE3272398D1 true DE3272398D1 (en) 1986-09-04

Family

ID=23233534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383900099T Expired DE3272398D1 (en) 1981-11-02 1982-11-01 Miniature circuit processing devices and matrix test heads for use therein

Country Status (6)

Country Link
US (2) US4510445A (OSRAM)
EP (1) EP0093768B1 (OSRAM)
JP (2) JPS5880847A (OSRAM)
KR (1) KR860000227B1 (OSRAM)
DE (1) DE3272398D1 (OSRAM)
WO (1) WO1983001688A1 (OSRAM)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510445A (en) * 1981-11-02 1985-04-09 Joseph Kvaternik Miniature circuit processing devices and matrix test heads for use therein
JPS58120650U (ja) * 1982-02-09 1983-08-17 日本電子材料株式会社 プロ−ブカ−ド
JPS60142531A (ja) * 1983-12-28 1985-07-27 Yokowo Mfg Co Ltd 回路基板等の検査装置
ATE36197T1 (de) * 1985-09-16 1988-08-15 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten oder dergleichen.
US4727319A (en) * 1985-12-24 1988-02-23 Hughes Aircraft Company Apparatus for on-wafer testing of electrical circuits
US4878018A (en) * 1986-02-28 1989-10-31 Malloy James T Electrical testing device
JPS63274154A (ja) * 1987-04-29 1988-11-11 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン プローブ・カード装置
USH663H (en) 1988-01-13 1989-08-01 High density probe head for chip testing
US4935694A (en) * 1988-09-20 1990-06-19 Electro Scientific Industries, Inc. Probe card fixture
JPH0621849B2 (ja) * 1989-02-13 1994-03-23 工業技術院長 材料試験機用の導電性圧子
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
US5304921A (en) * 1991-08-07 1994-04-19 Hewlett-Packard Company Enhanced grounding system for short-wire lengthed fixture
US5175493A (en) * 1991-10-11 1992-12-29 Interconnect Devices, Inc. Shielded electrical contact spring probe assembly
JPH05215773A (ja) * 1992-02-04 1993-08-24 Nhk Spring Co Ltd 多点測定用導電性接触子ユニット
KR100248571B1 (ko) * 1992-08-31 2000-03-15 히가시 데쓰로 프로우브 장치
US5414369A (en) * 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US5493230A (en) * 1994-02-25 1996-02-20 Everett Charles Technologies, Inc. Retention of test probes in translator fixtures
US5546012A (en) * 1994-04-15 1996-08-13 International Business Machines Corporation Probe card assembly having a ceramic probe card
US5625299A (en) * 1995-02-03 1997-04-29 Uhling; Thomas F. Multiple lead analog voltage probe with high signal integrity over a wide band width
US6373268B1 (en) 1999-05-10 2002-04-16 Intel Corporation Test handling method and equipment for conjoined integrated circuit dice
US6331836B1 (en) * 2000-08-24 2001-12-18 Fast Location.Net, Llc Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path
US6512389B1 (en) * 2000-11-17 2003-01-28 Aql Manufacturing Services, Inc. Apparatus for use in an electronic component test interface having multiple printed circuit boards
AU2003220023A1 (en) 2002-03-05 2003-09-22 Rika Denshi America, Inc. Apparatus for interfacing electronic packages and test equipment
DE102005030551B3 (de) * 2005-06-22 2007-01-04 JHS Technik Josef Schäfer Vorrichtung zum Übertragen von elektrischen Signalen zwischen einem Tester und einem Prüfadapter
JP4859937B2 (ja) * 2009-01-21 2012-01-25 第一ビニール株式会社 植物支持用の二分割組立て方式のｕ型支柱及び該ｕ型支柱構成用の連結具
DE102010001152A1 (de) * 2010-01-22 2011-07-28 Robert Bosch GmbH, 70469 Elektronikvorrichtung und Herstellungsverfahren für eine Elektronikvorrichtung
US10096958B2 (en) * 2015-09-24 2018-10-09 Spire Manufacturing Inc. Interface apparatus for semiconductor testing and method of manufacturing same
US20170099536A1 (en) * 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Electroacoustic transducer with flexible coilwire connection
TW202349006A (zh) * 2022-06-01 2023-12-16 研鋐精密電子科技股份有限公司 探針頭及包含其之垂直式探針卡

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3185927A (en) * 1961-01-31 1965-05-25 Kulicke & Soffa Mfg Co Probe instrument for inspecting semiconductor wafers including means for marking defective zones
US3345567A (en) * 1964-02-26 1967-10-03 Kulicke And Soffa Mfg Company Multipoint probe apparatus for electrically testing multiple surface points within small zones
US3437929A (en) * 1965-08-05 1969-04-08 Electroglas Inc Automatically indexed probe assembly for testing semiconductor wafers and the like
US3334354A (en) * 1966-03-17 1967-08-01 Xerox Corp Dotting ink recorder
US3600057A (en) * 1969-04-17 1971-08-17 Raymond J Leffler Single slide microscopy apparatus
US3731191A (en) * 1969-12-22 1973-05-01 Ibm Micro-miniature probe assembly
US3768351A (en) * 1972-05-08 1973-10-30 Gte Automatic Electric Lab Inc Method and apparatus for forming holes in a material
JPS5040550U (OSRAM) * 1973-08-04 1975-04-24
US3930809A (en) * 1973-08-21 1976-01-06 Wentworth Laboratories, Inc. Assembly fixture for fixed point probe card
JPS51117877A (en) * 1975-04-09 1976-10-16 Seiko Epson Corp Automatic prober
US4035723A (en) * 1975-10-16 1977-07-12 Xynetics, Inc. Probe arm
DE2632989A1 (de) * 1976-07-22 1978-02-02 Hoechst Ag Verfahren zum regenerieren von schwefelsaeure
US4052793A (en) * 1976-10-04 1977-10-11 International Business Machines Corporation Method of obtaining proper probe alignment in a multiple contact environment
JPS5448486A (en) * 1977-09-26 1979-04-17 Matsushita Electric Ind Co Ltd Automatic measuring unit
JPS5456378A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Wafer prober apparatus
JPS5486962U (OSRAM) * 1977-11-29 1979-06-20
JPS6019145B2 (ja) * 1978-07-08 1985-05-14 日本電信電話株式会社 試料受け渡し装置
US4510445A (en) * 1981-11-02 1985-04-09 Joseph Kvaternik Miniature circuit processing devices and matrix test heads for use therein

Also Published As

Publication number Publication date
WO1983001688A1 (en) 1983-05-11
US4510445A (en) 1985-04-09
EP0093768A4 (en) 1984-06-13
JPH055377B2 (OSRAM) 1993-01-22
KR860000227B1 (ko) 1986-03-15
JPS63107038A (ja) 1988-05-12
JPS6253943B2 (OSRAM) 1987-11-12
US4544888A (en) 1985-10-01
EP0093768A1 (en) 1983-11-16
EP0093768B1 (en) 1986-07-30
JPS5880847A (ja) 1983-05-16
KR840002585A (ko) 1984-07-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee