DE3236493C1 - Schwalloetgeraet - Google Patents

Schwalloetgeraet

Info

Publication number
DE3236493C1
DE3236493C1 DE3236493A DE3236493A DE3236493C1 DE 3236493 C1 DE3236493 C1 DE 3236493C1 DE 3236493 A DE3236493 A DE 3236493A DE 3236493 A DE3236493 A DE 3236493A DE 3236493 C1 DE3236493 C1 DE 3236493C1
Authority
DE
Germany
Prior art keywords
pressure chamber
pressure
solder
compressed air
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3236493A
Other languages
German (de)
English (en)
Inventor
Haim 75239 Rishon-Lizion Shtalryd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SACHS ERSA KG
Original Assignee
SACHS ERSA KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SACHS ERSA KG filed Critical SACHS ERSA KG
Priority to DE3236493A priority Critical patent/DE3236493C1/de
Priority to AT83730090T priority patent/ATE16687T1/de
Priority to DE8383730090T priority patent/DE3361354D1/de
Priority to EP83730090A priority patent/EP0105832B1/de
Priority to AU19681/83A priority patent/AU560540B2/en
Priority to KR1019830004710A priority patent/KR840006434A/ko
Priority to JP58180928A priority patent/JPS59147772A/ja
Priority to CA000438075A priority patent/CA1217684A/en
Priority to IL69899A priority patent/IL69899A/xx
Application granted granted Critical
Publication of DE3236493C1 publication Critical patent/DE3236493C1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE3236493A 1982-09-30 1982-09-30 Schwalloetgeraet Expired DE3236493C1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE3236493A DE3236493C1 (de) 1982-09-30 1982-09-30 Schwalloetgeraet
DE8383730090T DE3361354D1 (en) 1982-09-30 1983-09-27 Wave soldering device
EP83730090A EP0105832B1 (de) 1982-09-30 1983-09-27 Schwallötgerät
AT83730090T ATE16687T1 (de) 1982-09-30 1983-09-27 Schwalloetgeraet.
AU19681/83A AU560540B2 (en) 1982-09-30 1983-09-28 Flood soldering device
KR1019830004710A KR840006434A (ko) 1982-09-30 1983-09-30 플루드 납땜장치
JP58180928A JPS59147772A (ja) 1982-09-30 1983-09-30 はんだ付け装置
CA000438075A CA1217684A (en) 1982-09-30 1983-09-30 Swell-soldering apparatus
IL69899A IL69899A (en) 1982-09-30 1983-10-04 Flood soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3236493A DE3236493C1 (de) 1982-09-30 1982-09-30 Schwalloetgeraet

Publications (1)

Publication Number Publication Date
DE3236493C1 true DE3236493C1 (de) 1983-11-03

Family

ID=6174739

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3236493A Expired DE3236493C1 (de) 1982-09-30 1982-09-30 Schwalloetgeraet
DE8383730090T Expired DE3361354D1 (en) 1982-09-30 1983-09-27 Wave soldering device

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8383730090T Expired DE3361354D1 (en) 1982-09-30 1983-09-27 Wave soldering device

Country Status (8)

Country Link
EP (1) EP0105832B1 (enExample)
JP (1) JPS59147772A (enExample)
KR (1) KR840006434A (enExample)
AT (1) ATE16687T1 (enExample)
AU (1) AU560540B2 (enExample)
CA (1) CA1217684A (enExample)
DE (2) DE3236493C1 (enExample)
IL (1) IL69899A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224865A (ja) * 1986-12-11 1988-09-19 ペイス　インコーポレイテッド 半田付けおよび／または半田外し装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198414A (en) * 1963-07-30 1965-08-03 Electrovert Mfg Co Ltd Molten solder bath with uniformly dispersed additive

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Also Published As

Publication number Publication date
CA1217684A (en) 1987-02-10
EP0105832B1 (de) 1985-11-27
IL69899A (en) 1985-12-31
JPS59147772A (ja) 1984-08-24
AU1968183A (en) 1984-04-05
AU560540B2 (en) 1987-04-09
KR840006434A (ko) 1984-11-29
DE3361354D1 (en) 1986-01-09
ATE16687T1 (de) 1985-12-15
JPS6343196B2 (enExample) 1988-08-29
EP0105832A1 (de) 1984-04-18

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee