DE3228311C2 - Verdampfertiegel für Vakuum-Aufdampfanlagen - Google Patents
Verdampfertiegel für Vakuum-AufdampfanlagenInfo
- Publication number
- DE3228311C2 DE3228311C2 DE3228311A DE3228311A DE3228311C2 DE 3228311 C2 DE3228311 C2 DE 3228311C2 DE 3228311 A DE3228311 A DE 3228311A DE 3228311 A DE3228311 A DE 3228311A DE 3228311 C2 DE3228311 C2 DE 3228311C2
- Authority
- DE
- Germany
- Prior art keywords
- cooling channel
- crucible
- guide device
- recess
- evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 13
- 230000008020 evaporation Effects 0.000 title claims abstract description 13
- 238000007738 vacuum evaporation Methods 0.000 title claims abstract 3
- 238000001816 cooling Methods 0.000 claims abstract description 58
- 239000002826 coolant Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 238000005192 partition Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D1/00—Evaporating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Crucibles And Fluidized-Bed Furnaces (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3228311A DE3228311C2 (de) | 1982-07-29 | 1982-07-29 | Verdampfertiegel für Vakuum-Aufdampfanlagen |
| CH2241/83A CH653372A5 (de) | 1982-07-29 | 1983-04-27 | Verdampfertiegel fuer vakuum-aufdampfanlagen. |
| US06/511,862 US4530100A (en) | 1982-07-29 | 1983-07-07 | Vaporizer crucible for vacuum vapor-deposition |
| GB08319337A GB2126255B (en) | 1982-07-29 | 1983-07-18 | Vaporizer crucible for vacuum vapour-deposition apparatus installations |
| JP58132021A JPS5938384A (ja) | 1982-07-29 | 1983-07-21 | 真空蒸着装置のための蒸発容器 |
| FR8312589A FR2531104B1 (fr) | 1982-07-29 | 1983-07-29 | Creuset de vaporisation pour installations de depot de materiaux vaporises sous vide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3228311A DE3228311C2 (de) | 1982-07-29 | 1982-07-29 | Verdampfertiegel für Vakuum-Aufdampfanlagen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3228311A1 DE3228311A1 (de) | 1984-02-02 |
| DE3228311C2 true DE3228311C2 (de) | 1984-07-05 |
Family
ID=6169602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3228311A Expired DE3228311C2 (de) | 1982-07-29 | 1982-07-29 | Verdampfertiegel für Vakuum-Aufdampfanlagen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4530100A (enExample) |
| JP (1) | JPS5938384A (enExample) |
| CH (1) | CH653372A5 (enExample) |
| DE (1) | DE3228311C2 (enExample) |
| FR (1) | FR2531104B1 (enExample) |
| GB (1) | GB2126255B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4866239A (en) * | 1988-05-31 | 1989-09-12 | The Boc Group, Inc. | Vapor source assembly with crucible |
| US5111022A (en) * | 1989-08-23 | 1992-05-05 | Tfi Telemark | Cooling system for electron beam gun and method |
| JPH0765163B2 (ja) * | 1991-09-30 | 1995-07-12 | 株式会社シンクロン | ハースライナおよび蒸着方法 |
| US5473627A (en) * | 1992-11-05 | 1995-12-05 | Mdc Vacuum Products Corporation | UHV rotating fluid delivery system |
| JP2008240305A (ja) * | 2007-03-27 | 2008-10-09 | Sanwa Shutter Corp | 建具枠の躯体取付金具および躯体取付構造 |
| DE102019104988A1 (de) * | 2019-02-27 | 2020-08-27 | VON ARDENNE Asset GmbH & Co. KG | Versorgungsvorrichtung, Verfahren und Prozessieranordnung |
| KR102761515B1 (ko) * | 2019-02-27 | 2025-02-04 | 삼성디스플레이 주식회사 | 증착원 증발 장치 및 그 제조방법 |
| EP4384648A1 (en) | 2021-08-12 | 2024-06-19 | Applied Materials, Inc. | Evaporator for effective surface area evaporation |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2060936A (en) * | 1936-02-15 | 1936-11-17 | Todd Comb Equipment Inc | Heat exchange means |
| NL259959A (enExample) * | 1960-02-03 | |||
| DE1262101C2 (de) * | 1962-12-15 | 1973-10-25 | Tiegel fuer die verdampfung von stoffen im vakuum mittels elektronenstrahlen, insbesondere zur bandbedampfung | |
| US3414655A (en) * | 1966-01-26 | 1968-12-03 | Nat Res Corp | Apparatus for evaporation of low temperature semiconductor material by electron beam impingement on the material and comprising means for draining electric charge from the material |
| US3360600A (en) * | 1966-07-13 | 1967-12-26 | Air Reduction | Vapor source assembly |
| DE3010925A1 (de) * | 1980-03-21 | 1981-10-01 | Albrecht G. Prof. Dr. 4600 Dortmund Fischer | Gallium-gekuehlte elektronenstrahl-drehtiegel-vakuum-aufdampfanlage |
-
1982
- 1982-07-29 DE DE3228311A patent/DE3228311C2/de not_active Expired
-
1983
- 1983-04-27 CH CH2241/83A patent/CH653372A5/de not_active IP Right Cessation
- 1983-07-07 US US06/511,862 patent/US4530100A/en not_active Expired - Fee Related
- 1983-07-18 GB GB08319337A patent/GB2126255B/en not_active Expired
- 1983-07-21 JP JP58132021A patent/JPS5938384A/ja active Granted
- 1983-07-29 FR FR8312589A patent/FR2531104B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB8319337D0 (en) | 1983-08-17 |
| DE3228311A1 (de) | 1984-02-02 |
| FR2531104B1 (fr) | 1989-07-28 |
| CH653372A5 (de) | 1985-12-31 |
| FR2531104A1 (fr) | 1984-02-03 |
| JPH032948B2 (enExample) | 1991-01-17 |
| JPS5938384A (ja) | 1984-03-02 |
| GB2126255A (en) | 1984-03-21 |
| GB2126255B (en) | 1985-09-04 |
| US4530100A (en) | 1985-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: LEYBOLD AG, 6450 HANAU, DE |
|
| 8339 | Ceased/non-payment of the annual fee |