DE3223851A1 - Vorrichtung zum galvanischem beschichten von werkstuecken - Google Patents
Vorrichtung zum galvanischem beschichten von werkstueckenInfo
- Publication number
- DE3223851A1 DE3223851A1 DE19823223851 DE3223851A DE3223851A1 DE 3223851 A1 DE3223851 A1 DE 3223851A1 DE 19823223851 DE19823223851 DE 19823223851 DE 3223851 A DE3223851 A DE 3223851A DE 3223851 A1 DE3223851 A1 DE 3223851A1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- power source
- workpieces
- nozzle
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011248 coating agent Substances 0.000 title description 7
- 238000000576 coating method Methods 0.000 title description 7
- 239000003792 electrolyte Substances 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000009713 electroplating Methods 0.000 claims description 19
- 239000008151 electrolyte solution Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 230000001154 acute effect Effects 0.000 claims 1
- 238000010992 reflux Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001944 Plastisol Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 239000004999 plastisol Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/277,191 US4394241A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
| US06/277,192 US4378282A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
| US06/277,190 US4378281A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3223851A1 true DE3223851A1 (de) | 1983-01-13 |
Family
ID=27402880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19823223851 Withdrawn DE3223851A1 (de) | 1981-06-25 | 1982-06-25 | Vorrichtung zum galvanischem beschichten von werkstuecken |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA1190514A (enrdf_load_stackoverflow) |
| DE (1) | DE3223851A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2508498A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2101159B (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19645875A1 (de) * | 1996-09-10 | 1998-03-12 | Stohrer Doduco Gmbh & Co | Verfahren und Vorrichtung zum Beschichten von tafelförmigen Elementen in einem elektrolytischen Bad |
| US6160196A (en) * | 1996-08-06 | 2000-12-12 | Beiersdorf Ag | Antimicrobial wound coverings |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933051A (en) * | 1989-07-24 | 1990-06-12 | Omi International Corporation | Cyanide-free copper plating process |
| DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
| DE102007026633B4 (de) * | 2007-06-06 | 2009-04-02 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware |
| CN113355721B (zh) * | 2021-06-29 | 2022-06-17 | 上海天承化学有限公司 | 一种电镀喷流系统 |
-
1982
- 1982-05-25 CA CA000403613A patent/CA1190514A/en not_active Expired
- 1982-06-03 GB GB08216175A patent/GB2101159B/en not_active Expired
- 1982-06-23 FR FR8210971A patent/FR2508498A1/fr active Granted
- 1982-06-25 DE DE19823223851 patent/DE3223851A1/de not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6160196A (en) * | 1996-08-06 | 2000-12-12 | Beiersdorf Ag | Antimicrobial wound coverings |
| DE19645875A1 (de) * | 1996-09-10 | 1998-03-12 | Stohrer Doduco Gmbh & Co | Verfahren und Vorrichtung zum Beschichten von tafelförmigen Elementen in einem elektrolytischen Bad |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2101159A (en) | 1983-01-12 |
| FR2508498A1 (fr) | 1982-12-31 |
| GB2101159B (en) | 1985-05-15 |
| CA1190514A (en) | 1985-07-16 |
| FR2508498B3 (enrdf_load_stackoverflow) | 1984-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |