GB2101159B - High speed plating of flat planar workpieces - Google Patents
High speed plating of flat planar workpiecesInfo
- Publication number
- GB2101159B GB2101159B GB08216175A GB8216175A GB2101159B GB 2101159 B GB2101159 B GB 2101159B GB 08216175 A GB08216175 A GB 08216175A GB 8216175 A GB8216175 A GB 8216175A GB 2101159 B GB2101159 B GB 2101159B
- Authority
- GB
- United Kingdom
- Prior art keywords
- high speed
- flat planar
- speed plating
- planar workpieces
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/277,190 US4378281A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
US06/277,192 US4378282A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
US06/277,191 US4394241A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2101159A GB2101159A (en) | 1983-01-12 |
GB2101159B true GB2101159B (en) | 1985-05-15 |
Family
ID=27402880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08216175A Expired GB2101159B (en) | 1981-06-25 | 1982-06-03 | High speed plating of flat planar workpieces |
Country Status (4)
Country | Link |
---|---|
CA (1) | CA1190514A (en) |
DE (1) | DE3223851A1 (en) |
FR (1) | FR2508498A1 (en) |
GB (1) | GB2101159B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4933051A (en) * | 1989-07-24 | 1990-06-12 | Omi International Corporation | Cyanide-free copper plating process |
DE19631421C2 (en) * | 1996-08-06 | 2002-07-18 | Beiersdorf Ag | Antimicrobial wound dressings |
DE19645875A1 (en) * | 1996-09-10 | 1998-03-12 | Stohrer Doduco Gmbh & Co | Electro plating of sheet workpieces |
DE102005039100A1 (en) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Device for holding or holding a plurality of substrates and electroplating device |
DE102007026633B4 (en) | 2007-06-06 | 2009-04-02 | Atotech Deutschland Gmbh | Apparatus and method for the electrolytic treatment of plate-shaped goods |
CN113355721B (en) * | 2021-06-29 | 2022-06-17 | 上海天承化学有限公司 | Electroplating jet system |
-
1982
- 1982-05-25 CA CA000403613A patent/CA1190514A/en not_active Expired
- 1982-06-03 GB GB08216175A patent/GB2101159B/en not_active Expired
- 1982-06-23 FR FR8210971A patent/FR2508498A1/en active Granted
- 1982-06-25 DE DE19823223851 patent/DE3223851A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2508498B3 (en) | 1984-04-27 |
GB2101159A (en) | 1983-01-12 |
DE3223851A1 (en) | 1983-01-13 |
CA1190514A (en) | 1985-07-16 |
FR2508498A1 (en) | 1982-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |