DE3177003D1 - Electronic circuit chip carrier - Google Patents
Electronic circuit chip carrierInfo
- Publication number
- DE3177003D1 DE3177003D1 DE8181104228T DE3177003T DE3177003D1 DE 3177003 D1 DE3177003 D1 DE 3177003D1 DE 8181104228 T DE8181104228 T DE 8181104228T DE 3177003 T DE3177003 T DE 3177003T DE 3177003 D1 DE3177003 D1 DE 3177003D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic circuit
- circuit chip
- chip carrier
- carrier
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/164,119 US4328530A (en) | 1980-06-30 | 1980-06-30 | Multiple layer, ceramic carrier for high switching speed VLSI chips |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3177003D1 true DE3177003D1 (en) | 1989-04-13 |
Family
ID=22593058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181104228T Expired DE3177003D1 (en) | 1980-06-30 | 1981-06-03 | Electronic circuit chip carrier |
Country Status (4)
Country | Link |
---|---|
US (1) | US4328530A (de) |
EP (1) | EP0042987B1 (de) |
JP (1) | JPS5728348A (de) |
DE (1) | DE3177003D1 (de) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4419714A (en) * | 1982-04-02 | 1983-12-06 | International Business Machines Corporation | Low inductance ceramic capacitor and method for its making |
US4430690A (en) * | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4498046A (en) * | 1982-10-18 | 1985-02-05 | International Business Machines Corporation | Room temperature cryogenic test interface |
EP0120500B1 (de) * | 1983-03-29 | 1989-08-16 | Nec Corporation | LSI Verpackung hoher Dichte für logische Schaltungen |
US4604678A (en) * | 1983-07-18 | 1986-08-05 | Frederick Parker | Circuit board with high density electrical tracers |
US4727410A (en) * | 1983-11-23 | 1988-02-23 | Cabot Technical Ceramics, Inc. | High density integrated circuit package |
US4996584A (en) * | 1985-01-31 | 1991-02-26 | Gould, Inc. | Thin-film electrical connections for integrated circuits |
US4768038A (en) * | 1985-05-17 | 1988-08-30 | Konishiroku Photo Industry Co., Ltd. | Thermal printhead integrated circuit device |
FR2591801B1 (fr) * | 1985-12-17 | 1988-10-14 | Inf Milit Spatiale Aeronaut | Boitier d'encapsulation d'un circuit electronique |
US4922378A (en) * | 1986-08-01 | 1990-05-01 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
US5031072A (en) * | 1986-08-01 | 1991-07-09 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
DE3677601D1 (de) * | 1986-08-22 | 1991-03-28 | Ibm Deutschland | Integriertes verdrahtungssystem fuer sehr hochintegrierte schaltungen. |
US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
US4907068A (en) * | 1987-01-21 | 1990-03-06 | Siemens Aktiengesellschaft | Semiconductor arrangement having at least one semiconductor body |
FR2616963B1 (fr) * | 1987-06-19 | 1991-02-08 | Thomson Composants Militaires | Boitier ceramique multicouches |
JPH0754780B2 (ja) * | 1987-08-10 | 1995-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
US4878155A (en) * | 1987-09-25 | 1989-10-31 | Conley Larry R | High speed discrete wire pin panel assembly with embedded capacitors |
JPH0158909U (de) * | 1987-10-08 | 1989-04-13 | ||
US4889962A (en) * | 1988-08-19 | 1989-12-26 | Northern Telecom Limited | Circuit board with coaxial circuit and method therefor |
EP0359513A3 (de) * | 1988-09-14 | 1990-12-19 | Hitachi, Ltd. | Halbleiterchipträger und Verfahren zu dessen Herstellung |
US4916576A (en) * | 1989-02-27 | 1990-04-10 | Fmtt, Inc. | Matrix capacitor |
US4862318A (en) * | 1989-04-04 | 1989-08-29 | Avx Corporation | Method of forming thin film terminations of low inductance ceramic capacitors and resultant article |
USRE34395E (en) * | 1989-06-15 | 1993-10-05 | Cray Research, Inc. | Method of making a chip carrier with terminating resistive elements |
US4949453A (en) * | 1989-06-15 | 1990-08-21 | Cray Research, Inc. | Method of making a chip carrier with terminating resistive elements |
US5258576A (en) * | 1989-06-15 | 1993-11-02 | Cray Research, Inc. | Integrated circuit chip carrier lid |
JPH03125444A (ja) * | 1989-10-09 | 1991-05-28 | Chisso Corp | 改良されたフィルムキャリヤー |
US5068715A (en) * | 1990-06-29 | 1991-11-26 | Digital Equipment Corporation | High-power, high-performance integrated circuit chip package |
US5132613A (en) * | 1990-11-30 | 1992-07-21 | International Business Machines Corporation | Low inductance side mount decoupling test structure |
US5177594A (en) * | 1991-01-09 | 1993-01-05 | International Business Machines Corporation | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
US5177670A (en) * | 1991-02-08 | 1993-01-05 | Hitachi, Ltd. | Capacitor-carrying semiconductor module |
US5331505A (en) * | 1993-01-08 | 1994-07-19 | Honeywell Inc. | Multi-coplanar capacitor for electrical connector |
US5767443A (en) * | 1993-07-10 | 1998-06-16 | Micron Technology, Inc. | Multi-die encapsulation device |
US5841074A (en) * | 1996-03-12 | 1998-11-24 | International Business Machines Corporation | Backplane power distribution system having impedance variations in the form of spaced voids |
US6727435B1 (en) * | 1996-03-12 | 2004-04-27 | International Business Machines Corporation | Backplane power distribution system |
US6252302B1 (en) | 1996-09-19 | 2001-06-26 | Warren M. Farnworth | Heat transfer material for an improved die edge contacting socket |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US5880925A (en) | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
JP2991175B2 (ja) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
US6292350B1 (en) | 1997-11-10 | 2001-09-18 | Murata Manufacturing, Co., Ltd | Multilayer capacitor |
US6266229B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6266228B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6549395B1 (en) | 1997-11-14 | 2003-04-15 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6011683A (en) * | 1997-12-29 | 2000-01-04 | Texas Instruments Incorporated | Thin multilayer ceramic capacitors |
JP3792445B2 (ja) | 1999-03-30 | 2006-07-05 | 日本特殊陶業株式会社 | コンデンサ付属配線基板 |
JP3548821B2 (ja) | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路 |
JP3476127B2 (ja) | 1999-05-10 | 2003-12-10 | 株式会社村田製作所 | 積層コンデンサ |
US6327134B1 (en) | 1999-10-18 | 2001-12-04 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor, wiring board, and high-frequency circuit |
JP3489729B2 (ja) | 1999-11-19 | 2004-01-26 | 株式会社村田製作所 | 積層コンデンサ、配線基板、デカップリング回路および高周波回路 |
JP2001185442A (ja) * | 1999-12-27 | 2001-07-06 | Murata Mfg Co Ltd | 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板 |
US6801422B2 (en) * | 1999-12-28 | 2004-10-05 | Intel Corporation | High performance capacitor |
US6724611B1 (en) | 2000-03-29 | 2004-04-20 | Intel Corporation | Multi-layer chip capacitor |
US6964584B2 (en) * | 2001-12-21 | 2005-11-15 | Intel Corporation | Low impedance, high-power socket and method of using |
US6768650B2 (en) * | 2002-02-07 | 2004-07-27 | International Business Machines Corporation | Method and structure for reduction of impedance using decoupling capacitor |
US6845492B1 (en) * | 2003-02-13 | 2005-01-18 | Hewlett-Packard Development Company, L.P. | Signal via impedance adjustment tool |
US7081650B2 (en) * | 2003-03-31 | 2006-07-25 | Intel Corporation | Interposer with signal and power supply through vias |
JP4059181B2 (ja) * | 2003-09-29 | 2008-03-12 | 株式会社村田製作所 | 多端子型積層セラミック電子部品の製造方法 |
ATE355597T1 (de) * | 2003-12-05 | 2006-03-15 | Ngk Spark Plug Co | Kondensator und verfahren zu seiner herstellung |
JP4658576B2 (ja) * | 2003-12-05 | 2011-03-23 | 日本特殊陶業株式会社 | コンデンサとその製造方法 |
US7630188B2 (en) | 2005-03-01 | 2009-12-08 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
JP5279488B2 (ja) * | 2005-05-30 | 2013-09-04 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | ケーシング本体およびケーシング本体の製造方法 |
FR2893448A1 (fr) * | 2005-11-15 | 2007-05-18 | St Microelectronics Sa | Dispositif semi-conducteur a plusieurs puces de circuits integres assemblees et procede d'assemblage et de connexion electrique de puces de circuits integres |
US9138250B2 (en) * | 2006-04-24 | 2015-09-22 | Ethicon Endo-Surgery, Inc. | Medical instrument handle and medical instrument having a handle |
JP4795861B2 (ja) * | 2006-06-15 | 2011-10-19 | 日本特殊陶業株式会社 | コンデンサ、配線基板 |
US20080128854A1 (en) * | 2006-12-04 | 2008-06-05 | Augustine Anne E | Embedded array capacitor with top and bottom exterior surface metallization |
US7898818B2 (en) * | 2007-03-07 | 2011-03-01 | Dell Products, Lp | Variably orientated capacitive elements for printed circuit boards and method of manufacturing same |
TWI358120B (en) * | 2008-07-04 | 2012-02-11 | Gigno Technology Co Ltd | Semiconductor chip module and manufacturing method |
KR101221869B1 (ko) * | 2009-08-31 | 2013-01-15 | 한국전자통신연구원 | 반도체 패키지 및 그 제조 방법 |
US9468090B2 (en) * | 2012-10-29 | 2016-10-11 | Cisco Technology, Inc. | Current redistribution in a printed circuit board |
US9093295B2 (en) | 2013-11-13 | 2015-07-28 | Qualcomm Incorporated | Embedded sheet capacitor |
JP6418099B2 (ja) * | 2014-09-01 | 2018-11-07 | 株式会社村田製作所 | 電子部品内蔵基板 |
US9343398B2 (en) * | 2014-09-26 | 2016-05-17 | Invensas Corporation | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail |
US11489038B2 (en) * | 2017-08-29 | 2022-11-01 | Micron Technology, Inc. | Capacitors having vertical contacts extending through conductive tiers |
US10796212B2 (en) * | 2018-10-02 | 2020-10-06 | Xerox Corporation | Orientation-agnostic method to interface to printed memory label |
US11158580B2 (en) | 2019-10-18 | 2021-10-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices with backside power distribution network and frontside through silicon via |
KR20210085848A (ko) * | 2019-12-31 | 2021-07-08 | 삼성전기주식회사 | 적층형 전자 부품 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1000032A (en) * | 1960-10-07 | 1965-08-04 | Walter Schick | Improvements relating to electrical capacitors |
US3290756A (en) * | 1962-08-15 | 1966-12-13 | Hughes Aircraft Co | Method of assembling and interconnecting electrical components |
US3312870A (en) * | 1964-03-13 | 1967-04-04 | Hughes Aircraft Co | Electrical transmission system |
US3356786A (en) * | 1964-10-07 | 1967-12-05 | Texas Instruments Inc | Modular circuit boards |
US3663866A (en) * | 1970-03-27 | 1972-05-16 | Rogers Corp | Back plane |
US3983458A (en) * | 1971-07-21 | 1976-09-28 | Corning Glass Works | Electrical device assembly and method |
US3880493A (en) * | 1973-12-28 | 1975-04-29 | Burroughs Corp | Capacitor socket for a dual-in-line package |
US3896354A (en) * | 1974-07-02 | 1975-07-22 | Sprague Electric Co | Monolithic ceramic capacitor |
US3992761A (en) * | 1974-11-22 | 1976-11-23 | Trw Inc. | Method of making multi-layer capacitors |
US4059849A (en) * | 1974-12-16 | 1977-11-22 | Westinghouse Electric Corporation | Interconnected module |
US4222090A (en) * | 1977-11-25 | 1980-09-09 | Jaffe Richard A | Micromodular electronic package |
DE2915240A1 (de) * | 1978-06-28 | 1980-01-03 | Mitsumi Electric Co | Gedruckte schaltung |
US4237522A (en) * | 1979-06-29 | 1980-12-02 | International Business Machines Corporation | Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate |
-
1980
- 1980-06-30 US US06/164,119 patent/US4328530A/en not_active Expired - Lifetime
-
1981
- 1981-05-29 JP JP8123881A patent/JPS5728348A/ja active Granted
- 1981-06-03 DE DE8181104228T patent/DE3177003D1/de not_active Expired
- 1981-06-03 EP EP81104228A patent/EP0042987B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4328530A (en) | 1982-05-04 |
EP0042987A3 (en) | 1984-12-19 |
JPS5756217B2 (de) | 1982-11-29 |
EP0042987B1 (de) | 1989-03-08 |
JPS5728348A (en) | 1982-02-16 |
EP0042987A2 (de) | 1982-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |