ATE355597T1 - Kondensator und verfahren zu seiner herstellung - Google Patents
Kondensator und verfahren zu seiner herstellungInfo
- Publication number
- ATE355597T1 ATE355597T1 AT04028749T AT04028749T ATE355597T1 AT E355597 T1 ATE355597 T1 AT E355597T1 AT 04028749 T AT04028749 T AT 04028749T AT 04028749 T AT04028749 T AT 04028749T AT E355597 T1 ATE355597 T1 AT E355597T1
- Authority
- AT
- Austria
- Prior art keywords
- laminate
- thickness
- ceramic layer
- ceramic
- capacitor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003407327 | 2003-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE355597T1 true ATE355597T1 (de) | 2006-03-15 |
Family
ID=34464022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04028749T ATE355597T1 (de) | 2003-12-05 | 2004-12-03 | Kondensator und verfahren zu seiner herstellung |
Country Status (5)
Country | Link |
---|---|
US (2) | US7072169B2 (de) |
EP (1) | EP1538639B1 (de) |
CN (1) | CN100580829C (de) |
AT (1) | ATE355597T1 (de) |
DE (1) | DE602004004983T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10217565A1 (de) * | 2002-04-19 | 2003-11-13 | Infineon Technologies Ag | Halbleiterbauelement mit integrierter gitterförmiger Kapazitätsstruktur |
EP1538640B1 (de) * | 2003-12-05 | 2016-11-16 | NGK Spark Plug Co., Ltd. | Kondensator und Verfahren zu seiner Herstellung |
KR101046890B1 (ko) * | 2005-06-15 | 2011-07-06 | 이비덴 가부시키가이샤 | 다층 프린트 배선판 |
JP4854345B2 (ja) * | 2006-03-16 | 2012-01-18 | 富士通株式会社 | コンデンサシート及び電子回路基板 |
WO2008018870A1 (en) * | 2006-08-09 | 2008-02-14 | Geomat Insights, Llc | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit |
JP4844487B2 (ja) * | 2006-08-09 | 2011-12-28 | 株式会社村田製作所 | 積層コンデンサ、回路基板、回路モジュール及び積層コンデンサの製造方法 |
US8713769B2 (en) * | 2007-03-10 | 2014-05-06 | Sanmina-Sci Corporation | Embedded capacitive stack |
US7911802B2 (en) * | 2007-04-06 | 2011-03-22 | Ibiden Co., Ltd. | Interposer, a method for manufacturing the same and an electronic circuit package |
KR101596460B1 (ko) * | 2011-10-01 | 2016-02-26 | 인텔 코포레이션 | 온-칩 커패시터 및 그 조립 방법 |
US9269968B2 (en) * | 2012-02-03 | 2016-02-23 | University Of Washington Through Its Center For Commercialization | Methods and devices for generating electricity from a fuel and an oxidant using a capacitor |
US20130215586A1 (en) * | 2012-02-16 | 2013-08-22 | Ibiden Co., Ltd. | Wiring substrate |
US9293521B2 (en) * | 2012-03-02 | 2016-03-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Concentric capacitor structure |
US9159718B2 (en) * | 2013-03-08 | 2015-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Switched capacitor structure |
KR101309326B1 (ko) | 2012-05-30 | 2013-09-16 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101548813B1 (ko) * | 2013-11-06 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
JP2016162904A (ja) * | 2015-03-03 | 2016-09-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
KR102620521B1 (ko) * | 2019-07-05 | 2024-01-03 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
CN110323061A (zh) * | 2019-07-10 | 2019-10-11 | 南方科技大学 | 具有多种烧制模式的三维模组 |
US10984957B1 (en) * | 2019-12-03 | 2021-04-20 | International Business Machines Corporation | Printed circuit board embedded capacitor |
US11450484B2 (en) * | 2019-12-27 | 2022-09-20 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4328530A (en) * | 1980-06-30 | 1982-05-04 | International Business Machines Corporation | Multiple layer, ceramic carrier for high switching speed VLSI chips |
MY120414A (en) * | 1995-10-03 | 2005-10-31 | Tdk Corp | Multilayer ceramic capacitor |
JPH10261546A (ja) * | 1997-03-19 | 1998-09-29 | Murata Mfg Co Ltd | 積層コンデンサ |
US5880925A (en) * | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
JPH11204372A (ja) | 1997-11-14 | 1999-07-30 | Murata Mfg Co Ltd | 積層コンデンサ |
EP0917165B1 (de) * | 1997-11-14 | 2007-04-11 | Murata Manufacturing Co., Ltd. | Vielschichtkondensator |
US6549395B1 (en) | 1997-11-14 | 2003-04-15 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6678927B1 (en) * | 1997-11-24 | 2004-01-20 | Avx Corporation | Miniature surface mount capacitor and method of making same |
JP3476127B2 (ja) * | 1999-05-10 | 2003-12-10 | 株式会社村田製作所 | 積層コンデンサ |
JP2001185442A (ja) * | 1999-12-27 | 2001-07-06 | Murata Mfg Co Ltd | 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板 |
US6346743B1 (en) * | 2000-06-30 | 2002-02-12 | Intel Corp. | Embedded capacitor assembly in a package |
JP2002359141A (ja) | 2001-05-31 | 2002-12-13 | Ngk Spark Plug Co Ltd | 積層電子部品の製造方法 |
JP2002359149A (ja) * | 2001-05-31 | 2002-12-13 | Ngk Spark Plug Co Ltd | 積層電子部品の製造方法 |
JP2003068571A (ja) * | 2001-08-27 | 2003-03-07 | Nec Corp | 可変コンデンサおよび可変インダクタ並びにそれらを備えた高周波回路モジュール |
JP2003158030A (ja) | 2001-11-20 | 2003-05-30 | Ngk Spark Plug Co Ltd | 積層電子部品の製法 |
US6606237B1 (en) * | 2002-06-27 | 2003-08-12 | Murata Manufacturing Co., Ltd. | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
JP4548571B2 (ja) * | 2002-10-08 | 2010-09-22 | 日本特殊陶業株式会社 | 積層コンデンサの製造方法 |
JP4458812B2 (ja) | 2002-10-30 | 2010-04-28 | 京セラ株式会社 | コンデンサ、コンデンサの製造方法、配線基板、デカップリング回路及び高周波回路 |
-
2004
- 2004-12-03 AT AT04028749T patent/ATE355597T1/de not_active IP Right Cessation
- 2004-12-03 DE DE602004004983T patent/DE602004004983T2/de active Active
- 2004-12-03 EP EP04028749A patent/EP1538639B1/de not_active Not-in-force
- 2004-12-06 US US11/003,767 patent/US7072169B2/en not_active Expired - Fee Related
- 2004-12-06 CN CN200410097920A patent/CN100580829C/zh not_active Expired - Fee Related
-
2006
- 2006-06-28 US US11/475,891 patent/US7233480B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7233480B2 (en) | 2007-06-19 |
DE602004004983T2 (de) | 2007-10-31 |
US20060245142A1 (en) | 2006-11-02 |
US7072169B2 (en) | 2006-07-04 |
US20050122662A1 (en) | 2005-06-09 |
CN100580829C (zh) | 2010-01-13 |
EP1538639B1 (de) | 2007-02-28 |
EP1538639A2 (de) | 2005-06-08 |
EP1538639A3 (de) | 2005-12-14 |
CN1624829A (zh) | 2005-06-08 |
DE602004004983D1 (de) | 2007-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |