DE3125360A1 - "elektronisches bauelement" - Google Patents

"elektronisches bauelement"

Info

Publication number
DE3125360A1
DE3125360A1 DE19813125360 DE3125360A DE3125360A1 DE 3125360 A1 DE3125360 A1 DE 3125360A1 DE 19813125360 DE19813125360 DE 19813125360 DE 3125360 A DE3125360 A DE 3125360A DE 3125360 A1 DE3125360 A1 DE 3125360A1
Authority
DE
Germany
Prior art keywords
housing
welds
electronic component
protect
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813125360
Other languages
German (de)
English (en)
Other versions
DE3125360C2 (enExample
Inventor
Manfred Dipl.-Ing. 7141 Schwieberdingen Frister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19813125360 priority Critical patent/DE3125360A1/de
Priority to FR8209403A priority patent/FR2508705B1/fr
Priority to JP57108598A priority patent/JPS586153A/ja
Priority to ES1982273620U priority patent/ES273620Y/es
Publication of DE3125360A1 publication Critical patent/DE3125360A1/de
Application granted granted Critical
Publication of DE3125360C2 publication Critical patent/DE3125360C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE19813125360 1981-06-27 1981-06-27 "elektronisches bauelement" Granted DE3125360A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19813125360 DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"
FR8209403A FR2508705B1 (fr) 1981-06-27 1982-05-28 Composant electronique a inserer dans un dispositif de branchement
JP57108598A JPS586153A (ja) 1981-06-27 1982-06-25 電子部品
ES1982273620U ES273620Y (es) 1981-06-27 1982-06-25 Componente electronico del tipo insertado en una carcasa.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813125360 DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"

Publications (2)

Publication Number Publication Date
DE3125360A1 true DE3125360A1 (de) 1983-01-13
DE3125360C2 DE3125360C2 (enExample) 1989-11-30

Family

ID=6135531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813125360 Granted DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"

Country Status (4)

Country Link
JP (1) JPS586153A (enExample)
DE (1) DE3125360A1 (enExample)
ES (1) ES273620Y (enExample)
FR (1) FR2508705B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185380A (ja) * 1989-12-14 1991-08-13 Furuno Electric Co Ltd 水中探知装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1369793A (fr) * 1962-09-21 1964-08-14 Westinghouse Electric Corp Dispositif semi-conducteur étanche
JPS432111Y1 (enExample) * 1964-05-23 1968-01-29
JPS5128829B1 (enExample) * 1968-10-21 1976-08-21
JPS4853256U (enExample) * 1971-10-26 1973-07-10
JPS502506U (enExample) * 1973-05-08 1975-01-11
JPS5093566A (enExample) * 1973-12-20 1975-07-25
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package

Also Published As

Publication number Publication date
FR2508705A1 (fr) 1982-12-31
ES273620U (es) 1984-03-01
DE3125360C2 (enExample) 1989-11-30
FR2508705B1 (fr) 1985-12-27
ES273620Y (es) 1984-10-01
JPH0558260B2 (enExample) 1993-08-26
JPS586153A (ja) 1983-01-13

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