JPH0558260B2 - - Google Patents

Info

Publication number
JPH0558260B2
JPH0558260B2 JP57108598A JP10859882A JPH0558260B2 JP H0558260 B2 JPH0558260 B2 JP H0558260B2 JP 57108598 A JP57108598 A JP 57108598A JP 10859882 A JP10859882 A JP 10859882A JP H0558260 B2 JPH0558260 B2 JP H0558260B2
Authority
JP
Japan
Prior art keywords
casing
socket plate
electronic component
welding
additional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57108598A
Other languages
English (en)
Japanese (ja)
Other versions
JPS586153A (ja
Inventor
Furisutaa Manfuretsudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS586153A publication Critical patent/JPS586153A/ja
Publication of JPH0558260B2 publication Critical patent/JPH0558260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/132—
    • H10W72/5363—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP57108598A 1981-06-27 1982-06-25 電子部品 Granted JPS586153A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3125360.1 1981-06-27
DE19813125360 DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"

Publications (2)

Publication Number Publication Date
JPS586153A JPS586153A (ja) 1983-01-13
JPH0558260B2 true JPH0558260B2 (enExample) 1993-08-26

Family

ID=6135531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57108598A Granted JPS586153A (ja) 1981-06-27 1982-06-25 電子部品

Country Status (4)

Country Link
JP (1) JPS586153A (enExample)
DE (1) DE3125360A1 (enExample)
ES (1) ES273620Y (enExample)
FR (1) FR2508705B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package
JPH03185380A (ja) * 1989-12-14 1991-08-13 Furuno Electric Co Ltd 水中探知装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1369793A (fr) * 1962-09-21 1964-08-14 Westinghouse Electric Corp Dispositif semi-conducteur étanche
JPS432111Y1 (enExample) * 1964-05-23 1968-01-29
JPS5128829B1 (enExample) * 1968-10-21 1976-08-21
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel
JPS4853256U (enExample) * 1971-10-26 1973-07-10
JPS502506U (enExample) * 1973-05-08 1975-01-11
JPS5093566A (enExample) * 1973-12-20 1975-07-25
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system

Also Published As

Publication number Publication date
ES273620U (es) 1984-03-01
ES273620Y (es) 1984-10-01
FR2508705B1 (fr) 1985-12-27
DE3125360C2 (enExample) 1989-11-30
JPS586153A (ja) 1983-01-13
FR2508705A1 (fr) 1982-12-31
DE3125360A1 (de) 1983-01-13

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