DE3104024A1 - Reaktives zerstaeubungsaetzen von silicium - Google Patents
Reaktives zerstaeubungsaetzen von siliciumInfo
- Publication number
- DE3104024A1 DE3104024A1 DE19813104024 DE3104024A DE3104024A1 DE 3104024 A1 DE3104024 A1 DE 3104024A1 DE 19813104024 DE19813104024 DE 19813104024 DE 3104024 A DE3104024 A DE 3104024A DE 3104024 A1 DE3104024 A1 DE 3104024A1
- Authority
- DE
- Germany
- Prior art keywords
- etching
- silicon
- chlorine
- dipl
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims description 19
- 239000010703 silicon Substances 0.000 title claims description 19
- 239000007921 spray Substances 0.000 title 1
- 238000005530 etching Methods 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 35
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 18
- 239000000460 chlorine Substances 0.000 claims description 18
- 229910052801 chlorine Inorganic materials 0.000 claims description 18
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims description 15
- 238000000992 sputter etching Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 2
- 229920005591 polysilicon Polymers 0.000 description 24
- 239000000463 material Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 10
- 230000000873 masking effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 241000252095 Congridae Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 101100545228 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ZDS1 gene Proteins 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5346—Dry etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11910380A | 1980-02-06 | 1980-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3104024A1 true DE3104024A1 (de) | 1981-12-17 |
| DE3104024C2 DE3104024C2 (enrdf_load_stackoverflow) | 1988-08-18 |
Family
ID=22382565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813104024 Granted DE3104024A1 (de) | 1980-02-06 | 1981-02-05 | Reaktives zerstaeubungsaetzen von silicium |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS56130928A (enrdf_load_stackoverflow) |
| CA (1) | CA1148895A (enrdf_load_stackoverflow) |
| DE (1) | DE3104024A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2478421A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2068286B (enrdf_load_stackoverflow) |
| NL (1) | NL190592C (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3606959A1 (de) * | 1986-03-04 | 1987-09-10 | Leybold Heraeus Gmbh & Co Kg | Vorrichtung zur plasmabehandlung von substraten in einer durch hochfrequenz angeregten plasmaentladung |
| DE3935189A1 (de) * | 1989-10-23 | 1991-05-08 | Leybold Ag | Verfahren und vorrichtung zur behandlung von werkstuecken durch reaktives ionenaetzen |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831439B2 (ja) * | 1986-03-05 | 1996-03-27 | 株式会社東芝 | 反応性イオンエッチング方法 |
| KR930008580B1 (ko) * | 1990-06-22 | 1993-09-09 | 현대전자산업 주식회사 | 표면적이 극대화된 실리콘층 및 그 제조방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4104086A (en) * | 1977-08-15 | 1978-08-01 | International Business Machines Corporation | Method for forming isolated regions of silicon utilizing reactive ion etching |
| US4226665A (en) * | 1978-07-31 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Device fabrication by plasma etching |
-
1981
- 1981-01-30 CA CA000369719A patent/CA1148895A/en not_active Expired
- 1981-02-03 GB GB8103292A patent/GB2068286B/en not_active Expired
- 1981-02-05 DE DE19813104024 patent/DE3104024A1/de active Granted
- 1981-02-05 FR FR8102254A patent/FR2478421A1/fr active Granted
- 1981-02-05 NL NL8100560A patent/NL190592C/xx not_active IP Right Cessation
- 1981-02-06 JP JP1587281A patent/JPS56130928A/ja active Pending
Non-Patent Citations (2)
| Title |
|---|
| "J. Vac. Sci. Technol.", Bd. 16, Nr. 2, März/April 1979, S. 410-413 * |
| "Philips techniche Rundschau", Bd. 38, 1979, Nr. 7/8, S. 203-214 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3606959A1 (de) * | 1986-03-04 | 1987-09-10 | Leybold Heraeus Gmbh & Co Kg | Vorrichtung zur plasmabehandlung von substraten in einer durch hochfrequenz angeregten plasmaentladung |
| DE3935189A1 (de) * | 1989-10-23 | 1991-05-08 | Leybold Ag | Verfahren und vorrichtung zur behandlung von werkstuecken durch reaktives ionenaetzen |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1148895A (en) | 1983-06-28 |
| NL8100560A (nl) | 1981-09-01 |
| FR2478421B1 (enrdf_load_stackoverflow) | 1983-12-23 |
| GB2068286A (en) | 1981-08-12 |
| GB2068286B (en) | 1984-07-11 |
| FR2478421A1 (fr) | 1981-09-18 |
| DE3104024C2 (enrdf_load_stackoverflow) | 1988-08-18 |
| NL190592B (nl) | 1993-12-01 |
| NL190592C (nl) | 1994-05-02 |
| JPS56130928A (en) | 1981-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3733135C1 (de) | Vorrichtung zum Beschichten oder AEtzen mittels eines Plasmas | |
| DE3841588C2 (enrdf_load_stackoverflow) | ||
| EP0010596B1 (de) | Verfahren zur Ausbildung von Maskenöffnungen bei der Herstellung von Halbleiteranordnungen | |
| DE1621599C2 (de) | Einrichtung zum Abtragen von Verunrei nigungen einer auf einem Halbleiterkörper aufgebrachten metallischen Schicht im Be reich von kleinen Offnungen einer Isolier schicht durch Kathodenzerstäubung | |
| DE69724192T2 (de) | Verfahren zum Ätzen von Polyzidstrukturen | |
| EP0015403B1 (de) | Verfahren zum reaktiven Ionenätzen von Silicium | |
| DE2945533C2 (de) | Verfahren zur Herstellung eines Verdrahtungssystems | |
| DE69409347T2 (de) | Verfahren zum Herstellen von Halbleitervorrichtungen | |
| DE3706127C2 (enrdf_load_stackoverflow) | ||
| EP0057258B1 (de) | Verfahren zum Herstellen von Polysiliziumstrukturen im 1/um-Bereich auf integrierte Halbleiterschaltungen enthaltenden Substraten durch Plasmaätzen | |
| DE3140890C2 (de) | Photolithographisches Verfahren zum Herstellen einer integrierten Schaltungsvorrichtung | |
| DE4130391C2 (de) | Verfahren zum selektiven entfernen einer schicht und dessen verwendung | |
| DE2953117A1 (en) | Fabrication of integrated circuits utilizing thick high-resolution patterns | |
| EP0094528A2 (de) | Verfahren zum Herstellen von Strukturen von aus Metallsilizid und Polysilizium bestehenden Doppelschichten auf integrierte Halbleiterschaltungen enthaltenden Substraten durch reaktives Ionenätzen | |
| DE3326929A1 (de) | Bauelement-herstellungsverfahren mit plasmaaetzen | |
| DE2951287A1 (de) | Verfahren zur herstellung von ebenen oberflaechen mit feinsten spitzen im mikrometer-bereich | |
| DE3441470A1 (de) | Anordnung zum aetzen von halbleiterscheiben | |
| EP0090067B2 (de) | Reaktor für das reaktive Ionenätzen und Ätzverfahren | |
| DE2911484C2 (de) | Metall-Isolator-Halbleiterbauelement | |
| DE1640486A1 (de) | Verfahren zum Erzeugen eines duennen,elektrisch isolierenden Filmes auf einer Unterlage | |
| EP0126969B1 (de) | Verfahren zum Herstellen von Strukturen von aus Metallsiliziden bzw. Silizid-Polysilizium bestehenden Schichten für integrierte Halbleiterschaltungen durch reaktives Ionenätzen | |
| DE3219284C2 (enrdf_load_stackoverflow) | ||
| DE3104024A1 (de) | Reaktives zerstaeubungsaetzen von silicium | |
| DE3318566A1 (de) | Plasma-aetzverfahren | |
| EP0237844A1 (de) | Verfahren zur Herstellung einer Abdeckschicht für die Halbleitertechnik sowie Verwendung der Abdeckschicht |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8127 | New person/name/address of the applicant |
Owner name: AT & T TECHNOLOGIES, INC., NEW YORK, N.Y., US |
|
| 8128 | New person/name/address of the agent |
Representative=s name: BLUMBACH, P., DIPL.-ING., 6200 WIESBADEN WESER, W. |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN |