DE3067677D1 - Boat for wafer processing - Google Patents

Boat for wafer processing

Info

Publication number
DE3067677D1
DE3067677D1 DE8080901301T DE3067677T DE3067677D1 DE 3067677 D1 DE3067677 D1 DE 3067677D1 DE 8080901301 T DE8080901301 T DE 8080901301T DE 3067677 T DE3067677 T DE 3067677T DE 3067677 D1 DE3067677 D1 DE 3067677D1
Authority
DE
Germany
Prior art keywords
boat
wafer processing
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080901301T
Other languages
German (de)
English (en)
Inventor
Steven N Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
Rockwell International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwell International Corp filed Critical Rockwell International Corp
Application granted granted Critical
Publication of DE3067677D1 publication Critical patent/DE3067677D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/12—Substrate holders or susceptors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
DE8080901301T 1979-09-17 1980-06-06 Boat for wafer processing Expired DE3067677D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/076,045 US4256229A (en) 1979-09-17 1979-09-17 Boat for wafer processing
PCT/US1980/000706 WO1981000681A1 (en) 1979-09-17 1980-06-06 Boat for wafer processing

Publications (1)

Publication Number Publication Date
DE3067677D1 true DE3067677D1 (en) 1984-06-07

Family

ID=22129605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080901301T Expired DE3067677D1 (en) 1979-09-17 1980-06-06 Boat for wafer processing

Country Status (6)

Country Link
US (1) US4256229A (OSRAM)
EP (1) EP0036859B1 (OSRAM)
JP (1) JPS56501225A (OSRAM)
CA (1) CA1143074A (OSRAM)
DE (1) DE3067677D1 (OSRAM)
WO (1) WO1981000681A1 (OSRAM)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4434899A (en) 1980-11-17 1984-03-06 Liberty Carton Co. Adjustable wire tote for printed circuit boards
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
US4518085A (en) * 1982-04-29 1985-05-21 At&T Technologies, Inc. Multi-purpose transport tray
EP0100539A3 (en) * 1982-07-30 1985-05-22 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
US5230747A (en) * 1982-07-30 1993-07-27 Hitachi, Ltd. Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer
JPH0624199B2 (ja) * 1982-07-30 1994-03-30 株式会社日立製作所 ウエハの加工方法
US5279992A (en) * 1982-07-30 1994-01-18 Hitachi, Ltd. Method of producing a wafer having a curved notch
US4572101A (en) * 1983-05-13 1986-02-25 Asq Boats, Inc. Side lifting wafer boat assembly
US4484538A (en) * 1983-11-16 1984-11-27 Btu Engineering Corporation Apparatus for providing depletion-free uniform thickness CVD thin-film on semiconductor wafers
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
DE3440111C1 (de) * 1984-11-02 1986-05-15 Heraeus Quarzschmelze Gmbh, 6450 Hanau Traegerhorde
US4653636A (en) * 1985-05-14 1987-03-31 Microglass, Inc. Wafer carrier and method
JPH0736418B2 (ja) * 1986-05-19 1995-04-19 富士通株式会社 ウエーハキャリア
EP0267462A3 (en) * 1986-11-12 1990-01-31 Heraeus Amersil, Inc. Mass transferable semiconductor substrate processing and handling full shell carrier (boat)
US4949848A (en) * 1988-04-29 1990-08-21 Fluoroware, Inc. Wafer carrier
US5111936A (en) * 1990-11-30 1992-05-12 Fluoroware Wafer carrier
CA2120325A1 (en) * 1991-10-04 1993-04-15 Alan E. Walter Ultracleaning of involuted microparts
DE4428169C2 (de) * 1994-08-09 1996-07-11 Steag Micro Tech Gmbh Träger für Substrate
US5785518A (en) * 1994-09-30 1998-07-28 Sony Corporation Masking element fixture
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
USD381344S (en) * 1995-07-31 1997-07-22 Kaijo Corporation Disk carrier
US6214127B1 (en) 1998-02-04 2001-04-10 Micron Technology, Inc. Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier
US6520191B1 (en) * 1998-10-19 2003-02-18 Memc Electronic Materials, Inc. Carrier for cleaning silicon wafers
US6176377B1 (en) * 1999-08-18 2001-01-23 Ali Industries, Inc. Rack for supporting abrasive discs or the like
US20020008045A1 (en) * 2000-06-12 2002-01-24 Guyot Joshua N. Microscope slide container
US6455395B1 (en) * 2000-06-30 2002-09-24 Integrated Materials, Inc. Method of fabricating silicon structures including fixtures for supporting wafers
US6871657B2 (en) * 2001-04-06 2005-03-29 Akrion, Llc Low profile wafer carrier
JP2003201148A (ja) * 2001-10-31 2003-07-15 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板の化学強化用ホルダー
KR100481855B1 (ko) * 2002-08-05 2005-04-11 삼성전자주식회사 집적회로 제조 장치
US6814808B1 (en) 2002-10-08 2004-11-09 Sci-Tech Glassblowing, Inc. Carrier for semiconductor wafers
FR2846785B1 (fr) * 2002-11-04 2005-02-04 Soitec Silicon On Insulator Nacelle de manutention de tranches de materiau semiconducteur
FR2858306B1 (fr) * 2003-07-28 2007-11-23 Semco Engineering Sa Support de plaquettes, convertible pouvant recevoir au moins deux types de plaquettes differencies par la dimension des plaquettes.
KR100921521B1 (ko) * 2007-10-12 2009-10-12 세메스 주식회사 기판 지지 유닛 및 이를 이용한 기판 처리 장치
JP4999808B2 (ja) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置
WO2011008753A1 (en) * 2009-07-13 2011-01-20 Greene, Tweed Of Delaware, Inc. Chimerized wafer boats for use in semiconductor chip processing and related methods
US20120247686A1 (en) * 2011-03-28 2012-10-04 Memc Electronic Materials, Inc. Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
DE202012005850U1 (de) 2012-06-14 2012-10-10 Institut Für Solarenergieforschung Gmbh Vorrichtung zum Halten von Halbleitersubstraten verschiedener Formen und Größen
CN104992917B (zh) * 2015-08-10 2018-04-24 乐山无线电股份有限公司 一种硅片载具
CN107325324B (zh) * 2016-04-28 2019-08-20 中国石油化工股份有限公司 阻燃剂、阻燃防静电组合物和阻燃防静电聚丙烯发泡珠粒
CN206961808U (zh) * 2017-07-14 2018-02-02 君泰创新（北京）科技有限公司 硅片清洗工装
CN109637958B (zh) * 2019-01-21 2024-02-20 苏州赛森电子科技有限公司 一种硅片腐蚀工艺固定载具及固定方法
CN112831833B (zh) * 2020-12-31 2024-04-09 中核北方核燃料元件有限公司 一种可定位的物料舟皿

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB950052A (en) * 1962-12-17 1964-02-19 Upsala Ekeby Aktiebolag Improvements in stands for supporting and transporting flat ceramic articles for firing the same
US3553037A (en) * 1968-04-05 1971-01-05 Stewart Warner Corp Gas diffusion method for fabricating semiconductor devices
DE2133877A1 (de) * 1971-07-07 1973-01-18 Siemens Ag Anordnung zum eindiffundieren von dotierstoffen in halbleiterscheiben
DE2133876A1 (de) * 1971-07-07 1973-01-18 Siemens Ag Anordnung zum eindiffundieren von dotierstoffen
JPS5812730B2 (ja) * 1973-08-06 1983-03-10 株式会社日立製作所 ウエ−ハジグ
JPS5068775A (OSRAM) * 1973-10-19 1975-06-09
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
US4053294A (en) * 1976-05-19 1977-10-11 California Quartzware Corporation Low stress semiconductor wafer carrier and method of manufacture
US4098923A (en) * 1976-06-07 1978-07-04 Motorola, Inc. Pyrolytic deposition of silicon dioxide on semiconductors using a shrouded boat
US4176751A (en) * 1977-01-27 1979-12-04 Northern Telecom Limited Container apparatus for handling semiconductor wafers

Also Published As

Publication number Publication date
EP0036859B1 (en) 1984-05-02
EP0036859A4 (en) 1982-02-05
JPS56501225A (OSRAM) 1981-08-27
US4256229A (en) 1981-03-17
WO1981000681A1 (en) 1981-03-19
CA1143074A (en) 1983-03-15
EP0036859A1 (en) 1981-10-07

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee