JPS5645059A - Thinnsheet coolinggbody used for semiconductor - Google Patents

Thinnsheet coolinggbody used for semiconductor

Info

Publication number
JPS5645059A
JPS5645059A JP12250980A JP12250980A JPS5645059A JP S5645059 A JPS5645059 A JP S5645059A JP 12250980 A JP12250980 A JP 12250980A JP 12250980 A JP12250980 A JP 12250980A JP S5645059 A JPS5645059 A JP S5645059A
Authority
JP
Japan
Prior art keywords
thinnsheet
coolinggbody
semiconductor
thinnsheet coolinggbody
coolinggbody used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12250980A
Other languages
Japanese (ja)
Inventor
Ratsuku Peetaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS5645059A publication Critical patent/JPS5645059A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12250980A 1979-09-07 1980-09-05 Thinnsheet coolinggbody used for semiconductor Pending JPS5645059A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792936161 DE2936161A1 (en) 1979-09-07 1979-09-07 Vehicle generator rectifier diode cooling system - has diodes supported by ribbed carrier adjacent to ventilating opening through end cover

Publications (1)

Publication Number Publication Date
JPS5645059A true JPS5645059A (en) 1981-04-24

Family

ID=6080274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12250980A Pending JPS5645059A (en) 1979-09-07 1980-09-05 Thinnsheet coolinggbody used for semiconductor

Country Status (2)

Country Link
JP (1) JPS5645059A (en)
DE (1) DE2936161A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013506996A (en) * 2009-10-03 2013-02-28 ウルバリン チューブ,インコーポレイテッド Cold plate with pin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013506996A (en) * 2009-10-03 2013-02-28 ウルバリン チューブ,インコーポレイテッド Cold plate with pin

Also Published As

Publication number Publication date
DE2936161A1 (en) 1981-03-19

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