JPS5645059A - Thinnsheet coolinggbody used for semiconductor - Google Patents
Thinnsheet coolinggbody used for semiconductorInfo
- Publication number
- JPS5645059A JPS5645059A JP12250980A JP12250980A JPS5645059A JP S5645059 A JPS5645059 A JP S5645059A JP 12250980 A JP12250980 A JP 12250980A JP 12250980 A JP12250980 A JP 12250980A JP S5645059 A JPS5645059 A JP S5645059A
- Authority
- JP
- Japan
- Prior art keywords
- thinnsheet
- coolinggbody
- semiconductor
- thinnsheet coolinggbody
- coolinggbody used
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792936161 DE2936161A1 (en) | 1979-09-07 | 1979-09-07 | Vehicle generator rectifier diode cooling system - has diodes supported by ribbed carrier adjacent to ventilating opening through end cover |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5645059A true JPS5645059A (en) | 1981-04-24 |
Family
ID=6080274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12250980A Pending JPS5645059A (en) | 1979-09-07 | 1980-09-05 | Thinnsheet coolinggbody used for semiconductor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5645059A (en) |
DE (1) | DE2936161A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013506996A (en) * | 2009-10-03 | 2013-02-28 | ウルバリン チューブ,インコーポレイテッド | Cold plate with pin |
-
1979
- 1979-09-07 DE DE19792936161 patent/DE2936161A1/en not_active Withdrawn
-
1980
- 1980-09-05 JP JP12250980A patent/JPS5645059A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013506996A (en) * | 2009-10-03 | 2013-02-28 | ウルバリン チューブ,インコーポレイテッド | Cold plate with pin |
Also Published As
Publication number | Publication date |
---|---|
DE2936161A1 (en) | 1981-03-19 |
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