DE3026183A1 - Gehaeuse fuer integrierte logikschaltkreise - Google Patents

Gehaeuse fuer integrierte logikschaltkreise

Info

Publication number
DE3026183A1
DE3026183A1 DE19803026183 DE3026183A DE3026183A1 DE 3026183 A1 DE3026183 A1 DE 3026183A1 DE 19803026183 DE19803026183 DE 19803026183 DE 3026183 A DE3026183 A DE 3026183A DE 3026183 A1 DE3026183 A1 DE 3026183A1
Authority
DE
Germany
Prior art keywords
substrate
housing according
signal lines
housing
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19803026183
Other languages
German (de)
English (en)
Other versions
DE3026183C2 (cg-RX-API-DMAC10.html
Inventor
Moritoshi Akino
Hiroshi Murano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of DE3026183A1 publication Critical patent/DE3026183A1/de
Application granted granted Critical
Publication of DE3026183C2 publication Critical patent/DE3026183C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W40/226—
    • H10W40/47—
    • H10W70/685—
    • H10W76/12—
    • H10W90/00—
    • H10W70/63—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
DE19803026183 1979-07-10 1980-07-10 Gehaeuse fuer integrierte logikschaltkreise Granted DE3026183A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8702279A JPS5612760A (en) 1979-07-10 1979-07-10 Multi chip lsi package

Publications (2)

Publication Number Publication Date
DE3026183A1 true DE3026183A1 (de) 1981-02-19
DE3026183C2 DE3026183C2 (cg-RX-API-DMAC10.html) 1988-03-10

Family

ID=13903327

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803026183 Granted DE3026183A1 (de) 1979-07-10 1980-07-10 Gehaeuse fuer integrierte logikschaltkreise

Country Status (4)

Country Link
US (1) US4398208A (cg-RX-API-DMAC10.html)
JP (1) JPS5612760A (cg-RX-API-DMAC10.html)
DE (1) DE3026183A1 (cg-RX-API-DMAC10.html)
FR (1) FR2461361B1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435341A1 (de) * 1984-09-26 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen von kuehlkoerpern auf einer mehrzahl von integrierten bausteinen
WO1994001888A1 (de) * 1992-07-08 1994-01-20 Daimler Benz Ag Anordnung für die mehrfachverdrahtung von multichipmodulen

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818951A (ja) * 1981-07-22 1983-02-03 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体チツプ装着用基板
EP0120500B1 (en) * 1983-03-29 1989-08-16 Nec Corporation High density lsi package for logic circuits
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
FR2608863B1 (fr) * 1986-12-19 1994-04-29 Nec Corp Circuit integre logique comportant des bascules electroniques d'entree et de sortie pour stabiliser les durees des impulsions
US4805691A (en) * 1986-12-22 1989-02-21 Sundstrand Corporation Cooling technique for compact electronics inverter
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPS63228206A (ja) * 1987-03-17 1988-09-22 Nec Corp クロツク分配方式
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4918335A (en) * 1987-11-06 1990-04-17 Ford Aerospace Corporation Interconnection system for integrated circuit chips
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
US5040052A (en) * 1987-12-28 1991-08-13 Texas Instruments Incorporated Compact silicon module for high density integrated circuits
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
CA1304830C (en) * 1988-09-20 1992-07-07 Toshifumi Sano Cooling structure
US5285012A (en) * 1992-02-18 1994-02-08 Axon Instruments, Inc. Low noise integrated circuit package
US6262477B1 (en) 1993-03-19 2001-07-17 Advanced Interconnect Technologies Ball grid array electronic package
TWI320300B (en) * 2005-11-18 2010-02-01 Dissipating heat device of fin-type
US8064224B2 (en) * 2008-03-31 2011-11-22 Intel Corporation Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
US9429983B1 (en) 2013-09-12 2016-08-30 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US11042211B2 (en) 2009-08-07 2021-06-22 Advanced Processor Architectures, Llc Serially connected computing nodes in a distributed computing system
US9645603B1 (en) 2013-09-12 2017-05-09 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
WO2011017676A1 (en) 2009-08-07 2011-02-10 Advanced Processor Architectures, Llc Distributed computing
US10014238B2 (en) 2016-07-19 2018-07-03 Ge Energy Power Conversion Technology Ltd Method, system, and electronic assembly for thermal management

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
DE2334427A1 (de) * 1972-07-10 1974-01-31 Amdahl Corp Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren
DE2607403A1 (de) * 1975-03-31 1976-10-21 Ibm Luftgekuehlte packung fuer halbleiterschaltungen hoher packungsdichte
DE2758140A1 (de) * 1977-01-03 1978-07-13 Ibm Monolithisch integrierte halbleiterschaltungen tragender modul

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202888A (en) * 1962-02-09 1965-08-24 Hughes Aircraft Co Micro-miniature semiconductor devices
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3373322A (en) * 1966-01-13 1968-03-12 Mitronics Inc Semiconductor envelope
US3361868A (en) * 1966-08-04 1968-01-02 Coors Porcelain Co Support for electrical circuit component
US3496634A (en) * 1966-12-30 1970-02-24 Ibm Method of wiring and metal embedding an electrical back panel
US3404214A (en) * 1967-07-17 1968-10-01 Alloys Unltd Inc Flat package for semiconductors
US3519895A (en) * 1968-02-06 1970-07-07 Westinghouse Electric Corp Combination of solderless terminal assembly and semiconductor
US3649881A (en) * 1970-08-31 1972-03-14 Rca Corp High-power semiconductor device assembly
US4220917A (en) * 1978-07-31 1980-09-02 International Business Machines Corporation Test circuitry for module interconnection network

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
DE2334427A1 (de) * 1972-07-10 1974-01-31 Amdahl Corp Baugruppe fuer ein lsi-plaettchen und herstellungsverfahren
DE2607403A1 (de) * 1975-03-31 1976-10-21 Ibm Luftgekuehlte packung fuer halbleiterschaltungen hoher packungsdichte
DE2758140A1 (de) * 1977-01-03 1978-07-13 Ibm Monolithisch integrierte halbleiterschaltungen tragender modul

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
US-Z.: "IEEE Transactions on Computers", Vol. C-30, No. 12, Dez. 1971, S. 1469-1479 *
US-Z.: ELECTRONICS 15. Febr. 1979, S. 113-117 *
US-Z.: ELECTRONICS 4. Jan. 1979, S. 130-133 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435341A1 (de) * 1984-09-26 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen von kuehlkoerpern auf einer mehrzahl von integrierten bausteinen
WO1994001888A1 (de) * 1992-07-08 1994-01-20 Daimler Benz Ag Anordnung für die mehrfachverdrahtung von multichipmodulen

Also Published As

Publication number Publication date
US4398208A (en) 1983-08-09
DE3026183C2 (cg-RX-API-DMAC10.html) 1988-03-10
FR2461361B1 (fr) 1985-09-13
FR2461361A1 (fr) 1981-01-30
JPS5612760A (en) 1981-02-07
JPS6249989B2 (cg-RX-API-DMAC10.html) 1987-10-22

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Legal Events

Date Code Title Description
OAR Request for search filed
OB Request for examination as to novelty
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: VOSSIUS, V., DIPL.-CHEM. DR.RER.NAT. TAUCHNER, P., DIPL.-CHEM. DR.RER.NAT. HEUNEMANN, D., DIPL.-PHYS. DR.RER.NAT. RAUH, P., DIPL.-CHEM. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN

8328 Change in the person/name/address of the agent

Free format text: TAUCHNER, P., DIPL.-CHEM. DR.RER.NAT. HEUNEMANN, D., DIPL.-PHYS. DR.RER.NAT. RAUH, P., DIPL.-CHEM. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee