DE3017447A1 - Mikrogehaeuse fuer einen elektronischen schaltkreis und hybridschaltkreis, welcher ein solches mikrogehaeuse aufweist - Google Patents

Mikrogehaeuse fuer einen elektronischen schaltkreis und hybridschaltkreis, welcher ein solches mikrogehaeuse aufweist

Info

Publication number
DE3017447A1
DE3017447A1 DE19803017447 DE3017447A DE3017447A1 DE 3017447 A1 DE3017447 A1 DE 3017447A1 DE 19803017447 DE19803017447 DE 19803017447 DE 3017447 A DE3017447 A DE 3017447A DE 3017447 A1 DE3017447 A1 DE 3017447A1
Authority
DE
Germany
Prior art keywords
housing
microhousing
micro
circuit
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19803017447
Other languages
German (de)
English (en)
Other versions
DE3017447C2 (enExample
Inventor
Roland Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE3017447A1 publication Critical patent/DE3017447A1/de
Application granted granted Critical
Publication of DE3017447C2 publication Critical patent/DE3017447C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H10W44/601—
    • H10W70/692—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE19803017447 1979-05-10 1980-05-07 Mikrogehaeuse fuer einen elektronischen schaltkreis und hybridschaltkreis, welcher ein solches mikrogehaeuse aufweist Granted DE3017447A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911852A FR2456388A1 (fr) 1979-05-10 1979-05-10 Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Publications (2)

Publication Number Publication Date
DE3017447A1 true DE3017447A1 (de) 1980-11-13
DE3017447C2 DE3017447C2 (enExample) 1989-10-05

Family

ID=9225293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803017447 Granted DE3017447A1 (de) 1979-05-10 1980-05-07 Mikrogehaeuse fuer einen elektronischen schaltkreis und hybridschaltkreis, welcher ein solches mikrogehaeuse aufweist

Country Status (3)

Country Link
US (1) US4408256A (enExample)
DE (1) DE3017447A1 (enExample)
FR (1) FR2456388A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495837A1 (fr) * 1980-12-09 1982-06-11 Thomson Csf Embase de microboitier d'encapsulation et microboitier comportant une telle embase
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
GB2091035B (en) * 1981-01-12 1985-01-09 Avx Corp Integrated circuit device and sub-assembly
US4454529A (en) * 1981-01-12 1984-06-12 Avx Corporation Integrated circuit device having internal dampening for a plurality of power supplies
CA1188010A (en) * 1981-05-06 1985-05-28 Leonard W. Schaper Package for a semiconductor chip
US4451845A (en) * 1981-12-22 1984-05-29 Avx Corporation Lead frame device including ceramic encapsulated capacitor and IC chip
LU85135A1 (fr) * 1983-12-14 1985-09-12 Bonameau Jean Marie Dispositif de protection contre les perturbations et/ou des parasites au voisinage de circuits integres
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
FR2622346B1 (fr) * 1987-10-23 1993-05-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
JP2969237B2 (ja) * 1992-07-06 1999-11-02 日本特殊陶業株式会社 コンデンサー内蔵基板及びその製造方法
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
US5480727A (en) * 1994-02-03 1996-01-02 Motorola, Inc. Electronic device assembly and method for making
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
US5586011A (en) * 1994-08-29 1996-12-17 At&T Global Information Solutions Company Side plated electromagnetic interference shield strip for a printed circuit board
FR2802706B1 (fr) * 1999-12-15 2002-03-01 3D Plus Sa Procede et dispositif d'interconnexion en trois dimensions de composants electroniques
FR2832136B1 (fr) * 2001-11-09 2005-02-18 3D Plus Sa Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2911995B1 (fr) * 2007-01-30 2009-03-06 3D Plus Sa Sa Procede d'interconnexion de tranches electroniques
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694185A (en) * 1951-01-19 1954-11-09 Sprague Electric Co Electrical circuit arrangement
AT184944B (de) * 1948-08-17 1956-03-10 Emi Ltd Verfahren zur Herstellung von elektrischen Leitungsmustern
US3256499A (en) * 1962-07-26 1966-06-14 Globe Union Inc Resistance-capacitance network unit
DE1273637B (de) * 1965-08-25 1968-07-25 Vitramon Inc Schichtweise aufgebaute saeulenfoermige Modulbaugruppe
DE1273638B (de) * 1965-08-31 1968-07-25 Vitramon Inc Schichtenweise aufgebaute saeulenfoermige Modulbaugruppe
DE1811857A1 (de) * 1967-12-07 1969-07-17 Vitramon Inc Traeger fuer elektronische Mikrominiaturschaltungen
DE1956880A1 (de) * 1968-11-27 1970-06-18 Int Standard Electric Corp Elektrische Baugruppe
DE2010429A1 (de) * 1969-02-28 1970-09-10 Hawker Siddeley Dynamics Ltd., Hatfield, Hertfordshire (Grossbritannien) Elektrische Schaltungsanordnung mit hermetischer Abdichtung
GB1476886A (en) * 1974-04-22 1977-06-16 Trw Inc Ceramic printed circuit board structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270261A (en) * 1966-08-30 Dry oxide capacitor
DE562043C (de) * 1929-08-10 1932-10-21 Aeg Elektrischer Kondensator mit einem oder mehreren einander gegenueberstehenden Metallbelaegen, welche von gegeneinander und gegen die Metallbelaege isolierten Metallkoerpern rahmenartig umgeben sind
US2673949A (en) * 1950-11-18 1954-03-30 Globe Union Inc Printed circuits, including low-temperature coefficient capacitor
CH446463A (de) * 1964-12-01 1967-11-15 Photocircuits Corp Verfahren zur Herstellung von elektrischen Baueinheiten und nach dem Verfahren hergestellte elektrische Baueinheit
US3491275A (en) * 1967-05-02 1970-01-20 Sprague Electric Co Flat capacitor
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
US4247881A (en) * 1979-04-02 1981-01-27 Sprague Electric Company Discoidal monolithic ceramic capacitor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT184944B (de) * 1948-08-17 1956-03-10 Emi Ltd Verfahren zur Herstellung von elektrischen Leitungsmustern
US2694185A (en) * 1951-01-19 1954-11-09 Sprague Electric Co Electrical circuit arrangement
US3256499A (en) * 1962-07-26 1966-06-14 Globe Union Inc Resistance-capacitance network unit
DE1273637B (de) * 1965-08-25 1968-07-25 Vitramon Inc Schichtweise aufgebaute saeulenfoermige Modulbaugruppe
DE1273638B (de) * 1965-08-31 1968-07-25 Vitramon Inc Schichtenweise aufgebaute saeulenfoermige Modulbaugruppe
DE1811857A1 (de) * 1967-12-07 1969-07-17 Vitramon Inc Traeger fuer elektronische Mikrominiaturschaltungen
DE1956880A1 (de) * 1968-11-27 1970-06-18 Int Standard Electric Corp Elektrische Baugruppe
DE2010429A1 (de) * 1969-02-28 1970-09-10 Hawker Siddeley Dynamics Ltd., Hatfield, Hertfordshire (Grossbritannien) Elektrische Schaltungsanordnung mit hermetischer Abdichtung
GB1476886A (en) * 1974-04-22 1977-06-16 Trw Inc Ceramic printed circuit board structure

Also Published As

Publication number Publication date
US4408256A (en) 1983-10-04
FR2456388B1 (enExample) 1982-10-01
DE3017447C2 (enExample) 1989-10-05
FR2456388A1 (fr) 1980-12-05

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H05K 1/02

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee