FR2456388A1 - Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier - Google Patents

Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Info

Publication number
FR2456388A1
FR2456388A1 FR7911852A FR7911852A FR2456388A1 FR 2456388 A1 FR2456388 A1 FR 2456388A1 FR 7911852 A FR7911852 A FR 7911852A FR 7911852 A FR7911852 A FR 7911852A FR 2456388 A1 FR2456388 A1 FR 2456388A1
Authority
FR
France
Prior art keywords
microbox
circuit
capacitors
hybrid
electronic circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7911852A
Other languages
English (en)
French (fr)
Other versions
FR2456388B1 (enExample
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson-Brandt SA
Original Assignee
Thomson-Brandt SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson-Brandt SA filed Critical Thomson-Brandt SA
Priority to FR7911852A priority Critical patent/FR2456388A1/fr
Priority to DE19803017447 priority patent/DE3017447A1/de
Publication of FR2456388A1 publication Critical patent/FR2456388A1/fr
Priority to US06/346,907 priority patent/US4408256A/en
Application granted granted Critical
Publication of FR2456388B1 publication Critical patent/FR2456388B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H10W44/601—
    • H10W70/692—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR7911852A 1979-05-10 1979-05-10 Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier Granted FR2456388A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7911852A FR2456388A1 (fr) 1979-05-10 1979-05-10 Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier
DE19803017447 DE3017447A1 (de) 1979-05-10 1980-05-07 Mikrogehaeuse fuer einen elektronischen schaltkreis und hybridschaltkreis, welcher ein solches mikrogehaeuse aufweist
US06/346,907 US4408256A (en) 1979-05-10 1982-02-08 Microbox for electronic circuit and hybrid circuit having such a microbox

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911852A FR2456388A1 (fr) 1979-05-10 1979-05-10 Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Publications (2)

Publication Number Publication Date
FR2456388A1 true FR2456388A1 (fr) 1980-12-05
FR2456388B1 FR2456388B1 (enExample) 1982-10-01

Family

ID=9225293

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7911852A Granted FR2456388A1 (fr) 1979-05-10 1979-05-10 Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Country Status (3)

Country Link
US (1) US4408256A (enExample)
DE (1) DE3017447A1 (enExample)
FR (1) FR2456388A1 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495837A1 (fr) * 1980-12-09 1982-06-11 Thomson Csf Embase de microboitier d'encapsulation et microboitier comportant une telle embase
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
FR2499768A1 (fr) * 1981-01-12 1982-08-13 Avx Corp Dispositif a circuit integre et son sous-ensemble de montage
FR2518811A1 (fr) * 1981-12-22 1983-06-24 Avx Corp Dispositif a circuit integre en conteneur de ceramique
FR2521780A1 (fr) * 1982-01-15 1983-08-19 Avx Corp Dispositif a circuit integre presentant un moyen d'amortissement interne des signaux transitoires vis-a-vis de plusieurs sources d'alimentation electrique
EP0077818A4 (en) * 1981-05-06 1985-04-24 Western Electric Co PACKAGE FOR A SEMICONDUCTOR CHIP WITH A CAPACITOR AS AN INTEGRATED COMPONENT THEREOF.
EP0145694A3 (fr) * 1983-12-14 1986-10-08 Jean-Marie Bonameau Dispositif de protection contre les perturbations et/ou des parasites au voisinage de circuits intégrés
FR2622346A1 (fr) * 1987-10-23 1989-04-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
US4862322A (en) * 1988-05-02 1989-08-29 Bickford Harry R Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
JP2969237B2 (ja) * 1992-07-06 1999-11-02 日本特殊陶業株式会社 コンデンサー内蔵基板及びその製造方法
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
US5480727A (en) * 1994-02-03 1996-01-02 Motorola, Inc. Electronic device assembly and method for making
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
US5586011A (en) * 1994-08-29 1996-12-17 At&T Global Information Solutions Company Side plated electromagnetic interference shield strip for a printed circuit board
FR2802706B1 (fr) * 1999-12-15 2002-03-01 3D Plus Sa Procede et dispositif d'interconnexion en trois dimensions de composants electroniques
FR2832136B1 (fr) * 2001-11-09 2005-02-18 3D Plus Sa Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
FR2884049B1 (fr) * 2005-04-01 2007-06-22 3D Plus Sa Sa Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2911995B1 (fr) * 2007-01-30 2009-03-06 3D Plus Sa Sa Procede d'interconnexion de tranches electroniques
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH446463A (de) * 1964-12-01 1967-11-15 Photocircuits Corp Verfahren zur Herstellung von elektrischen Baueinheiten und nach dem Verfahren hergestellte elektrische Baueinheit

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3270261A (en) * 1966-08-30 Dry oxide capacitor
DE562043C (de) * 1929-08-10 1932-10-21 Aeg Elektrischer Kondensator mit einem oder mehreren einander gegenueberstehenden Metallbelaegen, welche von gegeneinander und gegen die Metallbelaege isolierten Metallkoerpern rahmenartig umgeben sind
GB682314A (en) * 1948-08-17 1952-11-05 Emi Ltd Improvements in or relating to methods of making electrically-conducting patterns, such as wiring circuits, coils and the like
US2673949A (en) * 1950-11-18 1954-03-30 Globe Union Inc Printed circuits, including low-temperature coefficient capacitor
US2694185A (en) * 1951-01-19 1954-11-09 Sprague Electric Co Electrical circuit arrangement
US3256499A (en) * 1962-07-26 1966-06-14 Globe Union Inc Resistance-capacitance network unit
DE1273637B (de) * 1965-08-25 1968-07-25 Vitramon Inc Schichtweise aufgebaute saeulenfoermige Modulbaugruppe
FR1468115A (fr) * 1965-08-31 1967-02-03 Vitramon Inc Composant électrique solide avec dispositif de résistance neutralisant les capacités
US3491275A (en) * 1967-05-02 1970-01-20 Sprague Electric Co Flat capacitor
GB1195149A (en) * 1967-12-07 1970-06-17 Vitramon Inc Microminiature Electronic Substrate for Microcircuits.
GB1207728A (en) * 1968-11-27 1970-10-07 Standard Telephones Cables Ltd Housing assembly for an electric circuit
GB1259804A (en) * 1969-02-28 1972-01-12 Hawker Siddeley Dynamics Ltd Improvements in or relating to the manufacture of electrical circuit assemblies
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
US3934074A (en) * 1974-04-22 1976-01-20 Trw Inc. Ceramic circuit board mounted in housing and method of fabrication thereof
US4247881A (en) * 1979-04-02 1981-01-27 Sprague Electric Company Discoidal monolithic ceramic capacitor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH446463A (de) * 1964-12-01 1967-11-15 Photocircuits Corp Verfahren zur Herstellung von elektrischen Baueinheiten und nach dem Verfahren hergestellte elektrische Baueinheit

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495837A1 (fr) * 1980-12-09 1982-06-11 Thomson Csf Embase de microboitier d'encapsulation et microboitier comportant une telle embase
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
FR2499768A1 (fr) * 1981-01-12 1982-08-13 Avx Corp Dispositif a circuit integre et son sous-ensemble de montage
EP0077818A4 (en) * 1981-05-06 1985-04-24 Western Electric Co PACKAGE FOR A SEMICONDUCTOR CHIP WITH A CAPACITOR AS AN INTEGRATED COMPONENT THEREOF.
FR2518811A1 (fr) * 1981-12-22 1983-06-24 Avx Corp Dispositif a circuit integre en conteneur de ceramique
FR2521780A1 (fr) * 1982-01-15 1983-08-19 Avx Corp Dispositif a circuit integre presentant un moyen d'amortissement interne des signaux transitoires vis-a-vis de plusieurs sources d'alimentation electrique
EP0145694A3 (fr) * 1983-12-14 1986-10-08 Jean-Marie Bonameau Dispositif de protection contre les perturbations et/ou des parasites au voisinage de circuits intégrés
FR2622346A1 (fr) * 1987-10-23 1989-04-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
DE3017447A1 (de) 1980-11-13
US4408256A (en) 1983-10-04
FR2456388B1 (enExample) 1982-10-01
DE3017447C2 (enExample) 1989-10-05

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