GB1259804A - Improvements in or relating to the manufacture of electrical circuit assemblies - Google Patents
Improvements in or relating to the manufacture of electrical circuit assembliesInfo
- Publication number
- GB1259804A GB1259804A GB500869A GB500869A GB1259804A GB 1259804 A GB1259804 A GB 1259804A GB 500869 A GB500869 A GB 500869A GB 500869 A GB500869 A GB 500869A GB 1259804 A GB1259804 A GB 1259804A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass
- conductive
- leads
- ceramic
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
1,259,804. Circuit assemblies. HAWKER SIDDELEY DYNAMICS Ltd. 28 Feb., 1969, No. 5008/69. Heading H1R. In an hermetically sealed circuit package including a conductive pattern on a substrate and leads extending from the package bonded to the conductive pattern a hermetic seal of insulating material such as glass, glass ceramic, inorganic or organic resin or rubber is formed over both the leads and part of the conductive pattern. A metallic, glass, glass ceramic or ceramic substrate has conductive coatings 2 screen printed thereon and then successive layers of insulating material 3, 5 and conductive material 4, 6 deposited in the required pattern. Preformed output leads 7 are then attached to the conductive areas 2 and a frame 8 metallized on one of its major plane surfaces 9 and coated with a sealing glass 10 is placed over the assembly and sealed by heating, the glass 10 seal extending over part of the circuit pattern as well as the leads 7, Fig. 2 (not shown). After affixing components to the circuit assembly sealing caps 11 of metal, glass or ceramic are sealed to the metallized areas 9. In an alternative arrangement the assembly may be coated with the glass 10 or a rubber or resin and then the frame 8 is fitted.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB500869A GB1259804A (en) | 1969-02-28 | 1969-02-28 | Improvements in or relating to the manufacture of electrical circuit assemblies |
NL7002256A NL7002256A (en) | 1969-02-28 | 1970-02-18 | |
DE19702010429 DE2010429A1 (en) | 1969-02-28 | 1970-02-27 | Electrical circuit arrangement with a hermetic seal |
FR7007129A FR2033131A5 (en) | 1969-02-28 | 1970-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB500869A GB1259804A (en) | 1969-02-28 | 1969-02-28 | Improvements in or relating to the manufacture of electrical circuit assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1259804A true GB1259804A (en) | 1972-01-12 |
Family
ID=9788012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB500869A Expired GB1259804A (en) | 1969-02-28 | 1969-02-28 | Improvements in or relating to the manufacture of electrical circuit assemblies |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE2010429A1 (en) |
FR (1) | FR2033131A5 (en) |
GB (1) | GB1259804A (en) |
NL (1) | NL7002256A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2237937A (en) * | 1989-11-07 | 1991-05-15 | Ryan Mining Services Limited | Electric switch for use in hazardous environments |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4266090A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package |
US4266089A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package having excellent heat transfer characteristics |
FR2456388A1 (en) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | ELECTRONIC CIRCUIT MICROBOX, AND HYBRID CIRCUIT HAVING SUCH A MICROBOX |
FR2653595B1 (en) * | 1989-10-25 | 1992-02-14 | Valtronic France | ELECTRONIC CIRCUIT WITH INTERCONNECTION GRID. |
DE4131534A1 (en) * | 1991-09-21 | 1993-04-01 | Standard Elektrik Lorenz Ag | DEVICE FOR THE INSULATED LEAD OUT OF PATHWAYS FROM A SHIELDING HOUSING |
-
1969
- 1969-02-28 GB GB500869A patent/GB1259804A/en not_active Expired
-
1970
- 1970-02-18 NL NL7002256A patent/NL7002256A/xx unknown
- 1970-02-27 FR FR7007129A patent/FR2033131A5/fr not_active Expired
- 1970-02-27 DE DE19702010429 patent/DE2010429A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2237937A (en) * | 1989-11-07 | 1991-05-15 | Ryan Mining Services Limited | Electric switch for use in hazardous environments |
Also Published As
Publication number | Publication date |
---|---|
FR2033131A5 (en) | 1970-11-27 |
DE2010429A1 (en) | 1970-09-10 |
NL7002256A (en) | 1970-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |