DE2946343C2 - Verfahren zur Vorbehandlung der Oberfläche von Polyamidsubstraten für die chemische Metallisierung - Google Patents

Verfahren zur Vorbehandlung der Oberfläche von Polyamidsubstraten für die chemische Metallisierung

Info

Publication number
DE2946343C2
DE2946343C2 DE2946343A DE2946343A DE2946343C2 DE 2946343 C2 DE2946343 C2 DE 2946343C2 DE 2946343 A DE2946343 A DE 2946343A DE 2946343 A DE2946343 A DE 2946343A DE 2946343 C2 DE2946343 C2 DE 2946343C2
Authority
DE
Germany
Prior art keywords
solution
acid
substrate
chemical
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2946343A
Other languages
German (de)
English (en)
Other versions
DE2946343A1 (de
Inventor
David A. 91792 West Covina Ca. Dillard
Lawrence P. 91780 Temple City Ca. Donovan
Eileen 91106 Arcadia Ca. Maguire
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Crown City Plating Co
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Publication of DE2946343A1 publication Critical patent/DE2946343A1/de
Application granted granted Critical
Publication of DE2946343C2 publication Critical patent/DE2946343C2/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/46—Post-polymerisation treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Polyamides (AREA)
DE2946343A 1978-12-19 1979-11-16 Verfahren zur Vorbehandlung der Oberfläche von Polyamidsubstraten für die chemische Metallisierung Expired DE2946343C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97092378A 1978-12-19 1978-12-19

Publications (2)

Publication Number Publication Date
DE2946343A1 DE2946343A1 (de) 1980-06-26
DE2946343C2 true DE2946343C2 (de) 1983-03-24

Family

ID=25517714

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2946343A Expired DE2946343C2 (de) 1978-12-19 1979-11-16 Verfahren zur Vorbehandlung der Oberfläche von Polyamidsubstraten für die chemische Metallisierung

Country Status (6)

Country Link
JP (1) JPS55112238A (enrdf_load_stackoverflow)
CA (1) CA1143260A (enrdf_load_stackoverflow)
DE (1) DE2946343C2 (enrdf_load_stackoverflow)
FR (1) FR2444691A1 (enrdf_load_stackoverflow)
GB (1) GB2040969B (enrdf_load_stackoverflow)
IT (1) IT1164546B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4328883A1 (de) * 1993-08-27 1995-03-02 Bayer Ag Verfahren zur Vorbereitung von Polyamidformteilen für die nachfolgende stromlose Metallisierung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
DE3137587A1 (de) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
JPH0427472A (ja) * 1990-05-21 1992-01-30 Nippon Parkerizing Co Ltd 樹脂成型品の洗浄方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
US3595761A (en) * 1965-02-18 1971-07-27 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials
US3377187A (en) * 1967-02-21 1968-04-09 American Cyanamid Co Glossy, transparent nylon film having an ionically reacted content of a strongly acidic material and method of making same
DE1920238A1 (de) * 1969-04-22 1970-11-12 Du Pont Deutschland Verfahren zur Vorbehandlung der Oberflaeche von Formteilen aus Polyoxymethylen-Homopolymerisaten
US3686017A (en) * 1970-10-05 1972-08-22 Monsanto Co Surface treatment of nylon shaped articles with aqueous reducing agents
BE792310A (fr) * 1971-12-08 1973-06-05 Kalle Ag Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides
FR2131563A7 (en) * 1972-03-23 1972-11-10 Dynachim Sarl Metal coating - of non-metallic substrates
FR2199012A1 (en) * 1972-09-11 1974-04-05 Aries Robert Etching compsn. for metallisation process - contg alkali hydroxide, org. solvent and surfactant
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4328883A1 (de) * 1993-08-27 1995-03-02 Bayer Ag Verfahren zur Vorbereitung von Polyamidformteilen für die nachfolgende stromlose Metallisierung

Also Published As

Publication number Publication date
GB2040969B (en) 1983-04-13
CA1143260A (en) 1983-03-22
FR2444691A1 (fr) 1980-07-18
JPS55112238A (en) 1980-08-29
FR2444691B1 (enrdf_load_stackoverflow) 1983-11-04
IT1164546B (it) 1987-04-15
GB2040969A (en) 1980-09-03
JPS633950B2 (enrdf_load_stackoverflow) 1988-01-26
IT7928067A0 (it) 1979-12-17
DE2946343A1 (de) 1980-06-26

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee