FR2444691A1 - Procede pour preparer la surface d'un substrat en polyamide a recevoir un depot chimique - Google Patents

Procede pour preparer la surface d'un substrat en polyamide a recevoir un depot chimique

Info

Publication number
FR2444691A1
FR2444691A1 FR7930961A FR7930961A FR2444691A1 FR 2444691 A1 FR2444691 A1 FR 2444691A1 FR 7930961 A FR7930961 A FR 7930961A FR 7930961 A FR7930961 A FR 7930961A FR 2444691 A1 FR2444691 A1 FR 2444691A1
Authority
FR
France
Prior art keywords
chemical
preparing
receive
solution
chemical deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7930961A
Other languages
English (en)
Other versions
FR2444691B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Crown City Plating Co
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Publication of FR2444691A1 publication Critical patent/FR2444691A1/fr
Application granted granted Critical
Publication of FR2444691B1 publication Critical patent/FR2444691B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/46—Post-polymerisation treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Polyamides (AREA)

Abstract

L'invention concerne la mise en condition de polyamides en vue de la formation d'un dépôt chimique. Des substrats en polyamide sont pré-conditionnés en vue d'un dépôt chimique par contact avec une solution aqueuse alcaline de pH au moins égal à 10 et attaqués chimiquement avec une solution d'acide. Cette solution est de préférence une solution aqueuse d'un acide organique contenant au moins 2 atomes de carbone, notamment un composé du type de l'acide acétique tel que l'acide trichloracétique. Application au revêtement chimique de polyamides, notamment en vue de rendre leur surface uniformément réceptive envers des métaux qui catalysent le dépôt chimique de nickel et de cuivre.
FR7930961A 1978-12-19 1979-12-18 Procede pour preparer la surface d'un substrat en polyamide a recevoir un depot chimique Granted FR2444691A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97092378A 1978-12-19 1978-12-19

Publications (2)

Publication Number Publication Date
FR2444691A1 true FR2444691A1 (fr) 1980-07-18
FR2444691B1 FR2444691B1 (fr) 1983-11-04

Family

ID=25517714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7930961A Granted FR2444691A1 (fr) 1978-12-19 1979-12-18 Procede pour preparer la surface d'un substrat en polyamide a recevoir un depot chimique

Country Status (6)

Country Link
JP (1) JPS55112238A (fr)
CA (1) CA1143260A (fr)
DE (1) DE2946343C2 (fr)
FR (1) FR2444691A1 (fr)
GB (1) GB2040969B (fr)
IT (1) IT1164546B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991018046A1 (fr) * 1990-05-21 1991-11-28 Henkel Corporation Procede de lavage d'articles fabriques a base de resine moulee

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
DE3137587A1 (de) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen
DE4328883C2 (de) * 1993-08-27 1996-08-14 Bayer Ag Verfahren zur Vorbereitung von Polyamidformteilen für die nachfolgende stromlose Metallisierung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377187A (en) * 1967-02-21 1968-04-09 American Cyanamid Co Glossy, transparent nylon film having an ionically reacted content of a strongly acidic material and method of making same
DE1920238A1 (de) * 1969-04-22 1970-11-12 Du Pont Deutschland Verfahren zur Vorbehandlung der Oberflaeche von Formteilen aus Polyoxymethylen-Homopolymerisaten
US3595761A (en) * 1965-02-18 1971-07-27 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
US3686017A (en) * 1970-10-05 1972-08-22 Monsanto Co Surface treatment of nylon shaped articles with aqueous reducing agents
FR2131563A7 (en) * 1972-03-23 1972-11-10 Dynachim Sarl Metal coating - of non-metallic substrates
FR2199012A1 (en) * 1972-09-11 1974-04-05 Aries Robert Etching compsn. for metallisation process - contg alkali hydroxide, org. solvent and surfactant

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials
BE792310A (fr) * 1971-12-08 1973-06-05 Kalle Ag Procede pour le depot de couches de cuivre sur des pieces moulees en polyimides
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3595761A (en) * 1965-02-18 1971-07-27 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
US3377187A (en) * 1967-02-21 1968-04-09 American Cyanamid Co Glossy, transparent nylon film having an ionically reacted content of a strongly acidic material and method of making same
DE1920238A1 (de) * 1969-04-22 1970-11-12 Du Pont Deutschland Verfahren zur Vorbehandlung der Oberflaeche von Formteilen aus Polyoxymethylen-Homopolymerisaten
US3686017A (en) * 1970-10-05 1972-08-22 Monsanto Co Surface treatment of nylon shaped articles with aqueous reducing agents
FR2131563A7 (en) * 1972-03-23 1972-11-10 Dynachim Sarl Metal coating - of non-metallic substrates
FR2199012A1 (en) * 1972-09-11 1974-04-05 Aries Robert Etching compsn. for metallisation process - contg alkali hydroxide, org. solvent and surfactant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991018046A1 (fr) * 1990-05-21 1991-11-28 Henkel Corporation Procede de lavage d'articles fabriques a base de resine moulee

Also Published As

Publication number Publication date
IT7928067A0 (it) 1979-12-17
GB2040969A (en) 1980-09-03
IT1164546B (it) 1987-04-15
DE2946343A1 (de) 1980-06-26
DE2946343C2 (de) 1983-03-24
CA1143260A (fr) 1983-03-22
JPS633950B2 (fr) 1988-01-26
JPS55112238A (en) 1980-08-29
FR2444691B1 (fr) 1983-11-04
GB2040969B (en) 1983-04-13

Similar Documents

Publication Publication Date Title
CA1177204A (fr) Methode et composition pour la dorure par immersion
FR2442278A2 (fr) Composition et procede pour depot continu et non electrolytique de cuivre, a l'aide d'un hypophosphite comme reducteur et en presence d'ions cobalt ou nickel
US3486928A (en) Bath and process for platinum and platinum alloys
US4144141A (en) Ammonia free palladium deposition using aminoacetic acid
KR870010216A (ko) 무전해 구리도금 및 이에 사용되는 도금욕
Iacovangelo Autocatalytic electroless gold deposition using hydrazine and dimethylamine borane as reducing agents
US6620304B1 (en) Bath system for galvanic deposition of metals
US6020021A (en) Method for depositing electroless nickel phosphorus alloys
FR2444691A1 (fr) Procede pour preparer la surface d'un substrat en polyamide a recevoir un depot chimique
US4980035A (en) Bath for electrolytic deposition of a gold-copper-zinc alloy
US3684534A (en) Method for stabilizing palladium containing solutions
US3389060A (en) Method of indium coating metallic articles
EP0112561B1 (fr) Solutions de dépôt électrolytique aqueuses et procédé de dépôt électrolytique d'alliages palladium-argent
US3468676A (en) Electroless gold plating
FR2444692A1 (fr) Procede pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un depot chimique
ATE33686T1 (de) Elektrolytische abscheidung von chrom und seinen legierungen.
FR2383882A1 (fr) Procede pour la preparation de graphite active et catalyseurs a base de ce graphite active
US3130072A (en) Silver-palladium immersion plating composition and process
US4118234A (en) Electroless copper plating bath
FR2434873A1 (fr) Bain et procede de depot electrolytique d'un alliage d'or
FR2506790A1 (fr) Bain et procede de depot electrolytique de ruthenium
US5322552A (en) Stable, electroless, aqueous, acidic gold bath for depositing gold and the use thereof
EP0343816A1 (fr) Procédé de dépôt chimique
US4545869A (en) Bath and process for high speed electroplating of palladium
US4299670A (en) Palladium plating procedure and bath

Legal Events

Date Code Title Description
ST Notification of lapse