DE2934994C2 - - Google Patents
Info
- Publication number
 - DE2934994C2 DE2934994C2 DE2934994A DE2934994A DE2934994C2 DE 2934994 C2 DE2934994 C2 DE 2934994C2 DE 2934994 A DE2934994 A DE 2934994A DE 2934994 A DE2934994 A DE 2934994A DE 2934994 C2 DE2934994 C2 DE 2934994C2
 - Authority
 - DE
 - Germany
 - Prior art keywords
 - epitaxial
 - layer
 - substrate
 - layers
 - gaas
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired
 
Links
- 239000010410 layer Substances 0.000 claims description 134
 - 239000000758 substrate Substances 0.000 claims description 43
 - 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 39
 - 239000013078 crystal Substances 0.000 claims description 34
 - 238000000034 method Methods 0.000 claims description 28
 - 239000000463 material Substances 0.000 claims description 23
 - 239000004065 semiconductor Substances 0.000 claims description 19
 - 239000000203 mixture Substances 0.000 claims description 15
 - 150000001875 compounds Chemical class 0.000 claims description 12
 - 238000004519 manufacturing process Methods 0.000 claims description 9
 - 239000000126 substance Substances 0.000 claims description 8
 - 238000000407 epitaxy Methods 0.000 claims description 7
 - 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 6
 - 239000011229 interlayer Substances 0.000 claims description 6
 - 239000007791 liquid phase Substances 0.000 claims description 6
 - 238000012545 processing Methods 0.000 claims description 5
 - 229910000673 Indium arsenide Inorganic materials 0.000 claims description 3
 - RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 3
 - 229910005540 GaP Inorganic materials 0.000 claims 1
 - JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 33
 - 238000007792 addition Methods 0.000 description 5
 - 229910052787 antimony Inorganic materials 0.000 description 5
 - 230000015572 biosynthetic process Effects 0.000 description 5
 - 239000006193 liquid solution Substances 0.000 description 5
 - 230000007547 defect Effects 0.000 description 4
 - 229910005542 GaSb Inorganic materials 0.000 description 3
 - ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
 - 230000001488 breeding effect Effects 0.000 description 3
 - 238000000151 deposition Methods 0.000 description 3
 - 230000008021 deposition Effects 0.000 description 3
 - 238000002474 experimental method Methods 0.000 description 3
 - 239000013307 optical fiber Substances 0.000 description 3
 - 230000008569 process Effects 0.000 description 3
 - GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
 - WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
 - 238000003491 array Methods 0.000 description 2
 - 238000009395 breeding Methods 0.000 description 2
 - 229910052729 chemical element Inorganic materials 0.000 description 2
 - 238000010276 construction Methods 0.000 description 2
 - 230000003247 decreasing effect Effects 0.000 description 2
 - 229910052732 germanium Inorganic materials 0.000 description 2
 - GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
 - 238000001465 metallisation Methods 0.000 description 2
 - 230000003287 optical effect Effects 0.000 description 2
 - 239000007858 starting material Substances 0.000 description 2
 - 239000002344 surface layer Substances 0.000 description 2
 - -1 InAsSb Chemical compound 0.000 description 1
 - 238000010521 absorption reaction Methods 0.000 description 1
 - 239000000654 additive Substances 0.000 description 1
 - 230000000996 additive effect Effects 0.000 description 1
 - AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
 - 229910052782 aluminium Inorganic materials 0.000 description 1
 - XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
 - 230000004888 barrier function Effects 0.000 description 1
 - 229910052790 beryllium Inorganic materials 0.000 description 1
 - ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
 - 230000008859 change Effects 0.000 description 1
 - 238000004891 communication Methods 0.000 description 1
 - 230000008878 coupling Effects 0.000 description 1
 - 238000010168 coupling process Methods 0.000 description 1
 - 238000005859 coupling reaction Methods 0.000 description 1
 - 238000012364 cultivation method Methods 0.000 description 1
 - 230000007423 decrease Effects 0.000 description 1
 - 230000000994 depressogenic effect Effects 0.000 description 1
 - 239000006185 dispersion Substances 0.000 description 1
 - 230000000694 effects Effects 0.000 description 1
 - 230000002349 favourable effect Effects 0.000 description 1
 - 229910052733 gallium Inorganic materials 0.000 description 1
 - PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
 - 239000010931 gold Substances 0.000 description 1
 - 229910052737 gold Inorganic materials 0.000 description 1
 - 238000002347 injection Methods 0.000 description 1
 - 239000007924 injection Substances 0.000 description 1
 - 229910000765 intermetallic Inorganic materials 0.000 description 1
 - 238000011835 investigation Methods 0.000 description 1
 - 238000004943 liquid phase epitaxy Methods 0.000 description 1
 - 238000001556 precipitation Methods 0.000 description 1
 - 238000004321 preservation Methods 0.000 description 1
 - 230000005855 radiation Effects 0.000 description 1
 - 239000002994 raw material Substances 0.000 description 1
 - 230000006798 recombination Effects 0.000 description 1
 - 238000005215 recombination Methods 0.000 description 1
 - 229910052710 silicon Inorganic materials 0.000 description 1
 - 239000010703 silicon Substances 0.000 description 1
 - 239000006104 solid solution Substances 0.000 description 1
 - 239000000243 solution Substances 0.000 description 1
 - 238000003786 synthesis reaction Methods 0.000 description 1
 - 230000007704 transition Effects 0.000 description 1
 - 239000012808 vapor phase Substances 0.000 description 1
 
Classifications
- 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
 - H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
 - H10H20/80—Constructional details
 - H10H20/81—Bodies
 - H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02367—Substrates
 - H01L21/0237—Materials
 - H01L21/02387—Group 13/15 materials
 - H01L21/02392—Phosphides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02367—Substrates
 - H01L21/0237—Materials
 - H01L21/02387—Group 13/15 materials
 - H01L21/02395—Arsenides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02436—Intermediate layers between substrates and deposited layers
 - H01L21/02439—Materials
 - H01L21/02455—Group 13/15 materials
 - H01L21/02461—Phosphides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02436—Intermediate layers between substrates and deposited layers
 - H01L21/02439—Materials
 - H01L21/02455—Group 13/15 materials
 - H01L21/02463—Arsenides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02436—Intermediate layers between substrates and deposited layers
 - H01L21/02439—Materials
 - H01L21/02455—Group 13/15 materials
 - H01L21/02466—Antimonides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02436—Intermediate layers between substrates and deposited layers
 - H01L21/02494—Structure
 - H01L21/02496—Layer structure
 - H01L21/02505—Layer structure consisting of more than two layers
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02518—Deposited layers
 - H01L21/02521—Materials
 - H01L21/02538—Group 13/15 materials
 - H01L21/02543—Phosphides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02518—Deposited layers
 - H01L21/02521—Materials
 - H01L21/02538—Group 13/15 materials
 - H01L21/02546—Arsenides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02518—Deposited layers
 - H01L21/02521—Materials
 - H01L21/02538—Group 13/15 materials
 - H01L21/02549—Antimonides
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02612—Formation types
 - H01L21/02617—Deposition types
 - H01L21/02623—Liquid deposition
 - H01L21/02625—Liquid deposition using melted materials
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02612—Formation types
 - H01L21/02617—Deposition types
 - H01L21/02623—Liquid deposition
 - H01L21/02628—Liquid deposition using solutions
 
 - 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
 - H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
 - H10D62/40—Crystalline structures
 
 - 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
 - H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
 - H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
 - H10D62/82—Heterojunctions
 - H10D62/824—Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
 
 - 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
 - H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
 - H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
 - H10D62/82—Heterojunctions
 - H10D62/826—Heterojunctions comprising only Group II-VI materials heterojunctions, e.g. CdTe/HgTe heterojunctions
 
 - 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
 - H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
 - H10H20/80—Constructional details
 - H10H20/81—Bodies
 - H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
 
 - 
        
- H—ELECTRICITY
 - H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
 - H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
 - H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
 - H10H20/80—Constructional details
 - H10H20/81—Bodies
 - H10H20/822—Materials of the light-emitting regions
 - H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
 
 - 
        
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
 - Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10S438/00—Semiconductor device manufacturing: process
 - Y10S438/938—Lattice strain control or utilization
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Condensed Matter Physics & Semiconductors (AREA)
 - General Physics & Mathematics (AREA)
 - Manufacturing & Machinery (AREA)
 - Computer Hardware Design (AREA)
 - Physics & Mathematics (AREA)
 - Power Engineering (AREA)
 - Chemical & Material Sciences (AREA)
 - Materials Engineering (AREA)
 - Led Devices (AREA)
 - Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
 - Semiconductor Lasers (AREA)
 - Crystals, And After-Treatments Of Crystals (AREA)
 - Recrystallisation Techniques (AREA)
 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| FR7825861A FR2435816A1 (fr) | 1978-09-08 | 1978-09-08 | Procede de realisation, par epitaxie, d'un dispositif semi-conducteur a structure multicouches et application de ce procede | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| DE2934994A1 DE2934994A1 (de) | 1980-03-20 | 
| DE2934994C2 true DE2934994C2 (instruction) | 1989-07-20 | 
Family
ID=9212457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| DE19792934994 Granted DE2934994A1 (de) | 1978-09-08 | 1979-08-30 | Verfahren zur epitaktischen herstellung einer halbleiteranordnung mit mehrschichtenstruktur und anwendung dieses verfahrens | 
Country Status (7)
| Country | Link | 
|---|---|
| US (1) | US4274890A (instruction) | 
| JP (1) | JPS5538096A (instruction) | 
| CA (1) | CA1134060A (instruction) | 
| DE (1) | DE2934994A1 (instruction) | 
| FR (1) | FR2435816A1 (instruction) | 
| GB (1) | GB2030767B (instruction) | 
| IT (1) | IT1123552B (instruction) | 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE19947020A1 (de) * | 1999-09-30 | 2001-04-19 | Infineon Technologies Ag | Kompensationsbauelement mit variabler Ladungsbilanz | 
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US4319937A (en) * | 1980-11-12 | 1982-03-16 | University Of Illinois Foundation | Homogeneous liquid phase epitaxial growth of heterojunction materials | 
| US4517047A (en) * | 1981-01-23 | 1985-05-14 | The United States Of America As Represented By The Secretary Of The Army | MBE growth technique for matching superlattices grown on GaAs substrates | 
| JPH0650723B2 (ja) * | 1984-10-17 | 1994-06-29 | 日本電気株式会社 | エピタキシヤル成長方法 | 
| JPS61172381A (ja) * | 1984-12-22 | 1986-08-04 | Fujitsu Ltd | InP系化合物半導体装置 | 
| US4548658A (en) * | 1985-01-30 | 1985-10-22 | Cook Melvin S | Growth of lattice-graded epilayers | 
| IL78840A0 (en) * | 1985-10-17 | 1986-09-30 | Holobeam | Lattice-graded epilayer | 
| US5326716A (en) * | 1986-02-11 | 1994-07-05 | Max Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Liquid phase epitaxial process for producing three-dimensional semiconductor structures by liquid phase expitaxy | 
| FR2595509B1 (fr) * | 1986-03-07 | 1988-05-13 | Thomson Csf | Composant en materiau semiconducteur epitaxie sur un substrat a parametre de maille different et application a divers composants en semiconducteurs | 
| JPH01117728A (ja) * | 1987-10-30 | 1989-05-10 | Masatoshi Shinozaki | 根無しもやしの製造方法 | 
| GB2213634B (en) * | 1987-12-08 | 1992-03-18 | Third Generation Technology Li | Photocathode structures | 
| US5264070A (en) * | 1990-10-09 | 1993-11-23 | Motorola, Inc. | Method of growth-orientation of a crystal on a device using an oriented seed layer | 
| DE102005047152A1 (de) | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Epitaxiesubstrat, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Halbleiterchips | 
| US8159791B2 (en) | 2008-02-06 | 2012-04-17 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetoresistive sensor having quantum well structure and a trapping layer for preventing charge carrier migration | 
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3982261A (en) * | 1972-09-22 | 1976-09-21 | Varian Associates | Epitaxial indium-gallium-arsenide phosphide layer on lattice-matched indium-phosphide substrate and devices | 
| US3958263A (en) * | 1973-11-12 | 1976-05-18 | Bell Telephone Laboratories, Incorporated | Stress reduction in algaas-algaasp multilayer structures | 
| US3962716A (en) * | 1973-11-12 | 1976-06-08 | Bell Telephone Laboratories, Incorporated | Reduction of dislocations in multilayer structures of zinc-blend materials | 
| US3963538A (en) * | 1974-12-17 | 1976-06-15 | International Business Machines Corporation | Two stage heteroepitaxial deposition process for GaP/Si | 
| US3995303A (en) * | 1975-06-05 | 1976-11-30 | Bell Telephone Laboratories, Incorporated | Growth and operation of a step-graded ternary III-V heterojunction p-n diode photodetector | 
| US4032951A (en) * | 1976-04-13 | 1977-06-28 | Bell Telephone Laboratories, Incorporated | Growth of iii-v layers containing arsenic, antimony and phosphorus, and device uses | 
| US4136350A (en) * | 1977-07-14 | 1979-01-23 | Bell Telephone Laboratories, Incorporated | Epitaxial growth of dissimilar materials | 
- 
        1978
        
- 1978-09-08 FR FR7825861A patent/FR2435816A1/fr active Granted
 
 - 
        1979
        
- 1979-08-30 DE DE19792934994 patent/DE2934994A1/de active Granted
 - 1979-08-30 CA CA334,763A patent/CA1134060A/en not_active Expired
 - 1979-09-04 US US06/072,257 patent/US4274890A/en not_active Expired - Lifetime
 - 1979-09-05 IT IT25506/79A patent/IT1123552B/it active
 - 1979-09-05 GB GB7930696A patent/GB2030767B/en not_active Expired
 - 1979-09-07 JP JP11434679A patent/JPS5538096A/ja active Granted
 
 
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE19947020A1 (de) * | 1999-09-30 | 2001-04-19 | Infineon Technologies Ag | Kompensationsbauelement mit variabler Ladungsbilanz | 
| DE19947020B4 (de) * | 1999-09-30 | 2006-02-23 | Infineon Technologies Ag | Kompensationsbauelement mit variabler Ladungsbilanz und dessen Herstellungsverfahren | 
Also Published As
| Publication number | Publication date | 
|---|---|
| IT1123552B (it) | 1986-04-30 | 
| US4274890A (en) | 1981-06-23 | 
| GB2030767B (en) | 1983-03-02 | 
| JPS5745055B2 (instruction) | 1982-09-25 | 
| JPS5538096A (en) | 1980-03-17 | 
| GB2030767A (en) | 1980-04-10 | 
| FR2435816B1 (instruction) | 1982-04-16 | 
| DE2934994A1 (de) | 1980-03-20 | 
| CA1134060A (en) | 1982-10-19 | 
| FR2435816A1 (fr) | 1980-04-04 | 
| IT7925506A0 (it) | 1979-09-05 | 
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