DE2926154C2 - Drucksensor mit einer Halbleitermembran - Google Patents

Drucksensor mit einer Halbleitermembran

Info

Publication number
DE2926154C2
DE2926154C2 DE2926154A DE2926154A DE2926154C2 DE 2926154 C2 DE2926154 C2 DE 2926154C2 DE 2926154 A DE2926154 A DE 2926154A DE 2926154 A DE2926154 A DE 2926154A DE 2926154 C2 DE2926154 C2 DE 2926154C2
Authority
DE
Germany
Prior art keywords
housing
pressure sensor
pressure
sensor according
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2926154A
Other languages
German (de)
English (en)
Other versions
DE2926154A1 (de
Inventor
Teruyoshi Yokohama Mihara
Tamotsu Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Publication of DE2926154A1 publication Critical patent/DE2926154A1/de
Application granted granted Critical
Publication of DE2926154C2 publication Critical patent/DE2926154C2/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE2926154A 1978-08-10 1979-06-28 Drucksensor mit einer Halbleitermembran Expired DE2926154C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9672278A JPS5524423A (en) 1978-08-10 1978-08-10 Semiconductor pressure sensor

Publications (2)

Publication Number Publication Date
DE2926154A1 DE2926154A1 (de) 1980-02-14
DE2926154C2 true DE2926154C2 (de) 1985-06-13

Family

ID=14172619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2926154A Expired DE2926154C2 (de) 1978-08-10 1979-06-28 Drucksensor mit einer Halbleitermembran

Country Status (5)

Country Link
US (1) US4314225A (Sortimente)
JP (1) JPS5524423A (Sortimente)
DE (1) DE2926154C2 (Sortimente)
FR (1) FR2433176A1 (Sortimente)
GB (1) GB2027988B (Sortimente)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840941A1 (de) * 1987-12-07 1989-06-15 Vaisala Oy Druckwandler

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US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US20020090749A1 (en) * 2001-01-09 2002-07-11 3M Innovative Properties Company Hermetic package for mems devices with integrated carrier
US20020089044A1 (en) * 2001-01-09 2002-07-11 3M Innovative Properties Company Hermetic mems package with interlocking layers
US6469909B2 (en) 2001-01-09 2002-10-22 3M Innovative Properties Company MEMS package with flexible circuit interconnect
JP4892781B2 (ja) * 2001-01-18 2012-03-07 富士電機株式会社 半導体物理量センサ
US8337166B2 (en) * 2001-11-26 2012-12-25 Shurflo, Llc Pump and pump control circuit apparatus and method
AU2003294666A1 (en) * 2002-12-12 2004-06-30 Danfoss A/S A pressure sensor
JP4774678B2 (ja) * 2003-08-29 2011-09-14 富士電機株式会社 圧力センサ装置
FI115487B (fi) * 2004-05-03 2005-05-13 Vti Technologies Oy Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi
JP2006023115A (ja) * 2004-07-06 2006-01-26 Surpass Kogyo Kk 絶対圧形圧力センサの製造方法および製造装置
JP4839648B2 (ja) * 2005-03-23 2011-12-21 富士電機株式会社 圧力センサ装置
US7089798B2 (en) * 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with thin membrane
EP1830167A3 (en) * 2006-03-02 2010-01-20 Alps Electric Co., Ltd. Pressure sensor having gold-silicon eutectic crystal layer interposed between contact layer and silicon substrate
US7930944B2 (en) * 2008-05-14 2011-04-26 Honeywell International Inc. ASIC compensated pressure sensor with soldered sense die attach
EP2312290B1 (de) * 2009-10-16 2019-09-25 First Sensor Mobility GmbH Drucksensor und dessen Verwendung in einem Fluidtank
CN102859688B (zh) * 2010-02-26 2015-05-27 优博创新科技产权有限公司 用于微机电系统器件的半导体封装体及其制造方法
JP5847385B2 (ja) * 2010-08-31 2016-01-20 ミツミ電機株式会社 圧力センサ装置及び該装置を備える電子機器、並びに該装置の実装方法
US8378435B2 (en) 2010-12-06 2013-02-19 Wai Yew Lo Pressure sensor and method of assembling same
CN102589753B (zh) 2011-01-05 2016-05-04 飞思卡尔半导体公司 压力传感器及其封装方法
US8371176B2 (en) 2011-01-06 2013-02-12 Honeywell International Inc. Media isolated pressure sensor
US9029999B2 (en) 2011-11-23 2015-05-12 Freescale Semiconductor, Inc. Semiconductor sensor device with footed lid
US8516897B1 (en) 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
US8890308B2 (en) * 2012-04-06 2014-11-18 Freescale Semiconductor, Inc. Integrated circuit package and method of forming the same
ITTO20120542A1 (it) 2012-06-20 2013-12-21 St Microelectronics Srl Dispositivo microelettromeccanico con instradamento dei segnali attraverso un cappuccio protettivo e metodo per controllare un dispositivo microelettromeccanico
US20140071642A1 (en) * 2012-09-11 2014-03-13 Horst Theuss Low stress component package
DE102013101731A1 (de) * 2013-02-21 2014-09-04 Epcos Ag Drucksensorsystem
DE102013101732A1 (de) * 2013-02-21 2014-08-21 Epcos Ag Sensorsystem
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JP5783297B2 (ja) * 2013-08-06 2015-09-24 株式会社デンソー 力学量センサ
US9297713B2 (en) 2014-03-19 2016-03-29 Freescale Semiconductor,Inc. Pressure sensor device with through silicon via
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
US9362479B2 (en) 2014-07-22 2016-06-07 Freescale Semiconductor, Inc. Package-in-package semiconductor sensor device
DE102014119396A1 (de) * 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung
CN107290096A (zh) 2016-04-11 2017-10-24 飞思卡尔半导体公司 具有膜片的压力感测集成电路器件
CN107527874B (zh) 2016-06-20 2023-08-01 恩智浦美国有限公司 腔式压力传感器器件
JP2018048964A (ja) * 2016-09-23 2018-03-29 株式会社鷺宮製作所 圧力センサ
JP6895289B2 (ja) * 2017-03-29 2021-06-30 株式会社堀場エステック 圧力センサ
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DE102018111898B4 (de) 2017-06-06 2025-10-16 Schott Ag Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Bauelement

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840941A1 (de) * 1987-12-07 1989-06-15 Vaisala Oy Druckwandler

Also Published As

Publication number Publication date
FR2433176B1 (Sortimente) 1982-09-24
GB2027988B (en) 1982-11-24
DE2926154A1 (de) 1980-02-14
JPS5524423A (en) 1980-02-21
JPS6153876B2 (Sortimente) 1986-11-19
FR2433176A1 (fr) 1980-03-07
US4314225A (en) 1982-02-02
GB2027988A (en) 1980-02-27

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Legal Events

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OAP Request for examination filed
OD Request for examination
OF Willingness to grant licences before publication of examined application
D2 Grant after examination
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8380 Miscellaneous part iii

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