DE2862150D1 - Method for reactive ion etching of an element - Google Patents
Method for reactive ion etching of an elementInfo
- Publication number
- DE2862150D1 DE2862150D1 DE7878430010T DE2862150T DE2862150D1 DE 2862150 D1 DE2862150 D1 DE 2862150D1 DE 7878430010 T DE7878430010 T DE 7878430010T DE 2862150 T DE2862150 T DE 2862150T DE 2862150 D1 DE2862150 D1 DE 2862150D1
- Authority
- DE
- Germany
- Prior art keywords
- reactive ion
- ion etching
- etching
- reactive
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P50/283—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84008577A | 1977-10-06 | 1977-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2862150D1 true DE2862150D1 (en) | 1983-02-17 |
Family
ID=25281410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE7878430010T Expired DE2862150D1 (en) | 1977-10-06 | 1978-08-25 | Method for reactive ion etching of an element |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0001538B1 (OSRAM) |
| JP (1) | JPS5455174A (OSRAM) |
| DE (1) | DE2862150D1 (OSRAM) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1584364A (en) * | 1976-06-21 | 1981-02-11 | Unilever Ltd | Shampoo |
| JPS5691447A (en) * | 1979-12-25 | 1981-07-24 | Seiko Epson Corp | Forming of element segregation region of semiconductor integrated circuit |
| JPS5691446A (en) * | 1979-12-25 | 1981-07-24 | Seiko Epson Corp | Forming of element segregation region of semiconductor integrated circuit |
| US4324611A (en) * | 1980-06-26 | 1982-04-13 | Branson International Plasma Corporation | Process and gas mixture for etching silicon dioxide and silicon nitride |
| US4333793A (en) * | 1980-10-20 | 1982-06-08 | Bell Telephone Laboratories, Incorporated | High-selectivity plasma-assisted etching of resist-masked layer |
| JPS5775429A (en) * | 1980-10-28 | 1982-05-12 | Toshiba Corp | Manufacture of semiconductor device |
| DE3175576D1 (en) * | 1980-12-11 | 1986-12-11 | Toshiba Kk | Dry etching device and method |
| JPS62228491A (ja) * | 1986-03-31 | 1987-10-07 | Canon Inc | ドライエツチングガス及びドライエツチング方法 |
| JPH088238B2 (ja) * | 1987-11-19 | 1996-01-29 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| WO1990005994A1 (fr) * | 1988-11-18 | 1990-05-31 | Kabushiki Kaisha Tokuda Seisakusho | Procede de gravure par la voie seche |
| DE68903951T2 (de) * | 1989-08-16 | 1993-07-08 | Ibm | Verfahren fuer die herstellung mikromechanischer messfuehler fuer afm/stm-profilometrie und mikromechanischer messfuehlerkopf. |
| DE10224137A1 (de) * | 2002-05-24 | 2003-12-04 | Infineon Technologies Ag | Ätzgas und Verfahren zum Trockenätzen |
| JP5208020B2 (ja) * | 2009-02-26 | 2013-06-12 | 京セラ株式会社 | 反応性イオンエッチング装置と基板のエッチング方法 |
| JP6568822B2 (ja) * | 2016-05-16 | 2019-08-28 | 東京エレクトロン株式会社 | エッチング方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1417085A (en) * | 1973-05-17 | 1975-12-10 | Standard Telephones Cables Ltd | Plasma etching |
-
1978
- 1978-08-25 EP EP78430010A patent/EP0001538B1/fr not_active Expired
- 1978-08-25 DE DE7878430010T patent/DE2862150D1/de not_active Expired
- 1978-09-08 JP JP10987778A patent/JPS5455174A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0001538A1 (fr) | 1979-04-18 |
| EP0001538B1 (fr) | 1983-01-12 |
| JPS5455174A (en) | 1979-05-02 |
| JPS6158975B2 (OSRAM) | 1986-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8339 | Ceased/non-payment of the annual fee |