DE2860348D1 - Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites - Google Patents

Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites

Info

Publication number
DE2860348D1
DE2860348D1 DE7878300619T DE2860348T DE2860348D1 DE 2860348 D1 DE2860348 D1 DE 2860348D1 DE 7878300619 T DE7878300619 T DE 7878300619T DE 2860348 T DE2860348 T DE 2860348T DE 2860348 D1 DE2860348 D1 DE 2860348D1
Authority
DE
Germany
Prior art keywords
multiplicity
singly
substrate providing
chip sites
soldering chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7878300619T
Other languages
English (en)
Inventor
Robert H Meyen
Karl J Puttlitz
Karl Schink
Herbert Wenskus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE2860348D1 publication Critical patent/DE2860348D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75283—Means for applying energy, e.g. heating means by infrared heating, e.g. infrared heating lamp
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/8123—Polychromatic or infrared lamp heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE7878300619T 1977-12-29 1978-11-13 Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites Expired DE2860348D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/865,768 US4160893A (en) 1977-12-29 1977-12-29 Individual chip joining machine

Publications (1)

Publication Number Publication Date
DE2860348D1 true DE2860348D1 (en) 1981-02-12

Family

ID=25346189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7878300619T Expired DE2860348D1 (en) 1977-12-29 1978-11-13 Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites

Country Status (4)

Country Link
US (1) US4160893A (de)
EP (1) EP0002884B1 (de)
JP (1) JPS5492546A (de)
DE (1) DE2860348D1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451324A (en) * 1979-05-12 1984-05-29 Sony Corporation Apparatus for placing chip type circuit elements on a board
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
JPS61196515A (ja) * 1985-02-26 1986-08-30 Mitsubishi Electric Corp 帯域溶融型半導体製造装置
NL8501677A (nl) * 1985-06-11 1987-01-02 Littelfuse Tracor Werkwijze voor het bevestigen van een aansluitdraad aan een metalen eindkap van een smeltveiligheid.
FR2618606B1 (fr) * 1987-07-24 1990-02-16 Thomson Composants Militaires Four de soudure de puces de circuit integre
FR2646558B1 (fr) * 1989-04-26 1994-04-01 Commissariat A Energie Atomique Procede et machine d'interconnexion de composants electriques par elements de soudure
DE69009421T2 (de) * 1989-12-20 1994-12-15 Philips Nv Verfahren zum Simultananordnen und Verlöten von SMD-Bauteilen.
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
US5128506A (en) * 1990-10-30 1992-07-07 Westinghouse Electric Corp. Method and apparatus for selective infrared soldering using shielding fixtures
JPH0750053Y2 (ja) * 1991-01-30 1995-11-15 株式会社精工舎 リフロー炉
JPH0589943A (ja) * 1991-09-27 1993-04-09 Haibetsuku:Kk 自己冷却型小型スポツトヒータ
US5299279A (en) * 1992-12-01 1994-03-29 Ilc Technology, Inc. Short arc lamp soldering device
US5532457A (en) * 1994-06-22 1996-07-02 International Business Machines Corporation Modified quartz plate to provide non-uniform light source
US5735450A (en) * 1996-06-21 1998-04-07 International Business Machines Corporation Apparatus and method for heating a board-mounted electrical module for rework
US5909837A (en) * 1997-05-09 1999-06-08 Quad Systems Corporation Contactless bonding tool heater
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US6152353A (en) * 1999-01-14 2000-11-28 Celestica International Inc. Printed circuit board header attachment station
JP2001077524A (ja) * 1999-09-03 2001-03-23 Fujitsu Ltd リフロー半田付け装置及びリフロー半田付け方法
US6533577B2 (en) 2001-02-02 2003-03-18 Cvd Equipment Corporation Compartmentalized oven
GB2473600B (en) * 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
US9591795B2 (en) 2014-09-18 2017-03-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Sensor-based removal of a soldered device
DE102015006981B4 (de) * 2015-05-29 2018-09-27 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat
CN114466526A (zh) * 2021-11-02 2022-05-10 深圳市智链信息技术有限公司 一种无线接收信号放大器的芯片固定装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1781244A (en) * 1928-06-27 1930-11-11 Clyde D Oswald Hair-curling machine
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3165818A (en) * 1960-10-18 1965-01-19 Kulicke & Soffa Mfg Co Method for mounting and bonding semiconductor wafers
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
GB1236636A (en) * 1967-07-14 1971-06-23 Messer Griesheim Gmbh Apparatus for welding and cutting workpieces
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
US3568307A (en) * 1969-04-10 1971-03-09 Kulicke & Soffa Ind Inc Method of picking up and bonding semiconductor wafers to a carrier
US3628717A (en) * 1969-11-12 1971-12-21 Ibm Apparatus for positioning and bonding
US3710069A (en) * 1970-07-06 1973-01-09 Ibm Method of and apparatus for selective solder reflow
US3641648A (en) * 1970-08-20 1972-02-15 Bell Telephone Labor Inc Piece part handling apparatus
US3738560A (en) * 1970-12-08 1973-06-12 Kulicke & Soffa Ind Inc Semiconductor die bonder
DE2105513C3 (de) * 1971-02-05 1973-09-27 Siemens Ag, 1000 Berlin U. 8000 Muenchen Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
US3765475A (en) * 1971-06-04 1973-10-16 Iteck Corp Apparatus for soldering thick film substrates

Also Published As

Publication number Publication date
US4160893A (en) 1979-07-10
EP0002884B1 (de) 1980-11-26
JPS5492546A (en) 1979-07-21
EP0002884A1 (de) 1979-07-11
JPS5439581B2 (de) 1979-11-28

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee