JPS53142663A - Method of mounting ic chip - Google Patents

Method of mounting ic chip

Info

Publication number
JPS53142663A
JPS53142663A JP5637377A JP5637377A JPS53142663A JP S53142663 A JPS53142663 A JP S53142663A JP 5637377 A JP5637377 A JP 5637377A JP 5637377 A JP5637377 A JP 5637377A JP S53142663 A JPS53142663 A JP S53142663A
Authority
JP
Japan
Prior art keywords
chip
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5637377A
Other languages
Japanese (ja)
Inventor
Tokio Sakate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5637377A priority Critical patent/JPS53142663A/en
Publication of JPS53142663A publication Critical patent/JPS53142663A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP5637377A 1977-05-18 1977-05-18 Method of mounting ic chip Pending JPS53142663A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5637377A JPS53142663A (en) 1977-05-18 1977-05-18 Method of mounting ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5637377A JPS53142663A (en) 1977-05-18 1977-05-18 Method of mounting ic chip

Publications (1)

Publication Number Publication Date
JPS53142663A true JPS53142663A (en) 1978-12-12

Family

ID=13025444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5637377A Pending JPS53142663A (en) 1977-05-18 1977-05-18 Method of mounting ic chip

Country Status (1)

Country Link
JP (1) JPS53142663A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159360A (en) * 1982-03-17 1983-09-21 Fujitsu Ltd Semiconductor device
JPS595698A (en) * 1982-06-30 1984-01-12 三菱電機株式会社 Method of mounting electronic part
JPS59112689A (en) * 1982-11-17 1984-06-29 松下電器産業株式会社 Method of mounting both side chips
JPS61194797A (en) * 1985-02-23 1986-08-29 日本ビクター株式会社 Soldering method
WO2021085180A1 (en) * 2019-10-30 2021-05-06 株式会社村田製作所 Electronic component module and method for manufacturing electronic component module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159360A (en) * 1982-03-17 1983-09-21 Fujitsu Ltd Semiconductor device
JPS595698A (en) * 1982-06-30 1984-01-12 三菱電機株式会社 Method of mounting electronic part
JPS59112689A (en) * 1982-11-17 1984-06-29 松下電器産業株式会社 Method of mounting both side chips
JPS61194797A (en) * 1985-02-23 1986-08-29 日本ビクター株式会社 Soldering method
WO2021085180A1 (en) * 2019-10-30 2021-05-06 株式会社村田製作所 Electronic component module and method for manufacturing electronic component module

Similar Documents

Publication Publication Date Title
JPS53122387A (en) Method of forming ic
JPS5419668A (en) Method of producing ic
JPS53140980A (en) Semiconductor ic
JPS5414680A (en) Method of producing semiconductor ic
JPS5473566A (en) Ic chip support and method of fabricating same
JPS5494885A (en) Method of fabricating ic semiconductor
JPS53136494A (en) Method of producing semiconductor ic
JPS53114367A (en) Semiconductor ic
JPS53142663A (en) Method of mounting ic chip
JPS5388586A (en) Semiconductor ic
JPS53147483A (en) Semiconductor ic
JPS5494889A (en) Method of fabricating ic
JPS54991A (en) Semiconductor ic
JPS5578594A (en) Method of mounting chip element
JPS53102661A (en) Semiconductor ic
JPS53111282A (en) Semiconductor ic
JPS53108788A (en) Semiconductor ic
JPS5454588A (en) Semiconductor ic
JPS55141794A (en) Method of mounting chip component
JPS5396681A (en) Semiconductor ic
JPS5491060A (en) Method of fabricating ic
JPS5442983A (en) Semiconductor ic
JPS5415650A (en) Semiconductor ic
JPS5415651A (en) Semiconductor ic
JPS53116084A (en) Semiconductor ic and method of producing same