DE2807564C2 - Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung - Google Patents
Verfahren zur stromlosen Abscheidung einer Gold-Nickel-LegierungInfo
- Publication number
- DE2807564C2 DE2807564C2 DE19782807564 DE2807564A DE2807564C2 DE 2807564 C2 DE2807564 C2 DE 2807564C2 DE 19782807564 DE19782807564 DE 19782807564 DE 2807564 A DE2807564 A DE 2807564A DE 2807564 C2 DE2807564 C2 DE 2807564C2
- Authority
- DE
- Germany
- Prior art keywords
- gold
- nickel
- workpiece
- bath
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 18
- 230000008569 process Effects 0.000 title claims description 10
- 229910000990 Ni alloy Inorganic materials 0.000 title claims description 9
- 230000008021 deposition Effects 0.000 title claims description 9
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 title claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 82
- 229910052759 nickel Inorganic materials 0.000 claims description 41
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 11
- 239000011574 phosphorus Substances 0.000 claims description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims description 11
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 239000000872 buffer Substances 0.000 claims description 4
- 150000002344 gold compounds Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 3
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 48
- 239000010931 gold Substances 0.000 description 48
- 229910052737 gold Inorganic materials 0.000 description 47
- 238000000576 coating method Methods 0.000 description 35
- 239000011248 coating agent Substances 0.000 description 30
- 238000007747 plating Methods 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000006172 buffering agent Substances 0.000 description 6
- 229910001020 Au alloy Inorganic materials 0.000 description 5
- 239000003353 gold alloy Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- WJFYXDJAFDTXDE-UHFFFAOYSA-K gold(3+);2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Au+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WJFYXDJAFDTXDE-UHFFFAOYSA-K 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19782807564 DE2807564C2 (de) | 1978-02-22 | 1978-02-22 | Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19782807564 DE2807564C2 (de) | 1978-02-22 | 1978-02-22 | Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2807564A1 DE2807564A1 (de) | 1979-08-30 |
| DE2807564C2 true DE2807564C2 (de) | 1987-01-22 |
Family
ID=6032649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19782807564 Expired DE2807564C2 (de) | 1978-02-22 | 1978-02-22 | Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE2807564C2 (US06534493-20030318-C00288.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4302066A1 (en) * | 1993-01-26 | 1993-07-01 | Metrotech Handelsgesellschaft | Chemical precision gold@ plating process - producing thin, hard coatings in short cycle times, for e.g. jewellery with reduced gold@ usage |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB931638A (en) * | 1961-11-02 | 1963-07-17 | Precious Metal Depositors Ltd | Improvements in or relating to the deposition of gold or gold alloys |
| GB1022061A (en) * | 1962-01-19 | 1966-03-09 | Mitsubishi Electric Corp | Solutions for immersion plating gold and silver |
-
1978
- 1978-02-22 DE DE19782807564 patent/DE2807564C2/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4302066A1 (en) * | 1993-01-26 | 1993-07-01 | Metrotech Handelsgesellschaft | Chemical precision gold@ plating process - producing thin, hard coatings in short cycle times, for e.g. jewellery with reduced gold@ usage |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2807564A1 (de) | 1979-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3210268C2 (de) | Wäßriges alkalisches Bad zur stromlosen Abscheidung von Goldüberzügen | |
| DE2947821C2 (US06534493-20030318-C00288.png) | ||
| DE2457829A1 (de) | Verfahren und loesungen fuer die stromlose metallauftragung | |
| DE2518559A1 (de) | Stromloses plattierungsverfahren und plattierungsbad | |
| DE3320308C2 (de) | Wäßriges Bad zur stromlosen Abscheidung von Gold und dessen Legierungen und seine Anwendung | |
| EP0283771A1 (de) | Verfahren zur haftfesten Metallisierung von Kunststoffen | |
| DE3400670A1 (de) | Waessriges goldsulfit enthaltendes galvanisches bad und verfahren zur galvanischen abscheidung von gold unter verwendung dieses bades | |
| DE2807564C2 (de) | Verfahren zur stromlosen Abscheidung einer Gold-Nickel-Legierung | |
| DE1247804B (de) | Alkalisches Bad zum chemischen Abscheiden von festhaftenden Palladiumueberzuegen | |
| DE2254857B2 (de) | Verfahren zur Herstellung von abnutzungsfesten Nickeldispersionsüberzügen | |
| EP0152601B1 (de) | Wässriges alkalisches Bad zur Chemischen Abscheidung von Kupfer oder Nickel | |
| EP1763594B1 (de) | Verfahren zur verbesserung der lötbarkeit von nickelüberzügen | |
| DE69011549T2 (de) | Elektroplattierung von Gold enthaltenden Legierungen. | |
| DE923406C (de) | Bad und Verfahren zur Abscheidung von UEberzuegen aus Gold oder Goldlegierungen auf galvanischem Wege | |
| DE2538817C3 (de) | Bad und Verfahren zum stromlosen Vernickeln von Metall und Metallegierungen, insbesondere Aluminium und Aluminiumlegierungen | |
| DE1521080A1 (de) | Verfahren zur Aufbringung von metallischen Oberflaechenschichten auf Werkstuecke aus Titan | |
| DE1811607C3 (de) | Verfahren zur Vorbehandlung von stromlos und gegebenenfalls elektrolytisch zu metallisierenden Kunststoffen | |
| DE3486228T2 (de) | Nickelplattierung von aluminium ohne elektrizität. | |
| DE1521512B1 (de) | Alkalisches Bad zur stromlosen Kupferabscheidung | |
| CH680449A5 (US06534493-20030318-C00288.png) | ||
| DE3443471C2 (de) | Verfahren zur Neuaktivierung einer wäßrigen, Edelmetallionen enthaltenden Lösung für die Initiierung der stromlosen Nickelabscheidung auf mit Kupfer beschichteten Substraten und seine Anwendung | |
| DE1137918B (de) | Bad und Verfahren zur chemischen Abscheidung von Nickel-Bor- oder Kobalt-Bor-Legierungsueberzuegen | |
| DE2439075A1 (de) | Chemisches plattierverfahren | |
| DE1947003C (de) | Verfahren zum stromlosen Verkupfern von Aluminium und dessen Legierungen | |
| DE1812040C3 (de) | Verfahren zur chemischen Vernickelung der Oberflächen von Aluminium und Aluminiumlegierungen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8127 | New person/name/address of the applicant |
Owner name: BURR-BROWN CORP., TUCSON, ARIZ., US |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |