GB931638A - Improvements in or relating to the deposition of gold or gold alloys - Google Patents

Improvements in or relating to the deposition of gold or gold alloys

Info

Publication number
GB931638A
GB931638A GB3920661A GB3920661A GB931638A GB 931638 A GB931638 A GB 931638A GB 3920661 A GB3920661 A GB 3920661A GB 3920661 A GB3920661 A GB 3920661A GB 931638 A GB931638 A GB 931638A
Authority
GB
United Kingdom
Prior art keywords
gold
solution
salt
soluble
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3920661A
Inventor
Edgar Frederick Harlow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PRECIOUS METAL DEPOSITORS Ltd
Original Assignee
PRECIOUS METAL DEPOSITORS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PRECIOUS METAL DEPOSITORS Ltd filed Critical PRECIOUS METAL DEPOSITORS Ltd
Priority to GB3920661A priority Critical patent/GB931638A/en
Priority to CH1281462A priority patent/CH412512A/en
Publication of GB931638A publication Critical patent/GB931638A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)

Abstract

Gold, or gold alloy, is deposited by immersion or by electrolysis (see Group XXXVI) from a composition consisting of a tri-polyphosphate together with a gold salt, or with a gold salt plus the soluble salt of another metal, respectively. The composition, formulated as aqueous solution ready for use, as concentrate for dilution or as dry mixture for dissolution, can provide for the immersion coating of dissimilar metal surfaces from a common solution. Any suitable soluble gold salt may be used, e.g. gold cyanide, gold chloride. The pH of the solution is controlled by the addition of alkali, e.g. KOH, NH4OH or strong acid, e.g. HCl, H3PO4, H2SO4. Buffering compounds are included to maintain constant pH values and may consist of a suitable weak acid, e.g. citric, lactic, tartaric, boric or acetic acids or soluble salts thereof. As examples copper surfaces can be gold-plated at pH7-9, silver surfaces at pH 1-4. It is stated that Ni, Mo, Ti brass and gilding metal may likewise be gold-plated. Gold may also be deposited on non-conductors, e.g. plastics, glass and ceramic, provided such bases have a suitable catalytic surface formed thereon. Gold can also be provided in the solution by using gold anodes with a suitable cathode, e.g. stainless steel, Pt or Cu and electrolysing the solution until sufficient gold is formed therein. For the immersion coating or electro-deposition of gold, the solution temperatures range from 20 DEG C. to boiling point. Gold alloys can be formed from nickel, copper, cobalt, silver, indium, antimony and gallium which metals are added in the form of soluble salts.
GB3920661A 1961-11-02 1961-11-02 Improvements in or relating to the deposition of gold or gold alloys Expired GB931638A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB3920661A GB931638A (en) 1961-11-02 1961-11-02 Improvements in or relating to the deposition of gold or gold alloys
CH1281462A CH412512A (en) 1961-11-02 1962-11-01 Composition for depositing gold or gold alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3920661A GB931638A (en) 1961-11-02 1961-11-02 Improvements in or relating to the deposition of gold or gold alloys

Publications (1)

Publication Number Publication Date
GB931638A true GB931638A (en) 1963-07-17

Family

ID=10408277

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3920661A Expired GB931638A (en) 1961-11-02 1961-11-02 Improvements in or relating to the deposition of gold or gold alloys

Country Status (2)

Country Link
CH (1) CH412512A (en)
GB (1) GB931638A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4075065A (en) * 1975-07-07 1978-02-21 Handy & Harman Gold plating bath and process
DE2807564A1 (en) * 1978-02-22 1979-08-30 Burr Brown Res Corp Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer
WO2012001132A1 (en) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Tribologically loadable mixed noble metal/metal layers
US9631282B2 (en) 2010-06-30 2017-04-25 Schauenburg Ruhrkunststoff Gmbh Method for depositing a nickel-metal layer
CN111647919A (en) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 Aqueous preparation for producing gold and silver layers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4075065A (en) * 1975-07-07 1978-02-21 Handy & Harman Gold plating bath and process
DE2807564A1 (en) * 1978-02-22 1979-08-30 Burr Brown Res Corp Electroless gold plating a nickel plated workpiece - to provide a nickel-gold alloy layer
WO2012001132A1 (en) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Tribologically loadable mixed noble metal/metal layers
US9631282B2 (en) 2010-06-30 2017-04-25 Schauenburg Ruhrkunststoff Gmbh Method for depositing a nickel-metal layer
CN111647919A (en) * 2019-03-04 2020-09-11 弗劳恩霍夫应用研究促进协会 Aqueous preparation for producing gold and silver layers

Also Published As

Publication number Publication date
CH412512A (en) 1966-04-30

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