US2499807A - Process for electroplating molybdenum and its alloys - Google Patents
Process for electroplating molybdenum and its alloys Download PDFInfo
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- US2499807A US2499807A US456820A US45682042A US2499807A US 2499807 A US2499807 A US 2499807A US 456820 A US456820 A US 456820A US 45682042 A US45682042 A US 45682042A US 2499807 A US2499807 A US 2499807A
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- Prior art keywords
- molybdenum
- anion
- class consisting
- electrolyte
- acid
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title claims description 21
- 229910052750 molybdenum Inorganic materials 0.000 title claims description 20
- 239000011733 molybdenum Substances 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 15
- 238000009713 electroplating Methods 0.000 title description 3
- 229910045601 alloy Inorganic materials 0.000 title description 2
- 239000000956 alloy Substances 0.000 title description 2
- 239000002253 acid Substances 0.000 claims description 21
- 150000001450 anions Chemical class 0.000 claims description 17
- 239000003792 electrolyte Substances 0.000 claims description 15
- 229910001868 water Inorganic materials 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 9
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 9
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims description 8
- 150000008064 anhydrides Chemical class 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 description 16
- 150000003839 salts Chemical class 0.000 description 13
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- 150000001447 alkali salts Chemical class 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- -1 ferrous Chemical compound 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 150000004672 propanoic acids Chemical class 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000001243 acetic acids Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 description 1
- SDDZOHPBTVNQMF-UHFFFAOYSA-N azane;potassium;propanoic acid Chemical compound N.[K].CCC(O)=O SDDZOHPBTVNQMF-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 150000004674 formic acids Chemical class 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- GDXTWKJNMJAERW-UHFFFAOYSA-J molybdenum(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Mo+4] GDXTWKJNMJAERW-UHFFFAOYSA-J 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229940074355 nitric acid Drugs 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
Definitions
- the work on which the electrodeposition of molybdenum is desired is placed in the electrolyte vto form the cathode and the anode.
- a cathode of copper, iron, or nickel has been found to be satisfactory.
- the electrolytic bath is preferably maintained slightly acid.
- the optimum conditions being a pH between 5.5 to 6.8 as measured with a lass electrode.
- the pH maybe varied from this range and, in particular, a potassium-ammonium propionate bath will givegood deposits at a pH of 7.4.
- the current density may be varied quite widely but the optimum conditions arev between 0.1 to
- molybdenum ..Gp,n,1pounds used are the most readily available compounds of the element.
- Molybdic anhydride, M003; and ammonium paramolybdate, (NH4)5M07O24.4H2O are both-,commercially available and are both operative in our process.
- Example VI An electrolyte is made up of the following composition: 5 g. molybdic anhydride 50 g. NH4C2H3O2 50 g. KC2H3O2 10 cc. HC2H302 (glacial) 65 cc. H20 1 cc. 005304 (0.1 M)
- the optimum conditions for the codeposition of molybdenum and cobalt from this bath are current density 0.25 ampere per square centimeter; temperature 30 C. to 50 C. Bright metallic plates are obtained in one minute. The weight of an average deposit is 0.5 mg. on 16 square centimeters of cathode surface. The current density range for bright metal plating from this bath is 0.09 to 0.8 ampere per square centimeter.
- the process of plating metallic molybdenum which comprises passing a current between an anode and the work to be plated as a cathode in an electrolyte comprising an aqueous solution or a compound of the class consisting of molybdic acid, its anhydride and its salts and a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate, the ratio of said anion to water being between 1 to 2 and 1 to 4 and the pH being between 5.5 and 6.8.
- An electrolyte for the electrodeposition of metallic molybdenum comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts and a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate, the ratio of said anion to water being between 1 to 2.2 and 1 to 3 and the pH being between 5.5 and 6.8.
- An electrolyte for the electrodeposition of metallic molybdenum alloys comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts, a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate and a soluble salt of a metal of the class consisting of iron, nickel and cobalt the ratio of said anion to water being between 1 to 2 and 1 to 4 and the pH being between 5.5 and 6.8.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Mar. 7, 1950 PROCESS FOR ELECTROPLATINGr-.MQLYB- DENUM ANDITS ALLOYS Leonard F. Yntema, Webster Groves, and Mary Joecile, Ksycki. St. Louis, Mo., assignors to president and board of trustees of St. Louis University, St. Louis, M0.
N Drawing. Application August 31, 1942, Serial No. 456,820
- solai s. ((1204-43) A The invention relates to the electrodeDQSifion of molybdenum.
We have discovered that molybdenum maybe efficiently.electrodeposited from aqueous electrolytes containingmolybdic acid, its anhydride or itssalts. in the presence of aliphatic acids and highconcentrations of salts of aliphatic acids.
Among .the additional salts which may advantageouslybeused in our process are the sodium, potassium or,.ammonium formate, acetate, and propionate or. combinations of the same. It is of advantage to employ such concentrations of these saltsthat the mol ratio of added anion to water is from 1 to 2 up to 1 to 4, preferably between 1 1302.2 and 1 to 3.
The work on which the electrodeposition of molybdenum is desired is placed in the electrolyte vto form the cathode and the anode. is a conducting material which will notbe attacked by the reaction products at the anode, such as platinum or carbon. A cathode of copper, iron, or nickel has been found to be satisfactory.
The electrolytic bath is preferably maintained slightly acid. the optimum conditions being a pH between 5.5 to 6.8 as measured with a lass electrode. Under some conditions however the pH maybe varied from this range and, in particular, a potassium-ammonium propionate bath will givegood deposits at a pH of 7.4.
The current density may be varied quite widely but the optimum conditions arev between 0.1 to
0.8 ampere per square centimeter of cathode surljace. 1he temperature of the bath is. preferablvv maintained between 30 C. and 50? C.
,Wi h ur processes above des b we. ave been able to. obtain. smooth, bright, adherent deposits of molybdenum in two minutes. The deposited metal is resistant to acids such as 0 1d hydrochloric and sulfuric and is resistant to stron uallialies but is soluble in nitricacid.
Our process is adapted for the electrcplating of articles. to render them corrosionresistant as well as to obtain a bright decorative effect. It is usefulfor preparing: molybdenum sheet byobtaining a thi k deposit i -th m ta on ui abl ca a d'subsequ n i solv n o f. e cathode ea ins-the l e m n. she .io
Our process isadapted for theelectrodeposition of molybdenum alloys or mixtures with other metals Iron may be codeposited with molybdenum by adding to the bath a solution of a ferrous salt, such as ferrous ,i lfate (F8804). Cobalt m e, cod p sit d wi h ely d m, y adding tothe th a solution of acobalt salt, such as coj iidsel. be Qdee s t 2 with molybdenum by adding to the bath asolutime of. n kel-sa s has nicke1...su1. .(N'iSOi).
The. anions of. .thealiphaticacids, ,,such,, as formate, acetate, and propionate. which are pres:- ent in. high concentration increase the solubility f e he t mo1ybden compounds in the acid olutionsand. with the, acid, increa hQSQ ubility of reduction products of -the hexavalent o bd um compo nds .forme ur the P cessor electrolysis therebypreventing the precipitation. Oi, molybdenum hydroxide orf of basic salts.
One of the chief advantages of our process is that the molybdenum ..Gp,n,1pounds used are the most readily available compounds of the element. Molybdic anhydride, M003; and ammonium paramolybdate, (NH4)5M07O24.4H2O are both-,commercially available and are both operative in our process.
To illustrate our invention, the following-1e):- amples are given:
Example I An electrolyte is made up of the following vcomposition: 5 g. molybdicanhydride so g. KOH 55 co. NH'iQ 1 8% N s 75 cc. HCOzH' (8'7 cc, H V Preferablythe bath is subjected. to apreli ninary electrolysis at a current density of 0.53ampere per square centimeter until the bath becomes red in color. The optimum conditions for ob- .t ni amowbde m .fr m th s: ba h are. PH,
to 5.9; current density 0.5 ampere per squarecentimeter; temperature C. to C. Bright metallic deposits of molybdenum are. obtained in -five minutes. The weight of anaveragez-deposit is 0.5 mg. on an area of 8 square centimeters of cathode surface. The current densitynan cfor bright metal plating from this bath.is .,0.35 to 0.6 ampere per square centimeter.
. mlllc II nnelectrolyte made up of the, followingcomposition:
5 g. molybdic anhydride g NH4C2H302 50 g-rKt'JzHsOa l0 col-ICnI-lcOc- (glacial) cc. -;H2Q
No preliminary electrolysisis---needed. '-1 he optimum conditions for obtaining deposition of molybdenum from this bath are pH 5.7 to 6.0; current density 0.5 ampere per square centimeter; temperature 30 C. to 40 C. Bright metallic deposits of molybdenum are obtained in two minutes. The weight of an average deposit is 1.0 mg. on 8 square centimeters of cathode surface. The current density range for bright metal plating is from 0.2 to 0.6 ampere per square centimeter.
Example III An electrolyte is made up of the following composition:
g. molybdic anhydride 74 cc. prooionic acid (HC3H5O2) 32 gm. (NH4) zCOs 19 gm. X011 28 cc. H2O
Example IV An electrolyte is made up of the following com- "position:
5 g. mol bdic anhydride 60 g. KOH
55 cc. N -T4OH (28% NH3) '75 cc. HCOzH (87%) 15 cc. H20
30 cc. FeSO4 (0.1 M)
The optimum conditions for the codeposition of molybdenum and iron from this bath are a current density of 0.2 ampere per square centimeter: temperature 30 C. to 40 C. Bright metallic plates are obtained in two minutes. The current density range for bright metal plating from this bath is 0.15 to 0.5 ampere per square centimeter.
Example V An electrolyte is made up of the following composition:
5 g. molybdic anhydride 50 g. NH4C2H302 cc. HCaHsOz (glacial) 65 cc. H20
3 cc. NiSO4 (0.1 M)
The optimum conditions for obtaining codeposition of molybdenum and nickel from this bath are current density 0.25 ampere per square centimeter; temperature 30 C. to 40 C. Bright metallic plates are obtained in one minute. The weight of an average deposit is 1 mg. on 16 square centimeters of cathode surface. The current density range for bright metal plating from this bath is 0.07 to 1.0 ampere per square Centimeter.
Example VI An electrolyte is made up of the following composition: 5 g. molybdic anhydride 50 g. NH4C2H3O2 50 g. KC2H3O2 10 cc. HC2H302 (glacial) 65 cc. H20 1 cc. 005304 (0.1 M)
The optimum conditions for the codeposition of molybdenum and cobalt from this bath are current density 0.25 ampere per square centimeter; temperature 30 C. to 50 C. Bright metallic plates are obtained in one minute. The weight of an average deposit is 0.5 mg. on 16 square centimeters of cathode surface. The current density range for bright metal plating from this bath is 0.09 to 0.8 ampere per square centimeter.
The above examples are given by way of illustration only.
What we claim as our invention is:
1. The process of plating metallic molybdenum which comprises passing a current between an anode and the work to be plated as a cathode in an electrolyte comprising an aqueous solution or a compound of the class consisting of molybdic acid, its anhydride and its salts and a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate, the ratio of said anion to water being between 1 to 2 and 1 to 4 and the pH being between 5.5 and 6.8.
2. The process of plating metallic molybdenum which comprises passing a current between an anode and the work to be plated as a cathode in an electrolyte comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts and a high con centration of an anion of acetic acid, the ratio of said anion to water being ofthe order of 1 to 2% and the pH being between 5.5 and 6.8.
3. An electrolyte for the electrodeposition of metallic molybdenum comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts and a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate, the ratioof said anion to water being between 1 to 2 and 1 to 4 and the pH being between 5.5 and 6.8.
4. An electrolyte for the electrodeposition of metallic molybdenum comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts and a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate, the ratio of said anion to water being between 1 to 2.2 and 1 to 3 and the pH being between 5.5 and 6.8.
5. An electrolyte for the electrodeposition of metallic molybdenum alloys comprising an aqueous solution of a compound of the class consisting of molybdic acid, its anhydride and its salts, a high concentration of an anion of an aliphatic acid of the class consisting of formate, acetate and propionate and a soluble salt of a metal of the class consisting of iron, nickel and cobalt the ratio of said anion to water being between 1 to 2 and 1 to 4 and the pH being between 5.5 and 6.8.
6. The process of electroplating metallicmolybdenum which comprises passing a current between an anode and the.;work to be plated asf'a cathode in an electrolyte comprising an aqueous solution of a molybdate compound, an aliphatic acid of the class consisting of formic, acetic, and propionic acids and an alkali salt of an aliphatic acid of the class consisting of formate, acetate and propionate, in which the ratio of the anion of said aliphatic acid and salt of said aliphatic acid to water is between 1 to 2 and 1 to 4, the pH being between 5.5 and 6.8, the temperature being between 30 and 50 C. and maintaining the current density between 0.07 and 1.0 ampere per square centimeter.
7. The process according to claim 6 in which the ratio of the anion of said aliphatic acid and salt of said aliphatic acid to water is maintained between 1 to 2.2 and 1 to 3.
8. The process according to claim 1 in which the anode is a conducting material of the class consisting of platinum and carbon.
9. The process of electroplating metallic molybdenum alloys which comprises passing a current between an anode and the work to be plated as a cathode in an electrolyte comprising an aqueous solution of a molybdate compound, an aliphatic acid of the class consisting of formic, acetic, and
propionic acids and an alkali salt of an aliphatic acid of the class consisting of formate, acetate and propionate, and a soluble salt of a metal to be codeposited with molybdenum of the class consisting of iron, nickel, and cobalt, in which the ratio of the anion of said aliphatic acid and salt of said aliphatic acid to water is between 1 to 2 and 1 to 4, the pH being between 5.5 and 6.8, the temperature being between and C. and maintaining the current density between 0.07 and 1.0 ampere per square centimeter.
LEONARD F. YNTEMA.
MARY JOECILE KSYCKI.
REFERENCES CITED The following references are of record in the file of this patent:
Quantitative Analysis by Electrolysis," by Classen and Hall, published in 1913 by John Wiley & Sons, Inc., page 146.
Transactions of the Electrochemical Society," vol. (1936) pages 423, 424.
Claims (1)
1. THE PROCESS OF PLATING METALLIC MOLYBDENUM WHICH COMPRISES PASSING A CURRENT BETWEEN AN ANODE AND THE WORK TO BE PLATED AS A CATHODE IN AN ELECTROLYTE COMPRISING AN AQUEOUS SOLUTION OF A COMPOUND OF THE CLASS CONSISTING OF MOLYBDIC ACID, ITS ANHYDRIDE AND ITS SALTS AND A HIGH CONCENTRATION OF AN ANION OF AN ALIPHATIC ACID OF THE CLASS CONSISTING OF FORMATE, ACETATE AND PROPIONATE, THE RATIO OF SAID ANION TO WATER BEING BETWEEN 1 TO 2 AND 1 TO 4 AND THE PH BEING BETWEEN 5.5 AND 6.8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US456820A US2499807A (en) | 1942-08-31 | 1942-08-31 | Process for electroplating molybdenum and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US456820A US2499807A (en) | 1942-08-31 | 1942-08-31 | Process for electroplating molybdenum and its alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2499807A true US2499807A (en) | 1950-03-07 |
Family
ID=23814267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US456820A Expired - Lifetime US2499807A (en) | 1942-08-31 | 1942-08-31 | Process for electroplating molybdenum and its alloys |
Country Status (1)
| Country | Link |
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| US (1) | US2499807A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2943029A (en) * | 1958-02-11 | 1960-06-28 | Du Pont | Electrodeposition of molybdenum |
| US20090098398A1 (en) * | 2006-04-14 | 2009-04-16 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
| RU2432421C2 (en) * | 2009-06-03 | 2011-10-27 | Государственное образовательное учреждение высшего профессионального образования "Оренбургский государственный университет" | Procedure for manufacture of thin films |
-
1942
- 1942-08-31 US US456820A patent/US2499807A/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| None * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2943029A (en) * | 1958-02-11 | 1960-06-28 | Du Pont | Electrodeposition of molybdenum |
| US20090098398A1 (en) * | 2006-04-14 | 2009-04-16 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
| US8440066B2 (en) * | 2006-04-14 | 2013-05-14 | C. Uyemura & Co., Ltd. | Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component |
| RU2432421C2 (en) * | 2009-06-03 | 2011-10-27 | Государственное образовательное учреждение высшего профессионального образования "Оренбургский государственный университет" | Procedure for manufacture of thin films |
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