DE2758142C2 - Verfahren zur Herstellung von Ladeplatten - Google Patents
Verfahren zur Herstellung von LadeplattenInfo
- Publication number
- DE2758142C2 DE2758142C2 DE2758142A DE2758142A DE2758142C2 DE 2758142 C2 DE2758142 C2 DE 2758142C2 DE 2758142 A DE2758142 A DE 2758142A DE 2758142 A DE2758142 A DE 2758142A DE 2758142 C2 DE2758142 C2 DE 2758142C2
- Authority
- DE
- Germany
- Prior art keywords
- channels
- openings
- metal
- plates
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000011068 loading method Methods 0.000 title description 27
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 4
- 239000006089 photosensitive glass Substances 0.000 claims description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 claims 1
- 238000001556 precipitation Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
- B41J2/075—Ink jet characterised by jet control for many-valued deflection
- B41J2/08—Ink jet characterised by jet control for many-valued deflection charge-control type
- B41J2/085—Charge means, e.g. electrodes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/754,708 US4096626A (en) | 1976-12-27 | 1976-12-27 | Method of making multi-layer photosensitive glass ceramic charge plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2758142A1 DE2758142A1 (de) | 1978-07-06 |
| DE2758142C2 true DE2758142C2 (de) | 1985-08-01 |
Family
ID=25035970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2758142A Expired DE2758142C2 (de) | 1976-12-27 | 1977-12-27 | Verfahren zur Herstellung von Ladeplatten |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4096626A (enExample) |
| JP (1) | JPS609910B2 (enExample) |
| CA (1) | CA1072218A (enExample) |
| DE (1) | DE2758142C2 (enExample) |
| FR (1) | FR2375629A1 (enExample) |
| GB (1) | GB1587739A (enExample) |
| IT (1) | IT1113819B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5563280A (en) * | 1978-11-06 | 1980-05-13 | Seiko Epson Corp | Ink jet printer head |
| US4223320A (en) * | 1978-12-18 | 1980-09-16 | The Mead Corporation | Jet printer and electrode assembly therefor |
| JPS5586766A (en) * | 1978-12-23 | 1980-06-30 | Seiko Epson Corp | Electric wiring for ink jet head |
| JPS5586769A (en) * | 1978-12-23 | 1980-06-30 | Seiko Epson Corp | Ink jet recording head |
| JPS55118875A (en) * | 1979-03-07 | 1980-09-12 | Canon Inc | Method of fabricating multinozzle recording head |
| JPS55158985A (en) * | 1979-05-30 | 1980-12-10 | Seiko Epson Corp | Ink jet head |
| JPS55159984A (en) * | 1979-06-01 | 1980-12-12 | Seiko Epson Corp | Ink-jet recording head |
| US4346389A (en) * | 1979-10-11 | 1982-08-24 | Ricoh Co., Ltd. | Multiple charge electrode device for liquid jet printer |
| US4251820A (en) * | 1979-12-28 | 1981-02-17 | International Business Machines Corporation | Solder glass bonded charge electrode assembly for ink jet printers |
| US4487993A (en) * | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
| US4417393A (en) * | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
| US4347522A (en) * | 1981-04-01 | 1982-08-31 | The Mead Corporation | Laminated metal charge plate |
| DE3140690A1 (de) * | 1981-10-13 | 1983-04-28 | Krupp Polysius Ag, 4720 Beckum | Verfahren und anlage zur waermebehandlung von feinkoernigem gut |
| US4528996A (en) * | 1983-12-22 | 1985-07-16 | The Mead Corporation | Orifice plate cleaning system |
| US4727012A (en) * | 1984-10-25 | 1988-02-23 | Siemens Aktiengesellschaft | Method of manufacture for print heads of ink jet printers |
| JPS61104859A (ja) * | 1985-08-23 | 1986-05-23 | Seiko Epson Corp | マルチノズル型インクジエツトヘツド |
| JPS63128699A (ja) * | 1986-11-19 | 1988-06-01 | 株式会社日立製作所 | 感光性ガラス−セラミツク多層配線基板 |
| DE3814720A1 (de) * | 1988-04-30 | 1989-11-09 | Olympia Aeg | Verfahren zur herstellung einer grundplatte mit durch aetzen hergestellte einarbeitungen fuer einen tintendruckkopf |
| US5825382A (en) * | 1992-07-31 | 1998-10-20 | Francotyp-Postalia Ag & Co. | Edge-shooter ink jet print head and method for its manufacture |
| JP3756041B2 (ja) * | 1999-05-27 | 2006-03-15 | Ｈｏｙａ株式会社 | 多層プリント配線板の製造方法 |
| US20040021741A1 (en) * | 2002-07-30 | 2004-02-05 | Ottenheimer Thomas H. | Slotted substrate and method of making |
| US7304732B1 (en) * | 2003-11-19 | 2007-12-04 | United States Of America As Represented By The Secretary Of The Army | Microelectromechanical resonant photoacoustic cell |
| US20060042832A1 (en) * | 2004-08-27 | 2006-03-02 | Kiyoshi Sato | Multilayer circuit board and method of producing the same |
| US10067270B2 (en) * | 2014-08-29 | 2018-09-04 | National Institute For Materials Science | Electromagnetic wave absorbing/radiating material, method of manufacturing same, and infrared source |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE609659C (de) * | 1933-02-01 | 1935-02-19 | I G Farbenindustrie Akt Ges | Verfahren zum Herstellung hoher Kolloidreliefs fuer Hochdruckzwecke |
| US3492523A (en) * | 1960-04-20 | 1970-01-27 | Bendix Corp | Method of making an image intensifier array and resultant article |
| US3373437A (en) * | 1964-03-25 | 1968-03-12 | Richard G. Sweet | Fluid droplet recorder with a plurality of jets |
| US3596275A (en) * | 1964-03-25 | 1971-07-27 | Richard G Sweet | Fluid droplet recorder |
| US3509268A (en) * | 1967-04-10 | 1970-04-28 | Sperry Rand Corp | Mass interconnection device |
| US3586907A (en) * | 1969-11-17 | 1971-06-22 | Mead Corp | Laminated coating head |
| US3714706A (en) * | 1970-08-21 | 1973-02-06 | Perkin Elmer Corp | Array of conductors fixed through dielectric plate |
| US3825456A (en) * | 1970-09-30 | 1974-07-23 | Corning Glass Works | Spinnerette plates and spinnerette employing same |
| GB1425930A (en) * | 1972-12-13 | 1976-02-25 | Nat Printing Plate Co | Method of making a printing plate |
| US3999004A (en) * | 1974-09-27 | 1976-12-21 | International Business Machines Corporation | Multilayer ceramic substrate structure |
| US3975741A (en) * | 1975-07-23 | 1976-08-17 | International Business Machines Corporation | Charge electrode for ink jet |
-
1976
- 1976-12-27 US US05/754,708 patent/US4096626A/en not_active Expired - Lifetime
-
1977
- 1977-10-04 CA CA288,079A patent/CA1072218A/en not_active Expired
- 1977-11-18 FR FR7735656A patent/FR2375629A1/fr active Granted
- 1977-11-25 JP JP52140831A patent/JPS609910B2/ja not_active Expired
- 1977-12-13 IT IT30626/77A patent/IT1113819B/it active
- 1977-12-16 GB GB52380/77A patent/GB1587739A/en not_active Expired
- 1977-12-27 DE DE2758142A patent/DE2758142C2/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2375629B1 (enExample) | 1980-08-22 |
| FR2375629A1 (fr) | 1978-07-21 |
| US4096626A (en) | 1978-06-27 |
| JPS5382415A (en) | 1978-07-20 |
| IT1113819B (it) | 1986-01-27 |
| DE2758142A1 (de) | 1978-07-06 |
| JPS609910B2 (ja) | 1985-03-13 |
| GB1587739A (en) | 1981-04-08 |
| CA1072218A (en) | 1980-02-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8380 | Miscellaneous part iii |
Free format text: DER VERTRETER LAUTET RICHTIG: KIRCHHOF, N., ING.(GRAD.), PAT.-ASS., 7030 BOEBLINGEN |
|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |