DE2756694C3 - Verfahren zur Herstellung von gedruckten Schaltungen - Google Patents

Verfahren zur Herstellung von gedruckten Schaltungen

Info

Publication number
DE2756694C3
DE2756694C3 DE2756694A DE2756694A DE2756694C3 DE 2756694 C3 DE2756694 C3 DE 2756694C3 DE 2756694 A DE2756694 A DE 2756694A DE 2756694 A DE2756694 A DE 2756694A DE 2756694 C3 DE2756694 C3 DE 2756694C3
Authority
DE
Germany
Prior art keywords
holes
sheet
self
supporting
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2756694A
Other languages
German (de)
English (en)
Other versions
DE2756694A1 (de
DE2756694B2 (de
Inventor
Robert William Jackson N.J. Peiffer (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE2756694A1 publication Critical patent/DE2756694A1/de
Publication of DE2756694B2 publication Critical patent/DE2756694B2/de
Application granted granted Critical
Publication of DE2756694C3 publication Critical patent/DE2756694C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE2756694A 1976-12-22 1977-12-20 Verfahren zur Herstellung von gedruckten Schaltungen Expired DE2756694C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/753,459 US4054479A (en) 1976-12-22 1976-12-22 Additive process for producing printed circuit elements using a self-supported photosensitive sheet

Publications (3)

Publication Number Publication Date
DE2756694A1 DE2756694A1 (de) 1978-06-29
DE2756694B2 DE2756694B2 (de) 1979-09-20
DE2756694C3 true DE2756694C3 (de) 1980-06-26

Family

ID=25030721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2756694A Expired DE2756694C3 (de) 1976-12-22 1977-12-20 Verfahren zur Herstellung von gedruckten Schaltungen

Country Status (6)

Country Link
US (1) US4054479A (OSRAM)
JP (1) JPS5388956A (OSRAM)
BE (1) BE862131A (OSRAM)
DE (1) DE2756694C3 (OSRAM)
FR (1) FR2375796A1 (OSRAM)
GB (1) GB1596769A (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
US4157407A (en) * 1978-02-13 1979-06-05 E. I. Du Pont De Nemours And Company Toning and solvent washout process for making conductive interconnections
JPS54140968A (en) * 1978-04-25 1979-11-01 Hitachi Ltd Method of forming circuit
US4283243A (en) * 1978-10-24 1981-08-11 E. I. Du Pont De Nemours And Company Use of photosensitive stratum to create through-hole connections in circuit boards
US4247623A (en) * 1979-06-18 1981-01-27 Eastman Kodak Company Blank beam leads for IC chip bonding
US4460427A (en) * 1981-09-21 1984-07-17 E. I. Dupont De Nemours And Company Process for the preparation of flexible circuits
US4411980A (en) * 1981-09-21 1983-10-25 E. I. Du Pont De Nemours And Company Process for the preparation of flexible circuits
USRE33170E (en) * 1982-03-26 1990-02-27 The Regents Of The University Of California Surgically implantable disconnect device
US4495917A (en) * 1982-03-26 1985-01-29 The Regents Of The University Of California Surgically implantable disconnect device
JPS5912434A (ja) * 1982-07-13 1984-01-23 Tokyo Ohka Kogyo Co Ltd プリント配線板の製造方法
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
US4795693A (en) * 1983-07-13 1989-01-03 American Telephone And Telegraph Company, At&T Technologies, Inc. Multilayer circuit board fabrication process
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
US4859571A (en) * 1986-12-30 1989-08-22 E. I. Du Pont De Nemours And Company Embedded catalyst receptors for metallization of dielectrics
US6509546B1 (en) 2000-03-15 2003-01-21 International Business Machines Corporation Laser excision of laminate chip carriers
JP4993848B2 (ja) * 2004-05-28 2012-08-08 三洋電機株式会社 配線基材
US8563873B2 (en) * 2009-03-31 2013-10-22 Ibiden Co., Ltd. Substrate with metal film and method for manufacturing the same
KR102024113B1 (ko) 2017-12-20 2019-09-23 한국기술교육대학교 산학협력단 운전 조건에 따라 고유진동수가 변화하는 제어 대상의 동작을 제어하기 위한 방법 및 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1420044A (fr) * 1963-12-26 1965-12-03 Matsushita Electric Industrial Co Ltd Procédé de fabrication des circuits imprimés
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
FR1548401A (OSRAM) * 1967-08-16 1968-12-06
US3646572A (en) * 1970-02-09 1972-02-29 Photocircuits Corp Electric wiring assemblies
US3778900A (en) * 1970-09-04 1973-12-18 Ibm Method for forming interconnections between circuit layers of a multi-layer package
US3956041A (en) * 1972-07-11 1976-05-11 Kollmorgen Corporation Transfer coating process for manufacture of printing circuits
DE2309712A1 (de) * 1973-02-27 1974-08-29 Nitto Electric Ind Co Verfahren zur herstellung von abbildungen
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
JPS5286160A (en) * 1976-01-13 1977-07-18 Hitachi Ltd Method of producing printed circuit board

Also Published As

Publication number Publication date
DE2756694A1 (de) 1978-06-29
GB1596769A (en) 1981-08-26
JPS5388956A (en) 1978-08-04
JPS5748878B2 (OSRAM) 1982-10-19
FR2375796B1 (OSRAM) 1984-05-04
US4054479A (en) 1977-10-18
DE2756694B2 (de) 1979-09-20
FR2375796A1 (fr) 1978-07-21
BE862131A (fr) 1978-06-21

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee