DE2733746C3 - Verfahren zum Herstellen einer gedruckten Schaltungsplatte - Google Patents

Verfahren zum Herstellen einer gedruckten Schaltungsplatte

Info

Publication number
DE2733746C3
DE2733746C3 DE2733746A DE2733746A DE2733746C3 DE 2733746 C3 DE2733746 C3 DE 2733746C3 DE 2733746 A DE2733746 A DE 2733746A DE 2733746 A DE2733746 A DE 2733746A DE 2733746 C3 DE2733746 C3 DE 2733746C3
Authority
DE
Germany
Prior art keywords
pattern
copper
thickness
impregnation
copper clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2733746A
Other languages
German (de)
English (en)
Other versions
DE2733746B2 (de
DE2733746A1 (de
Inventor
Takayoshi Hanabusa
Keiji Dipl.-Ing. Kurosawa
Shinji Suzaka Nagano Umemoto
Kenji Dipl.-Ing. Yamamoto
Mitsuo Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE2733746A1 publication Critical patent/DE2733746A1/de
Publication of DE2733746B2 publication Critical patent/DE2733746B2/de
Application granted granted Critical
Publication of DE2733746C3 publication Critical patent/DE2733746C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/902—High modulus filament or fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE2733746A 1976-08-04 1977-07-27 Verfahren zum Herstellen einer gedruckten Schaltungsplatte Expired DE2733746C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9236076A JPS5317970A (en) 1976-08-04 1976-08-04 Copper stacking board

Publications (3)

Publication Number Publication Date
DE2733746A1 DE2733746A1 (de) 1978-02-09
DE2733746B2 DE2733746B2 (de) 1980-05-08
DE2733746C3 true DE2733746C3 (de) 1981-01-15

Family

ID=14052227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2733746A Expired DE2733746C3 (de) 1976-08-04 1977-07-27 Verfahren zum Herstellen einer gedruckten Schaltungsplatte

Country Status (5)

Country Link
US (1) US4372804A (enExample)
JP (1) JPS5317970A (enExample)
DE (1) DE2733746C3 (enExample)
FR (1) FR2361041A1 (enExample)
SE (1) SE439410B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633035A (en) * 1982-07-12 1986-12-30 Rogers Corporation Microwave circuit boards
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4631100A (en) * 1983-01-10 1986-12-23 Pellegrino Peter P Method and apparatus for mass producing printed circuit boards
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
JPS63250435A (ja) * 1987-04-08 1988-10-18 Hitachi Ltd 耐熱疲労性及び耐食性に優れたニツケル基合金
US4812191A (en) * 1987-06-01 1989-03-14 Digital Equipment Corporation Method of forming a multilevel interconnection device
USH788H (en) 1989-05-31 1990-06-05 The United States Of America As Represented By The Secretary Of The Air Force Method for bonding plastic to metal
US5072075A (en) * 1989-06-28 1991-12-10 Digital Equipment Corporation Double-sided hybrid high density circuit board and method of making same
US5296310A (en) * 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
JPH065593A (ja) * 1992-04-20 1994-01-14 Sumitomo Electric Ind Ltd 多層配線基板及びその製造方法
JP3014061U (ja) * 1994-03-23 1995-08-01 利江 有政 傘楽々けいたいベルト
US6703565B1 (en) * 1996-09-06 2004-03-09 Matsushita Electric Industrial Co., Ltd. Printed wiring board
US6222136B1 (en) * 1997-11-12 2001-04-24 International Business Machines Corporation Printed circuit board with continuous connective bumps
SG86345A1 (en) 1998-05-14 2002-02-19 Matsushita Electric Industrial Co Ltd Circuit board and method of manufacturing the same
US6565954B2 (en) 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6518514B2 (en) * 2000-08-21 2003-02-11 Matsushita Electric Industrial Co., Ltd. Circuit board and production of the same
DE10205592B4 (de) * 2002-02-11 2008-01-03 Ksg Leiterplatten Gmbh Verfahren zum Herstellen eines Halbzeugs für Leiterplatten
TWI232710B (en) * 2004-05-17 2005-05-11 Hannstar Display Corp Printed circuit board
US7565738B2 (en) * 2004-05-31 2009-07-28 Sanyo Electric Co., Ltd. Method for manufacturing circuit device
JP2006019361A (ja) 2004-06-30 2006-01-19 Sanyo Electric Co Ltd 回路装置およびその製造方法
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
KR20170023310A (ko) * 2015-08-20 2017-03-03 에스케이하이닉스 주식회사 임베디드 회로 패턴을 가지는 패키지 기판, 제조 방법 및 이를 포함하는 반도체 패키지
CN210075708U (zh) * 2019-01-23 2020-02-14 华为技术有限公司 印制电路板、电源以及电源供电系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3466206A (en) * 1962-06-01 1969-09-09 Control Data Corp Method of making embedded printed circuits
US3374129A (en) * 1963-05-02 1968-03-19 Sanders Associates Inc Method of producing printed circuits
US3688396A (en) * 1969-10-13 1972-09-05 Texas Instruments Inc Circuit board process
US3627902A (en) * 1970-02-02 1971-12-14 Control Data Corp Interconnections for multilayer printed circuit boards
GB1445591A (en) * 1973-03-24 1976-08-11 Int Computers Ld Mounting integrated circuit elements

Also Published As

Publication number Publication date
FR2361041B1 (enExample) 1981-10-23
DE2733746B2 (de) 1980-05-08
SE7708675L (sv) 1978-02-05
DE2733746A1 (de) 1978-02-09
SE439410B (sv) 1985-06-10
JPS5645312B2 (enExample) 1981-10-26
FR2361041A1 (fr) 1978-03-03
JPS5317970A (en) 1978-02-18
US4372804A (en) 1983-02-08

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Legal Events

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OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8328 Change in the person/name/address of the agent

Free format text: REINLAENDER, C., DIPL.-ING. DR.-ING., PAT.-ANW., 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee