DE2725800A1 - Verfahren zur herstellung von loetverbindungen fuer an einem traeger gehaltene schaltkreiselemente - Google Patents

Verfahren zur herstellung von loetverbindungen fuer an einem traeger gehaltene schaltkreiselemente

Info

Publication number
DE2725800A1
DE2725800A1 DE19772725800 DE2725800A DE2725800A1 DE 2725800 A1 DE2725800 A1 DE 2725800A1 DE 19772725800 DE19772725800 DE 19772725800 DE 2725800 A DE2725800 A DE 2725800A DE 2725800 A1 DE2725800 A1 DE 2725800A1
Authority
DE
Germany
Prior art keywords
circuit elements
carrier
soldered connections
vessel
evaporation liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19772725800
Other languages
German (de)
English (en)
Inventor
Eugene Roman Skarvinko
William Ditlef Von Voss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2725800A1 publication Critical patent/DE2725800A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19772725800 1976-06-14 1977-06-08 Verfahren zur herstellung von loetverbindungen fuer an einem traeger gehaltene schaltkreiselemente Ceased DE2725800A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/695,482 US4022371A (en) 1976-06-14 1976-06-14 Vapor bonding method

Publications (1)

Publication Number Publication Date
DE2725800A1 true DE2725800A1 (de) 1977-12-22

Family

ID=24793168

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772725800 Ceased DE2725800A1 (de) 1976-06-14 1977-06-08 Verfahren zur herstellung von loetverbindungen fuer an einem traeger gehaltene schaltkreiselemente

Country Status (5)

Country Link
US (1) US4022371A (cg-RX-API-DMAC7.html)
JP (2) JPS52152847A (cg-RX-API-DMAC7.html)
CA (1) CA1073275A (cg-RX-API-DMAC7.html)
DE (1) DE2725800A1 (cg-RX-API-DMAC7.html)
FR (1) FR2355430A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106295A1 (en) * 1982-10-12 1984-04-25 The HTC Corporation Single vapor system for soldering, fusing or brazing

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4194297A (en) * 1977-12-27 1980-03-25 Western Electric Company, Incorporated Method and apparatus for generating a controllably exposed vapor body for heating articles
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
US4238186A (en) * 1978-12-04 1980-12-09 Western Electric Company, Inc. Methods and apparatus for heating articles selectively exposed to a generated vapor through a volume controllable vapor barrier
US4334646A (en) * 1980-04-17 1982-06-15 Harris Corporation Method of solder reflow assembly
GB8312503D0 (en) * 1983-05-06 1983-06-08 Isc Chemicals Ltd Vapour phase soldering
FR2553186B1 (fr) * 1983-10-11 1988-10-14 Piezo Ceram Electronique Perfectionnements aux machines de chauffage d'articles ou produits par condensation de vapeur sur ceux-ci
IL76867A0 (en) * 1984-12-27 1986-02-28 Hughes Aircraft Co Soldering apparatus and method
CN1004680B (zh) * 1985-09-17 1989-07-05 近藤权士 物品的钎焊装置
US4840305A (en) * 1987-03-30 1989-06-20 Westinghouse Electric Corp. Method for vapor phase soldering
JP2509266B2 (ja) * 1987-12-24 1996-06-19 富士通株式会社 はんだリフロ―方法及びリフロ―装置
DE3814870C1 (cg-RX-API-DMAC7.html) * 1988-05-02 1989-11-16 Helmut Walter 8900 Augsburg De Leicht
DE3840098C1 (cg-RX-API-DMAC7.html) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
US5046658A (en) * 1989-07-27 1991-09-10 At&T Bell Laboratories Method and apparatus for soldering articles
US5030805A (en) * 1990-02-20 1991-07-09 Minnesota Mining And Manufacturing Company Condensation heating apparatus
US5188282A (en) * 1991-01-28 1993-02-23 Hughes Aircraft Company Vapor phase flash fusing of printed wiring boards
DE4103098C1 (cg-RX-API-DMAC7.html) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
DE19504350C2 (de) * 1995-02-10 1997-04-10 Fraunhofer Ges Forschung Verfahren zum Herstellen eines Kontakthöckers durch Umschmelzen einer Kontaktflächenmetallisierung
EP3851235B1 (de) * 2020-01-15 2024-03-13 Leicht, Eva Maria Vorrichtung und verfahren zur gesteuerten wärmeübertragung, insbesondere durch eine kondensierende flüssigkeit auf werkstücke grösserer abmessungen und massen
US12701664B2 (en) * 2022-08-03 2026-08-04 Samsung Electronics Co., Ltd. Solder reflow apparatus and method of manufacturing an electronic device
KR20240018915A (ko) 2022-08-03 2024-02-14 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
KR20250015009A (ko) * 2023-07-24 2025-02-03 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
US3734791A (en) * 1970-10-23 1973-05-22 Ibm Surfactant-containing soldering fluxes
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106295A1 (en) * 1982-10-12 1984-04-25 The HTC Corporation Single vapor system for soldering, fusing or brazing
EP0182036A1 (en) * 1982-10-12 1986-05-28 The HTC Corporation A single vapour system and method for soldering, fusing or brazing
EP0182035A1 (en) * 1982-10-12 1986-05-28 The HTC Corporation A single vapour system for soldering, fusing or brazing

Also Published As

Publication number Publication date
JPS5623369A (en) 1981-03-05
FR2355430B1 (cg-RX-API-DMAC7.html) 1979-03-09
US4022371A (en) 1977-05-10
JPS5628624B2 (cg-RX-API-DMAC7.html) 1981-07-03
CA1073275A (en) 1980-03-11
FR2355430A1 (fr) 1978-01-13
JPS5628623B2 (cg-RX-API-DMAC7.html) 1981-07-03
JPS52152847A (en) 1977-12-19

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Legal Events

Date Code Title Description
OD Request for examination
8128 New person/name/address of the agent

Representative=s name: NEULAND, J., DIPL.-ING., PAT.-ASS., 7030 BOEBLINGE

8125 Change of the main classification

Ipc: B23K 1/00

8126 Change of the secondary classification

Free format text: B23K 1/02 H05K 3/34

8131 Rejection