IL76867A0 - Soldering apparatus and method - Google Patents
Soldering apparatus and methodInfo
- Publication number
- IL76867A0 IL76867A0 IL76867A IL7686785A IL76867A0 IL 76867 A0 IL76867 A0 IL 76867A0 IL 76867 A IL76867 A IL 76867A IL 7686785 A IL7686785 A IL 7686785A IL 76867 A0 IL76867 A0 IL 76867A0
- Authority
- IL
- Israel
- Prior art keywords
- soldering apparatus
- soldering
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0661—Oscillating baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68695784A | 1984-12-27 | 1984-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
IL76867A0 true IL76867A0 (en) | 1986-02-28 |
Family
ID=24758445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL76867A IL76867A0 (en) | 1984-12-27 | 1985-10-28 | Soldering apparatus and method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS62501546A (en) |
GB (1) | GB2178990B (en) |
IL (1) | IL76867A0 (en) |
WO (1) | WO1986004002A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4432774C2 (en) * | 1994-09-15 | 2000-04-06 | Fraunhofer Ges Forschung | Process for producing meniscus-shaped solder bumps |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE125130C (en) * | 1967-11-24 | |||
US3674975A (en) * | 1969-11-06 | 1972-07-04 | Time Research Lab Inc | Apparatus for assembling stacks |
JPS5244566A (en) * | 1975-10-06 | 1977-04-07 | Mitsubishi Electric Corp | Method of alloying semiconductor pellet |
US4022371A (en) * | 1976-06-14 | 1977-05-10 | International Business Machines Corporation | Vapor bonding method |
DE2729477A1 (en) * | 1977-06-30 | 1979-01-11 | Loedige Maschbau Gmbh Geb | POWLED MIXING TOOL |
JPS54113088A (en) * | 1978-02-22 | 1979-09-04 | Omron Tateisi Electronics Co | Soldering of terminals |
US4315042A (en) * | 1978-07-14 | 1982-02-09 | Hybrid Technology Corporation | Solder removal technique |
-
1985
- 1985-10-28 IL IL76867A patent/IL76867A0/en not_active IP Right Cessation
- 1985-11-25 JP JP60505418A patent/JPS62501546A/en active Granted
- 1985-11-25 WO PCT/US1985/002308 patent/WO1986004002A1/en unknown
- 1985-11-25 GB GB08619695A patent/GB2178990B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2178990A (en) | 1987-02-25 |
WO1986004002A1 (en) | 1986-07-17 |
GB8619695D0 (en) | 1986-09-24 |
GB2178990B (en) | 1988-08-24 |
JPS62501546A (en) | 1987-06-25 |
JPH0240425B2 (en) | 1990-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RH | Patent void |