GB2178990A - Soldering apparatus and method - Google Patents

Soldering apparatus and method

Info

Publication number
GB2178990A
GB2178990A GB08619695A GB8619695A GB2178990A GB 2178990 A GB2178990 A GB 2178990A GB 08619695 A GB08619695 A GB 08619695A GB 8619695 A GB8619695 A GB 8619695A GB 2178990 A GB2178990 A GB 2178990A
Authority
GB
United Kingdom
Prior art keywords
solder
soldering
pot
circuit board
soldering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08619695A
Other versions
GB8619695D0 (en
GB2178990B (en
Inventor
Gerald B Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB8619695D0 publication Critical patent/GB8619695D0/en
Publication of GB2178990A publication Critical patent/GB2178990A/en
Application granted granted Critical
Publication of GB2178990B publication Critical patent/GB2178990B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

Soldering apparatus and method wherein an assembly (10) containing solder (16) is simultaneously subjected to vapor heating and ultrasonic vibration to provide for fluxless soldering. The solder (16) is heated in a solder pot (14) which creates a hot vapor space (38) above the surface of the solder (16). A transducer (22) vibrates the solder (16) in the pot (14) while the circuit board to be soldered floats on the surface of the solder (16). This invention is particularly useful for circuit board assemblies which are sensitive to cleansing in preparation for soldering and solder fluxes.
GB08619695A 1984-12-27 1985-11-25 Soldering apparatus and method Expired GB2178990B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68695784A 1984-12-27 1984-12-27

Publications (3)

Publication Number Publication Date
GB8619695D0 GB8619695D0 (en) 1986-09-24
GB2178990A true GB2178990A (en) 1987-02-25
GB2178990B GB2178990B (en) 1988-08-24

Family

ID=24758445

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08619695A Expired GB2178990B (en) 1984-12-27 1985-11-25 Soldering apparatus and method

Country Status (4)

Country Link
JP (1) JPS62501546A (en)
GB (1) GB2178990B (en)
IL (1) IL76867A0 (en)
WO (1) WO1986004002A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4432774C2 (en) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Process for producing meniscus-shaped solder bumps

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591829A1 (en) * 1967-11-24 1971-03-04 Zeva Elektrizitaets Ges Device for soldering printed circuits using drag soldering
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
US4022371A (en) * 1976-06-14 1977-05-10 International Business Machines Corporation Vapor bonding method
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5244566A (en) * 1975-10-06 1977-04-07 Mitsubishi Electric Corp Method of alloying semiconductor pellet
DE2729477A1 (en) * 1977-06-30 1979-01-11 Loedige Maschbau Gmbh Geb POWLED MIXING TOOL
JPS54113088A (en) * 1978-02-22 1979-09-04 Omron Tateisi Electronics Co Soldering of terminals

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591829A1 (en) * 1967-11-24 1971-03-04 Zeva Elektrizitaets Ges Device for soldering printed circuits using drag soldering
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
US4022371A (en) * 1976-06-14 1977-05-10 International Business Machines Corporation Vapor bonding method
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENTS ABSTRACTS OF JAPAN, VOLUME 9, NO. 14 22 JANUARY 1985 *

Also Published As

Publication number Publication date
WO1986004002A1 (en) 1986-07-17
IL76867A0 (en) 1986-02-28
GB8619695D0 (en) 1986-09-24
JPS62501546A (en) 1987-06-25
JPH0240425B2 (en) 1990-09-11
GB2178990B (en) 1988-08-24

Similar Documents

Publication Publication Date Title
BR8800682A (en) WELDING REFLUX APPLIANCE AND MASS REFLUX WELDING PROCESS ELECTRICAL AND ELECTRONIC COMPONENTS
IL85007A0 (en) Thermal technique for simultaneous testing of circuit board solder joints
BR8605482A (en) MASS WELDING SYSTEM
DE3679271D1 (en) DEVICE FOR HOT TINNING PCBS AND METHOD FOR SOLDERING THE CONNECTIONS OF COMPONENTS TO THE CABINETS AND SOLDERING EYES OF A CIRCUIT BOARD.
ATE116513T1 (en) METHOD FOR SOLDERING COMPONENTS ON CIRCUIT BOARDS.
GB2178990A (en) Soldering apparatus and method
IT8648143A0 (en) HEATING COIL ASSEMBLY FOR ELECTRONIC COMPONENT SOLDERING/DESOLDERING DEVICES
ATE91060T1 (en) METHOD OF SOLDERING A WIRELESS COMPONENT AND CIRCUIT BOARD WITH SOLDERED WIRELESS COMPONENT.
FR2442570A1 (en) Tracked board insertion and printed circuit board - is VIA slot enabling tracks to be soldered together
DE3881992D1 (en) Soldering head for soldering and desoldering components.
JPS6442140A (en) Connection of integrated circuit
DE3479178D1 (en) Wave soldering process and capillary solder means for carrying out the process
FI884971A0 (en) GENOMFOERING FOER ATT DUBBELSIDIGT KRETSKORT SAMT FOERFARANDE FOER AOSTADKOMMANDE AV DENSAMMA.
JPS56116693A (en) Method of rigidly soldering parts on bothhside circuit board
JPS5562795A (en) Method of and device for soldering printed circuit board
ATE212780T1 (en) FLAT ASSEMBLY AND METHOD FOR SUBSEQUENTLY APPLYING ADDITIONAL COMPONENTS TO A CIRCUIT BOARD
SU563240A1 (en) Appliance for supersonic soldering and
SU1687390A1 (en) Method for dismantling radio components glued to printed circuit board
JPS55166996A (en) Method of soldering flexible printed circuit board
JPS57165169A (en) Soldering method for electrical parts
JPH0432785Y2 (en)
JPS5685895A (en) Printed board mounting chip part and method of soldering chip part
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board
JPS5712597A (en) Method of soldering circuit board
JPS5668579A (en) Connecting method by melting solder

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951125