JPS52152847A - Steam bonding method - Google Patents

Steam bonding method

Info

Publication number
JPS52152847A
JPS52152847A JP5450377A JP5450377A JPS52152847A JP S52152847 A JPS52152847 A JP S52152847A JP 5450377 A JP5450377 A JP 5450377A JP 5450377 A JP5450377 A JP 5450377A JP S52152847 A JPS52152847 A JP S52152847A
Authority
JP
Japan
Prior art keywords
bonding method
steam bonding
steam
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5450377A
Other languages
English (en)
Other versions
JPS5628623B2 (ja
Inventor
Roman Sukaabinko Yuujin
Deiitorefu Fuon Fuoosu Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS52152847A publication Critical patent/JPS52152847A/ja
Publication of JPS5628623B2 publication Critical patent/JPS5628623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5450377A 1976-06-14 1977-05-13 Steam bonding method Granted JPS52152847A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/695,482 US4022371A (en) 1976-06-14 1976-06-14 Vapor bonding method

Publications (2)

Publication Number Publication Date
JPS52152847A true JPS52152847A (en) 1977-12-19
JPS5628623B2 JPS5628623B2 (ja) 1981-07-03

Family

ID=24793168

Family Applications (2)

Application Number Title Priority Date Filing Date
JP5450377A Granted JPS52152847A (en) 1976-06-14 1977-05-13 Steam bonding method
JP9336780A Granted JPS5623369A (en) 1976-06-14 1980-07-10 Vapor bonding method

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP9336780A Granted JPS5623369A (en) 1976-06-14 1980-07-10 Vapor bonding method

Country Status (5)

Country Link
US (1) US4022371A (ja)
JP (2) JPS52152847A (ja)
CA (1) CA1073275A (ja)
DE (1) DE2725800A1 (ja)
FR (1) FR2355430A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111841A (ja) * 1983-10-11 1985-06-18 ピエゾ−セラム・エレクトロニク 蒸気の凝縮により物品または製品を加熱する装置
JPS62501546A (ja) * 1984-12-27 1987-06-25 ヒュ−ズ・エアクラフト・カンパニ− 半田付け装置およびその方法
JPH01166881A (ja) * 1987-12-24 1989-06-30 Fujitsu Ltd はんだリフロー方法及びリフロー装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4194297A (en) * 1977-12-27 1980-03-25 Western Electric Company, Incorporated Method and apparatus for generating a controllably exposed vapor body for heating articles
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
US4238186A (en) * 1978-12-04 1980-12-09 Western Electric Company, Inc. Methods and apparatus for heating articles selectively exposed to a generated vapor through a volume controllable vapor barrier
US4334646A (en) * 1980-04-17 1982-06-15 Harris Corporation Method of solder reflow assembly
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing
GB8312503D0 (en) * 1983-05-06 1983-06-08 Isc Chemicals Ltd Vapour phase soldering
CN1004680B (zh) * 1985-09-17 1989-07-05 近藤权士 物品的钎焊装置
US4840305A (en) * 1987-03-30 1989-06-20 Westinghouse Electric Corp. Method for vapor phase soldering
DE3814870C1 (ja) * 1988-05-02 1989-11-16 Helmut Walter 8900 Augsburg De Leicht
DE3840098C1 (ja) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
US5046658A (en) * 1989-07-27 1991-09-10 At&T Bell Laboratories Method and apparatus for soldering articles
US5030805A (en) * 1990-02-20 1991-07-09 Minnesota Mining And Manufacturing Company Condensation heating apparatus
US5188282A (en) * 1991-01-28 1993-02-23 Hughes Aircraft Company Vapor phase flash fusing of printed wiring boards
DE4103098C1 (ja) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
DE19504350C2 (de) * 1995-02-10 1997-04-10 Fraunhofer Ges Forschung Verfahren zum Herstellen eines Kontakthöckers durch Umschmelzen einer Kontaktflächenmetallisierung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
US3734791A (en) * 1970-10-23 1973-05-22 Ibm Surfactant-containing soldering fluxes
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111841A (ja) * 1983-10-11 1985-06-18 ピエゾ−セラム・エレクトロニク 蒸気の凝縮により物品または製品を加熱する装置
JPH029534B2 (ja) * 1983-10-11 1990-03-02 Piezo Seramu Erekutoroniku
JPS62501546A (ja) * 1984-12-27 1987-06-25 ヒュ−ズ・エアクラフト・カンパニ− 半田付け装置およびその方法
JPH0240425B2 (ja) * 1984-12-27 1990-09-11 Hughes Aircraft Co
JPH01166881A (ja) * 1987-12-24 1989-06-30 Fujitsu Ltd はんだリフロー方法及びリフロー装置

Also Published As

Publication number Publication date
JPS5623369A (en) 1981-03-05
US4022371A (en) 1977-05-10
DE2725800A1 (de) 1977-12-22
FR2355430A1 (fr) 1978-01-13
FR2355430B1 (ja) 1979-03-09
CA1073275A (en) 1980-03-11
JPS5628623B2 (ja) 1981-07-03
JPS5628624B2 (ja) 1981-07-03

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