JPS5295061A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPS5295061A JPS5295061A JP1199576A JP1199576A JPS5295061A JP S5295061 A JPS5295061 A JP S5295061A JP 1199576 A JP1199576 A JP 1199576A JP 1199576 A JP1199576 A JP 1199576A JP S5295061 A JPS5295061 A JP S5295061A
- Authority
- JP
- Japan
- Prior art keywords
- bonding method
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1199576A JPS5295061A (en) | 1976-02-05 | 1976-02-05 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1199576A JPS5295061A (en) | 1976-02-05 | 1976-02-05 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5295061A true JPS5295061A (en) | 1977-08-10 |
Family
ID=11793154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1199576A Pending JPS5295061A (en) | 1976-02-05 | 1976-02-05 | Bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5295061A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
JPS59151492A (en) * | 1983-02-17 | 1984-08-29 | 日本電信電話株式会社 | Method an ddevice for soldering electronic part |
US10677276B2 (en) | 2015-06-08 | 2020-06-09 | Japan Display Inc. | Fixing structure and fixing method |
-
1976
- 1976-02-05 JP JP1199576A patent/JPS5295061A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
JPS59151492A (en) * | 1983-02-17 | 1984-08-29 | 日本電信電話株式会社 | Method an ddevice for soldering electronic part |
US10677276B2 (en) | 2015-06-08 | 2020-06-09 | Japan Display Inc. | Fixing structure and fixing method |
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