JPS5295061A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5295061A
JPS5295061A JP1199576A JP1199576A JPS5295061A JP S5295061 A JPS5295061 A JP S5295061A JP 1199576 A JP1199576 A JP 1199576A JP 1199576 A JP1199576 A JP 1199576A JP S5295061 A JPS5295061 A JP S5295061A
Authority
JP
Japan
Prior art keywords
bonding method
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1199576A
Other languages
Japanese (ja)
Inventor
Masaru Kawazumi
Michinori Shiina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP1199576A priority Critical patent/JPS5295061A/en
Publication of JPS5295061A publication Critical patent/JPS5295061A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1199576A 1976-02-05 1976-02-05 Bonding method Pending JPS5295061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1199576A JPS5295061A (en) 1976-02-05 1976-02-05 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1199576A JPS5295061A (en) 1976-02-05 1976-02-05 Bonding method

Publications (1)

Publication Number Publication Date
JPS5295061A true JPS5295061A (en) 1977-08-10

Family

ID=11793154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1199576A Pending JPS5295061A (en) 1976-02-05 1976-02-05 Bonding method

Country Status (1)

Country Link
JP (1) JPS5295061A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor
JPS59151492A (en) * 1983-02-17 1984-08-29 日本電信電話株式会社 Method an ddevice for soldering electronic part
US10677276B2 (en) 2015-06-08 2020-06-09 Japan Display Inc. Fixing structure and fixing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor
JPS59151492A (en) * 1983-02-17 1984-08-29 日本電信電話株式会社 Method an ddevice for soldering electronic part
US10677276B2 (en) 2015-06-08 2020-06-09 Japan Display Inc. Fixing structure and fixing method

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